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CL766 KT3685A9 T3515 LVC157 364112 SD4840 18002 00M16
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  unsawn Datasheet PDF File

For unsawn Found Datasheets File :: 222    Search Time::1.89ms    
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    EMMICRO[EM Microelectronic - MARIN SA]
Part No. EMTG30
OCR Text ...ies Chip Forms 8" Wafer sawn or unsawn Back grinding and distressing options 180 microns max thickness Modules Typical Application: SIM card GSM Phase2 or Phase2+ 16KB Development tools fully integrated within Keil uVision2/3 DevKit emul...
Description 30KB Ultra Low Cost Flash Smart Card IC

File Size 66.13K  /  3 Page

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    EMMICRO[EM Microelectronic - MARIN SA]
Part No. EMTG56
OCR Text ...ies Chip Forms 8" Wafer sawn or unsawn Back grinding and distressing options 180 microns max thickness Modules Typical Application: SIM card GSM Phase2+ 32KB Development tools fully integrated within Keil uVision2/3 DevKit emulator, exam...
Description 56KB Ultra Low Cost Flash Smart Card IC

File Size 66.17K  /  3 Page

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    EMMICRO[EM Microelectronic - MARIN SA]
Part No. EMTG97-3G
OCR Text ...ble Chip Forms 8" Wafer sawn or unsawn Back grinding and distressing options 180 microns max thickness Modules Typical Application: SIM card GSM Phase2+ OTA WIB 32KB SIM card GSM Phase2+ OTA 64KB Development tools fully integrated within...
Description 97KB Ultra Low Cost Flash Smart Card IC

File Size 48.52K  /  4 Page

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    STMICROELECTRONICS[STMicroelectronics]
Part No. M14C64 M14C32
OCR Text ...e in wafer form (either sawn or unsawn) and in micromodule form (on film). The M14C64 is available in micro-module Wafer Figure 1. Logic Diagram VCC Table 1. Signal Names SDA Serial Data/Address Input/ Output Serial Clock Write C...
Description Memory Card IC 64/32 Kbit Serial I2C Bus EEPROM
Memory Card IC 64/32 Kbit Serial I?C Bus EEPROM

File Size 125.67K  /  14 Page

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    意法半导
STMICROELECTRONICS[STMicroelectronics]
ST Microelectronics
SGS Thomson Microelectronics
Part No. M35101-W4 M35101 M35101-C20 M35101-C30 M35101-S4
OCR Text ... Form W4 S4 C20 C30 180 m 15 m unsawn wafer 180 m 15 m sawn wafer Antenna on Super 35 mm tape Antenna on Super 35 mm tape Transfer Code Given by ST ORDERING INFORMATION Devices are shipped from the factory with the memory content se...
Description Contactless Memory Chip 13.56 MHz / 2048-bit High Endurance EEPROM
Contactless Memory Chip 13.56 MHz, 2048-bit High Endurance EEPROM

File Size 29.48K  /  2 Page

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    意法半导
STMICROELECTRONICS[STMicroelectronics]
ST Microelectronics
Part No. M35102-W4 M35102 M35102-C20 M35102-C30 M35102-S4
OCR Text ... Form W4 S4 C20 C30 180 m 15 m unsawn wafer 180 m 15 m sawn wafer Antenna on Super 35 mm tape Antenna on Super 35 mm tape Transfer Code Given by ST ORDERING INFORMATION Devices are shipped from the factory with the memory content se...
Description Contactless Memory Chip with 64-bit Unique Serial ID 13.56 MHz / 2048-bit High Endurance EEPROM
Contactless Memory Chip with 64-bit Unique Serial ID 13.56 MHz, 2048-bit High Endurance EEPROM

File Size 29.63K  /  2 Page

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    STMicro
Part No. ST16ST2G 5009
OCR Text ...ST2G can be delivered either in unsawn or sawn wafers, 180 or 275 micron thickness as well as in micromodule package. Figure 1. Block Diagram V GENERATION PP RAM 8 BIT 384 SYSTEM ROM 1.5 KBtyte ROM 15 KBytes CPU BYTES ...
Description Smartcard MCU With up to 16352 Bytes EEPROM & T2G Authentication Library
From old datasheet system

File Size 28.17K  /  2 Page

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    INFINEON[Infineon Technologies AG]
Part No. SLE66C24PEM5 SLE66C24PE SLE66C24PEC
OCR Text ... SLE 66C24PE C Die (sawn, unsawn) M5.1 1.8 V; 3.0 V; 5.0 V or 3.0 V; 5.0 V - 25C to + 70C or - 25C to + 85C SLE 66C24PE M5 For ordering information please refer to the databook and contact your sales representative. Pro...
Description Security & Chip Card ICs

File Size 59.62K  /  8 Page

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    INFINEON[Infineon Technologies AG]
Part No. SLE66C321PEM5 SLE66C321PE SLE66C321PEC
OCR Text ... SLE 66C321PE C Die (sawn, unsawn) M5.1 1.8 V; 3.0 V; 5.0 V or 3.0 V; 5.0 V - 25C to + 70C or - 25C to + 85C Up to 33 MHz or 1 MHz - 7.5 MHz SLE 66C321PE M5 For ordering information please refer to the databook and conta...
Description Security & Chip Card ICs

File Size 57.47K  /  8 Page

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    Atmel, Corp.
Atmel Corp.
ATMEL[ATMEL Corporation]
Part No. T2525N740 T2525N744 T2525 T2525N T2525N030 T2525N033 T2525N036 T2525N038 T2525N040 T2525N044 T2525N130 T2525N133 T2525N136 T2525N138 T2525N140 T2525N144 T2525N230 T2525N233 T2525N236 T2525N238 T2525N240 T2525N244 T2525N330 T2525N333 T2525N336 T2525N340 T2525N344 T2525N630 T2525N633 T2525N636 T2525N638 T2525N640 T2525N644 T2525N730 T2525N733 T2525N736 T2525N738 T2525N338 T2525N276-6AQ
OCR Text .................... .......DDW -> unsawn wafers in box .................... .......6AQ -> (only on request, TSSOP8 taped and reeled) Pad Layout Figure 11. Pad Layout 1 (DDW only) GND IN OUT T2525 VS FUSING Figure 12. Pad La...
Description    IR RECEIVER ASSP
SPECIALTY TELECOM CIRCUIT, PDSO8
IR RECEIVER ASSP 红外线接收器ASSP

File Size 182.88K  /  10 Page

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For unsawn Found Datasheets File :: 222    Search Time::1.89ms    
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