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206K0 10HCB 2AM0405S 05D15 ZMM5230B MAX170 DM74L 05D15
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  1537-30K Datasheet PDF File

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    FX30KMJ-03

Mitsubishi Electric Sem...
MITSUBISHI[Mitsubishi Electric Semiconductor]
Part No. FX30KMJ-03
Description HIGH-SPEED SWITCHING USE

File Size 49.10K  /  4 Page

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Amphenol Communications Solutions

Part No. 51915-376LF
Description PwrBlade®, Power Connectors, 2DCP 40S Right Angle Receptacle, Solder To Board
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    Powerex Power Semicondu...
POWEREX[Powerex Power Semiconductors]
Mitsubishi Electric Corporation
Part No. FX30KMJ-2
Description MITSUBISHI Pch POWER MOSFET HIGH-SPEED SWITCHING USE

File Size 55.08K  /  4 Page

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Amphenol Communications Solutions

Part No. 51915-371LF
Description PwrBlade®, Power Connectors, 12S 3P Right Angle Receptacle, Solder To Board
Tech specs    

Official Product Page

    Mitsubishi Electric Corporation
POWEREX[Powerex Power Semiconductors]
Part No. FX30KMJ-06
Description MITSUBISHI Pch POWER MOSFET HIGH-SPEED SWITCHING USE

File Size 55.13K  /  4 Page

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Amphenol Communications Solutions

Part No. GSB3115373FHR
Description USB 3.2, Type A, Receptacle, Right Angle Stacked Sink, 9.91mm Height, 18 Pins, Shell with Nickel Plating, Shell Dip Pitch 15.6mm, 30u\\ Gold, Dip 3mm, Blue High Temperature Housing, Tray Packaging
Tech specs    

Official Product Page

    Mitsubishi Electric Corporation
POWEREX[Powerex Power Semiconductors]
Part No. FS30KMH-06
Description MITSUBISHI Nch POWER MOSFET HIGH-SPEED SWITCHING USE

File Size 46.02K  /  4 Page

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Amphenol Communications Solutions

Part No. GSB3115373RFHR
Description USB3.2, A, GEN1, RightAngle, STACK SINK, DIP, 30u\\ GOLD, BLUE, TL 3MM, H: 9.91mm
Tech specs    

Official Product Page

    Panasonic
Part No. AN3830K
Description VTR Reel Direct-Drive Motor Drive Circuit

File Size 422.72K  /  7 Page

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Amphenol Communications Solutions

Part No. GSB3115371RF1HR
Description USB 3.2, Type A, Receptacle, Right Angle Stacked Sink, 9.91mm Height, 18 Pins, Shell Without Flange(T/B), Shell with Nickel Plating, Shell Dip Pitch 15.6mm, 30u\\ Gold, Dip 2.4mm, Blue High Temperature Housing, Tape and Reel Packaging
Tech specs    

Official Product Page

    FS30KMJ-03

http://
MITSUBISHI[Mitsubishi Electric Semiconductor]
Part No. FS30KMJ-03
Description HIGH-SPEED SWITCHING USE

File Size 41.55K  /  4 Page

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    1608-330K 2012-221M 1608-082K

API DELEVAN
Part No. 1608-330K 2012-221M 1608-082K
Description 1 ELEMENT, 0.033 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD
1 ELEMENT, 0.22 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD
1 ELEMENT, 0.0082 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD

File Size 78.85K  /  1 Page

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    FS30KMJ-2

MITSUBISHI[Mitsubishi Electric Semiconductor]
Part No. FS30KMJ-2
Description HIGH-SPEED SWITCHING USE

File Size 41.59K  /  4 Page

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    FS30KMJ-3

MITSUBISHI[Mitsubishi Electric Semiconductor]
Part No. FS30KMJ-3
Description HIGH-SPEED SWITCHING USE

File Size 42.03K  /  4 Page

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    Mitsubishi Electric Corporation
POWEREX[Powerex Power Semiconductors]
Part No. FS30KMJ-2
Description MITSUBISHI Nch POWER MOSFET HIGH-SPEED SWITCHING USE

File Size 46.66K  /  4 Page

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