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  5687-4CC Datasheet PDF File

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    SPT774 SPT774CCJ SPT774CCN SPT774CCS SPT774BCS SPT774BCJ SPT774BCN

SPT
Fairchild Semiconductor
ETC[ETC]
List of Unclassifed Manufacturers
Part No. SPT774 SPT774CCJ SPT774CCN SPT774CCS SPT774BCS SPT774BCJ SPT774BCN
Description FAST / COMPLETE 12-BIT UP COMPATIBLE A/D CONVERTER WITH SAMPLE/HOLD
FAST, COMPLETE 12-BIT UP COMPATIBLE A/D CONVERTER WITH SAMPLE/HOLD

File Size 113.61K  /  12 Page

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Amphenol Communications Solutions

Part No. 95687-144HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 44 Positions, 2.54 mm Pitch, Vertical, 9.14 mm (0.36in) Mating, 9.14 mm (0.36in) Tail.
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    SPT574BCJ SPT574BCN SPT574BCS SPT574CCJ SPT574CCN SPT574CCS

Cadeka Microcircuits LLC.
Part No. SPT574BCJ SPT574BCN SPT574BCS SPT574CCJ SPT574CCN SPT574CCS
Description FAST, COMPLETE 12-BIT mP COMPATIBLE A/D CONVERTER WITH SAMPLE/HOLD

File Size 182.14K  /  12 Page

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Amphenol Communications Solutions

Part No. 95687-436HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 36 Positions, 2.54 mm Pitch, Vertical, 9.14 mm (0.36in) Mating, 9.14 mm (0.36in) Tail.
Tech specs    

Official Product Page

    MAX1492 MAX1492CAI MAX1492CNI MAX1494 MAX1494CCJ

MAXIM - Dallas Semiconductor
MAXIM[Maxim Integrated Products]
Part No. MAX1492 MAX1492CAI MAX1492CNI MAX1494 MAX1494CCJ
Description 3.5- and 4.5-Digit, Single-Chip ADCs with LCD Drivers

File Size 743.39K  /  35 Page

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Amphenol Communications Solutions

Part No. 95687-114HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 14 Positions, 2.54 mm Pitch, Vertical, 9.14 mm (0.36in) Mating, 9.14 mm (0.36in) Tail.
Tech specs    

Official Product Page

    International Business Machines, Corp.
Part No. IBM13M64734CCA
Description 64M x 72 2-Bank Registered/Buffered SDRAM Module(64M x 72 2组寄缓冲同步动态RAM模块) 64米72 2,银行注缓冲内存模组4米72 2组寄缓冲同步动态内存模块)

File Size 173.07K  /  20 Page

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Amphenol Communications Solutions

Part No. 95687-136HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 36 Positions, 2.54 mm Pitch, Vertical, 9.14 mm (0.36in) Mating, 9.14 mm (0.36in) Tail.
Tech specs    

Official Product Page

   
Part No. AS44CC373CASEF
Description SPECIALTY CONSUMER CIRCUIT, PDSO16 ROHS COMPLIANT, SOIC-16

File Size 359.70K  /  2 Page

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Amphenol Communications Solutions

Part No. 95687-158HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 58 Positions, 2.54 mm Pitch, Vertical, 9.14 mm (0.36in) Mating, 9.14 mm (0.36in) Tail.
Tech specs    

Official Product Page

    IBM Microeletronics
Part No. IBM13M32734CCB IBM13M32734CCB-75AT
Description 32M x 72 1-Bank Registered / Buffered SDRAM Module(32M x 72 1组寄缓冲同步动态RAM模块)
x72 SDRAM Module

File Size 183.29K  /  20 Page

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Amphenol Communications Solutions

Part No. 95687-122HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 22 Positions, 2.54 mm Pitch, Vertical, 9.14 mm (0.36in) Mating, 9.14 mm (0.36in) Tail.
Tech specs    

Official Product Page

   
Part No. IBM13M64734CCA-75AY
Description 64M X 72 SYNCHRONOUS DRAM MODULE, 5.65 ns, DMA168

File Size 195.90K  /  20 Page

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Amphenol Communications Solutions

Part No. 95687-168HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 68 Positions, 2.54 mm Pitch, Vertical, 9.14 mm (0.36in) Mating, 9.14 mm (0.36in) Tail.
Tech specs    

Official Product Page

    IBM Microeletronics
Part No. IBM13M32734CCA-360T
Description x72 SDRAM Module
32M x 72 1 Bank Registered/Buffered SDRAM Module(32M x 72 1组寄缓冲同步动态RAM模块)

File Size 160.78K  /  20 Page

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Amphenol Communications Solutions

Part No. 95687-102HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 2 Positions, 2.54 mm Pitch, Vertical, 9.14 mm (0.36in) Mating, 9.14 mm (0.36in) Tail.
Tech specs    

Official Product Page

    B41859C5687M B41859C5187M B41859C5188M

TDK Electronics
Part No. B41859C5687M B41859C5187M B41859C5188M
Description Aluminum electrolytic capacitors

File Size 523.73K  /  28 Page

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Amphenol Communications Solutions

Part No. 95687-402HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 2 Positions, 2.54 mm Pitch, Vertical, 9.14 mm (0.36in) Mating, 9.14 mm (0.36in) Tail.
Tech specs    

Official Product Page

   
Part No. IBM13M64734CCA-260Y IBM13M64734CCA-360Y
Description x72 SDRAM Module
64M X 72 SYNCHRONOUS DRAM MODULE, 7.2 ns, DMA168

File Size 172.89K  /  20 Page

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Amphenol Communications Solutions

Part No. 95687-448HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 48 Positions, 2.54 mm Pitch, Vertical, 9.14 mm (0.36in) Mating, 9.14 mm (0.36in) Tail.
Tech specs    

Official Product Page

For 5687-4CC Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | <12> | 13 | 14 | 15 |   

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