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Rochester Electronics LLC |
| Part No. |
100331/VYA
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| Description |
100331 - 100K Series, Low Power Triple D-Type Flip-Flop - Dual marked (5962-9153601VYA) - SPACE-LEVEL LOGIC
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Official Product Page
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Molex Electronics Ltd.
http://
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| Part No. |
0757576181 75757-6181
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| Description |
3.50mm (.138) Pitch, MX150?/a> Header, Breakaway, Vertical, 16 Circuits, 2.5μm(100μ) Tin (Sn) Plating, 27.77mm (1.093) Mating Pin Length, 3.05mm (.120) PC Tail
3.50mm (.138) Pitch, MX150 Header, Breakaway, Vertical, 16 Circuits, 2.5μm(100μ) Tin (Sn) Plating, 27.77mm (1.093) Mating Pin Length, 3.05mm (.120) PC Tail
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| File Size |
166.21K /
4 Page |
 View
it Online |
Download Datasheet
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Amphenol Communications Solutions |
| Part No. |
68033-122HLF
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| Description |
BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 22 Positions, 2.54 mm Pitch, Vertical, 3.42 mm (0.135in) Mating, 12.01 mm (0.473in) Tail.
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
0757576281 75757-6281
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| Description |
3.50mm (.138) Pitch, MX150 Header, Breakaway, Vertical, 16 Circuits, 1.25渭m (50渭) Nickel (Ni) Overall, 2.50渭m (100渭) Minimum Select Matte Tin (Sn) Plating on Ta
3.50mm (.138) Pitch, MX150 Header, Breakaway, Vertical, 16 Circuits, 1.25μm (50μ) Nickel (Ni) Overall, 2.50μm (100μ) Minimum Select Matte Tin (Sn) Plating on Tail
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| File Size |
166.28K /
4 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
68033-121HLF
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| Description |
BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 21 Positions, 2.54 mm Pitch, Vertical, 3.42 mm (0.135in) Mating, 12.01 mm (0.473in) Tail.
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
10106813-033112LF
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| Description |
0.5 mm Pitch Hermaphroditic Mezzanine Connector, 30 positions, Standard length with pegs and hold-downs, Half of mated height equals 3 mm
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
75757-0341 0757570341
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| Description |
3.50mm (.138) Pitch, MX150?/a> Header, Breakaway, Vertical, 4 Circuits, 1.25μm (50μ) Nickel (Ni) Overall, 2.50μm (100μ) Minimum Select Matte Tin (Sn) Plating on Tail
3.50mm (.138) Pitch, MX150 Header, Breakaway, Vertical, 4 Circuits, 1.25μm (50μ) Nickel (Ni) Overall, 2.50μm (100μ) Minimum Select Matte Tin (Sn) Plating on Tail
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| File Size |
99.21K /
3 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
74033-103LF
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| Description |
74033-103LF-BLACK 30AU LF
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
UE86L462700331
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| Description |
ExpressPort SFP+, High Speed Input Output Connectors, 2X4SFP EXP PRT LRGR LP DIA.
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
10137867-0331LF
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| Description |
Minitek® Pwr 3.0, Single Row, Right Angle SMT Tails and DIP Board Lock Header, 15u\\ Gold (Tin on Tails) plating, Black Color, 3 Positions, GW Compatible LCP, Tray packing.
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
68033-107HLF
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| Description |
BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 7 Positions, 2.54 mm Pitch, Vertical, 3.42 mm (0.135in) Mating, 12.01 mm (0.473in) Tail.
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
10136647-033112LF
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| Description |
Minitek® Pwr 4.2, Single Row, Vertical Through Hole Header, Nylon 66, 15u\\ Gold (Tin on Tails) plating, Natural Color, 3 Positions, GW Compatible, with out Posts, Tray packing.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
68033-116HLF
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| Description |
BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 16 Positions, 2.54 mm Pitch, Vertical, 3.42 mm (0.135in) Mating, 12.01 mm (0.473in) Tail.
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Official Product Page
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Bom2Buy.com
Price and Availability
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