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  1140-4013 Datasheet PDF File

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    1140-4049 83009

Molex Electronics Ltd.
Part No. 1140-4049 83009
Description Conductor Punch

File Size 11.43K  /  1 Page

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Toshiba Electronic Devices & Storage Corporation

Part No. TC4013BP
Description CMOS Logic IC, D-Type Flip-Flop, DIP14
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    1140-4014 8302-4 0011-40-4014

Molex Electronics Ltd.
Part No. 1140-4014 8302-4 0011-40-4014
Description Conductor Punch

File Size 11.61K  /  1 Page

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Amphenol Communications Solutions

Part No. 1140084168
Description 1140084168-Micro SD Normal Open H=1.55 NONE PUSH
Tech specs    

Official Product Page

    Sumida, Corp.
Part No. NP111-11405-G4
Description PGA114, IC SOCKET

File Size 327.65K  /  3 Page

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Amphenol Communications Solutions

Part No. 77311-401-30LF
Description BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 30 Positions, 2.54 mm Pitch.
Tech specs    

Official Product Page

    1140-4008 0011-40-4008 8301-2

Molex Electronics Ltd.
Part No. 1140-4008 0011-40-4008 8301-2
Description Conductor Punch

File Size 14.48K  /  1 Page

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Amphenol Communications Solutions

Part No. 77311-401-31LF
Description BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 31 Positions, 2.54 mm Pitch.
Tech specs    

Official Product Page

    11-40-2014 1140-2014 0011-40-2014 001140-2014

Molex Electronics Ltd.
Part No. 11-40-2014 1140-2014 0011-40-2014 001140-2014
Description Terminator Die

File Size 19.42K  /  1 Page

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Amphenol Communications Solutions

Part No. 77311-401-35LF
Description BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 35 Positions, 2.54 mm Pitch.
Tech specs    

Official Product Page

    1140-4200 0011-40-4200 001140-4200

Molex Electronics Ltd.
Part No. 1140-4200 0011-40-4200 001140-4200
Description Conductor Punch

File Size 14.32K  /  1 Page

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Amphenol Communications Solutions

Part No. 77311-401-33LF
Description BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 33 Positions, 2.54 mm Pitch.
Tech specs    

Official Product Page

    11-40-4409 0011-40-4409 1140-4409 001140-4409

Molex Electronics Ltd.
Part No. 11-40-4409 0011-40-4409 1140-4409 001140-4409
Description Insulation Punch

File Size 14.44K  /  1 Page

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Amphenol Communications Solutions

Part No. 77311-401-34LF
Description BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 34 Positions, 2.54 mm Pitch.
Tech specs    

Official Product Page

    11-40-2015 1140-2015 0011-40-2015 001140-2015

Molex Electronics Ltd.
Part No. 11-40-2015 1140-2015 0011-40-2015 001140-2015
Description Terminator Die

File Size 19.96K  /  1 Page

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Amphenol Communications Solutions

Part No. 77311-401-36LF
Description BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 36 Positions, 2.54 mm Pitch.
Tech specs    

Official Product Page

    0011-40-2192 1140-2192 001140-2192

Molex Electronics Ltd.
Part No. 0011-40-2192 1140-2192 001140-2192
Description Terminator Die

File Size 19.91K  /  1 Page

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Amphenol Communications Solutions

Part No. 77311-401-32LF
Description BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 32 Positions, 2.54 mm Pitch.
Tech specs    

Official Product Page

    1140-4203 001140-4203 0011-40-4203

Molex Electronics Ltd.
Part No. 1140-4203 001140-4203 0011-40-4203
Description Conductor Punch

File Size 14.32K  /  1 Page

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Amphenol Communications Solutions

Part No. ME1014013401311
Description Mini Cool Edge 0.60mm,Storage and Server connector ,Gen Z,EDSFF,OCP 3.0,140 signal pins, SMT, OCP, Straddle mount, 1.93mmPCB,-0.3mm offset
Tech specs    

Official Product Page

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