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bondpad Datasheet PDF File

For bondpad Found Datasheets File :: 124 Search Time::0.953ms
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				Vishay Siliconix
Part No.	T8914VA-SF-F
OCR Text	...ie height h 0.17 mm diameter of bondpad d 0.12 mm additional information (1) frontside metallization, anode aluminum backside metallizati on, cathode gold alloy dicing sawing die bonding technology epoxy bonding document number: 91 00...
Description	Specification of GaAlAs IR Emitting Diode Chip
File Size	95.66K / 4 Page	View it Online	Download Datasheet

				Vishay Siliconix
Part No.	TB9414VA-SF-F
OCR Text	...ie height h 0.19 mm diameter of bondpad d 0.11 mm additional information (1) frontside metallization, anode aluminum backside metallization, cathode gold alloy dicing sawing die bonding technology epoxy bonding document number: 91 000...
Description	Specification of GaAlAs IR Emitting Diode Chip
File Size	80.43K / 4 Page	View it Online	Download Datasheet

				BeRex Corporation
Part No.	BCG13D
OCR Text	... 1) die thickness 100um 2) bondpad metal thickness 2.8um 3) backside metal au, 5um 4) device is grounded through via holes esd rating esd rating: value: test: standard: class 1c passes <2000v human ...
Description	5-4000 MHz Cascadeable InGaP HBT Gain Block
File Size	275.62K / 6 Page	View it Online	Download Datasheet

				Vishay Siliconix
Part No.	T163VU-SF-F
OCR Text	...e height h 0.265 mm diameter of bondpad d 0.14 mm additional information (1) frontside metallization, anode aluminum backside metallizati on, cathode gold alloy dicing sawing die bonding technology epoxy bonding document number: 91 00...
Description	Infrared Emitting Diode Chip, 950 nm, GaAs
File Size	82.07K / 4 Page	View it Online	Download Datasheet

				http:// Vishay Siliconix
Part No.	T8514VB-SF-F
OCR Text	...ie height h 0.17 mm diameter of bondpad d 0.14 mm additional information (1) frontside metallization, anode aluminum backside metallizati on, cathode gold alloy dicing sawing die bonding technology epoxy bonding document number: 91 00...
Description	Specification of GaAlAs IR Emitting Diode Chip
File Size	88.17K / 4 Page	View it Online	Download Datasheet

				Maxim Integrated Products
Part No.	MAX1818EUAT
OCR Text	....8 microns (as drawn) g. bondpad dimensions: 2.7 mil. sq. h . isolation dielectric: sio 2 i. die separation method: wafer saw v. quality assurance information a. quality assurance co...
Description	PLASTIC ENCAPSULATED DEVICES
File Size	92.20K / 8 Page	View it Online	Download Datasheet

				BeRex Corporation
Part No.	BCIF7
OCR Text	... 1) die thickness 100um 2) bondpad metal thickness 2.8um 3) backside metal au, 5um 4) device is grounded through via holes berex ...
Description	50-800 MHz Internally Matched IF Amplifier
File Size	353.85K / 7 Page	View it Online	Download Datasheet

				BeRex Corporation
Part No.	BCT05CV
OCR Text	... 1) die thickness 100um 2) bondpad metal thickness 2.8um 3) backside metal au, 5um 4) device is grounded through via holes berex ...
Description	5-4000 MHz Wideband Drive Amplifier
File Size	292.51K / 8 Page	View it Online	Download Datasheet

				Vishay Siliconix
Part No.	TS8520VA TS8520VA-SF-F
OCR Text	...ie height h 0.17 mm diameter of bondpad d 0.107 mm additional information frontside metallization, anode gold alloy backside metallization, cathode gold alloy dicing sawing die bonding technology epoxy bonding ts8520va www.vishay.com v...
Description	Specification of High Power IR Emitting Diode Chip
File Size	90.51K / 4 Page	View it Online	Download Datasheet

				Vishay Siliconix
Part No.	TS8542VA TS8542VA-SF-F
OCR Text	...ie height h 0.17 mm diameter of bondpad d 0.127 mm additional information frontside metallization, anode gold alloy backside metallization, cathode gold alloy dicing sawing die bonding technology epoxy bonding ts8542va www.vishay.com v...
Description	Specification of High Power IR Emitting Diode Chip
File Size	96.75K / 4 Page	View it Online	Download Datasheet

For bondpad Found Datasheets File :: 124 Search Time::0.953ms
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