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HIROSE[Hirose Electric]
Hirose Electric USA, INC.
HIROSE ELECTRIC Co., Ltd.
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| Part No. |
FH25-51S-0.3SH FH25-21S-0.3SH FH25-27S-0.3SH FH25-33S-0.3SH FH25-39S-0.3SH FH25-45S-0.3SH
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| OCR Text |
...cts Metal fittings
Material
LCP LCP Phosphor bronze Phosphor bronze
Finish
Color: Black Color: Dark brown Gold plated Tin plated(No-lead)
Remarks
UL94V-0 -----------------------------
sOrdering information
FH25 - 51S - 0.3... |
| Description |
0.3 mm Contact Pitch/ 0.9 mm above the board/ Flexible Printed Circuit ZIF Connectors.
MS3108A16-11S
0.3 mm Contact Pitch, 0.9 mm above the board, Flexible Printed Circuit ZIF Connectors. 联系间距0.3毫米0.9以上的电路板，柔性线路板中频连接毫米
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| File Size |
479.58K /
8 Page |
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it Online |
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Mitsubishi Electric, Corp.
MITSUBISHI[Mitsubishi Electric Semiconductor]
Mitsubishi Electric Corporation
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| Part No. |
FU-627SLD-F1M54
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| OCR Text |
...5) Rise and fall times
D Pfp lcp
Dlp D Pf tr,tf
Note 1. Pulse condition : Pulse width10ms,Duty ratio 1% Note 2. If : Forward current(LD) Note 3. Ib : Bias current(LD) Note 4. lcp=(Sai*li)/Sai Dlp=((Sai* (li-lc)2)/Sai)1/2 Where ai a... |
| Description |
1.55 um LD MODULE WITH SINGLEMODE FIBER PIGTAIL 1.55微米劳工处模块，单模光纤尾纤
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| File Size |
50.34K /
3 Page |
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it Online |
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MITSUMI[Mitsumi Electronics, Corp.]
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| Part No. |
G24-010-210-AGGE CIM-G24
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| OCR Text |
...pins) 3. Housing material (21 : LCP resin) 4. UL grade (0 : UL94-V0) 5. Contact plating (A : Gold) 6. Contact plating thickness (G : 0.3m) 7. Contact style (G : Angle) 8. Package (E : Taping)
SPECIFICATIONS
ELECTRICAL CHARACTERISTICS Ra... |
| Description |
Memory Stick?/a> Duo Connectors
Memory Stick Duo Connectors
Memory Stick⑩ Duo Connectors
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| File Size |
80.80K /
2 Page |
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it Online |
Download Datasheet |
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MITSUMI[Mitsumi Electronics, Corp.]
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| Part No. |
H33N-008-210-AGGE CIM-H33N
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| OCR Text |
...: 8pins) Housing material (21 : LCP resin) Housing UL grade (0 : UL94V-0) Contact plating (A : Gold) Contact plating thickness (G : 3m) Contact read style (G : Angle SMT) Package (E : Taping)
SPECIFICATIONS
ELECTRICAL CHARACTERISTICS Ra... |
| Description |
microSD card connectors
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| File Size |
106.41K /
2 Page |
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it Online |
Download Datasheet |
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MICROSEMI[Microsemi Corporation]
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| Part No. |
LX2206ILD LX2206
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| OCR Text |
...urrent Control Logic SD H/L HCP LCP Current Programming Battery GND STAT Full Power On DCOK
LX2206 DCOK
TMP BAT Battery Temperature Lockout Sensing
LX2206 LX2206
PACKAGE ORDER INFO
TA (C) -40 to 85
LD
Plastic MLPD 10-Pin
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| Description |
Dual Level Lithium Ion Battery Charger
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| File Size |
299.16K /
14 Page |
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it Online |
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MICROSEMI[Microsemi Corporation]
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| Part No. |
LX2207ILD LX2207
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| OCR Text |
...WWW .Microsemi .C OM
TMP HCP LCP H/L GND
THERMAL DATA
LD Package
(Top View)
LD
Plastic Micro Leadframe Package 12-Pin 49C/W
RoHS / Pb-free 100% matte Tin Lead Finish
THERMAL RESISTANCE-JUNCTION TO AMBIENT, JA
Juncti... |
| Description |
Three Level Lithium Ion Battery Charger
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| File Size |
387.80K /
14 Page |
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it Online |
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OKI[OKI electronic componets]
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| Part No. |
ML87V3104
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| OCR Text |
...VDDO" pins.
(NC) DISP DF FRP LCP VSS DDA3 DDA2 DDA1 DDA0 VDDO CPS CP (NC) VSS (NC) DDB3 DDB2 DDB1 DDB0 VDDO DDC3 DDC2 DDC1 DDC0
26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50
3/69
FEDL87V3104-03
OK... |
| Description |
From old datasheet system
LCD Display Controller with Embedded Display Memory
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| File Size |
427.39K /
69 Page |
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it Online |
Download Datasheet |
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Price and Availability
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