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EUDYNA[Eudyna Devices Inc]
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| Part No. |
F0100404B
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| OCR Text |
...re. The material of the pads is tiw/Pt/Au and the backside is metalized by Ti/Au.
Assembling Condition SEI recommends the assembling process as shown below and affirms sufficient wirepull and die-shear strength. The heating time of one ... |
| Description |
3.3V/5V 1.25 Gb/s Receiver Transimpedance Amplifier
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| File Size |
459.81K /
10 Page |
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it Online |
Download Datasheet
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EUDYNA[Eudyna Devices Inc]
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| Part No. |
F0100406B
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| OCR Text |
...are.The material of the pads is tiw/Pt/Au and the backside is metalized by Ti/Au.
F0100406B Assembling Condition
3.3V 1.25Gbit/s Transimpedance Amplifier
SEI recommends the assembling process as shown below and affirms sufficient w... |
| Description |
3.3V 1.25Gbit/s NRZ Receiver Transimpedance Amplifier
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| File Size |
95.21K /
10 Page |
View
it Online |
Download Datasheet |
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EUDYNA[Eudyna Devices Inc]
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| Part No. |
F0100504B
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| OCR Text |
...are.The material of the pads is tiw/Pt/Au and the backside is metalized by Ti/Au.
F0100504B Assembling Condition
3.3V/5V 2.5Gbps Transimpedance Amplifier
SEI recommends the assembling process as shown below and affirms sufficient w... |
| Description |
3.3V/5V 2.5Gb/s NRZ Receiver Transimpedance Amplifier
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| File Size |
182.36K /
13 Page |
View
it Online |
Download Datasheet |
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EUDYNA[Eudyna Devices Inc]
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| Part No. |
F0100505B
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| OCR Text |
...re. The material of the pads is tiw/Pt/Au and the backside is metalized by Ti/Au. Assembling Condition SEI recommends the assembling process as shown below and affirms sufficient wirepull and die-shear strength. The heating time of one min... |
| Description |
3.3 V /5V 2.5 Gb/s NRZ Receiver Transimpedance Amplifier
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| File Size |
560.54K /
12 Page |
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it Online |
Download Datasheet |
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EUDYNA[Eudyna Devices Inc]
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| Part No. |
F0100604B
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| OCR Text |
...square. The material of pads is tiw/Pt/Au and the backside is metalized by Ti/Au.
Assembling Condition SEI recommends the assembling process as shown below and affirms sufficient wirepull and die-shear strength. The heating time of one ... |
| Description |
10 Gb/s Receiver Transimpedance Amplifier
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| File Size |
1,026.01K /
9 Page |
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it Online |
Download Datasheet |
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EUDYNA[Eudyna Devices Inc]
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| Part No. |
F0100612B
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| OCR Text |
...are.The material of the pads is tiw/Pt/Au and the backside is metalized by Ti/Au.
Assembling Condition
SEI recommends the assembling process as shown below and affirms sufficient wire-pull and die-share strength. The heating time of one... |
| Description |
10Gb/s Receiver Transimpedance Amplifier
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| File Size |
170.22K /
7 Page |
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it Online |
Download Datasheet |
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EUDYNA[Eudyna Devices Inc]
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| Part No. |
F0100613B
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| OCR Text |
...are.The material of the pads is tiw/Pt/Au and the backside is metalized by Ti/Au.
Assembling Condition
SEI recommends the assembling process as shown below and affirms sufficient wire-pull and die-share strength. The heating time of one... |
| Description |
10Gb/s Receiver Transimpedance Amplifier
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| File Size |
203.17K /
7 Page |
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it Online |
Download Datasheet |
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EUDYNA[Eudyna Devices Inc]
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| Part No. |
F0321818B
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| OCR Text |
...re. The material of the pads is tiw/Pt/Au and the backside is metalized by Ti/Au.
Assembling Condition SEI recommends the assembling process as shown below and affirms sufficient wirepull and die-shear strength. The heating time of one ... |
| Description |
2 GHz Bandwidth Limiting Amplifier
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| File Size |
497.31K /
11 Page |
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it Online |
Download Datasheet |
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INTERSIL[Intersil Corporation]
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| Part No. |
HFA1103_04 HFA1103IB HFA110304
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| OCR Text |
...ATION: Type: Metal 1: AlCu (2%)/tiw Thickness: Metal1: 8kA 0.4kA Type: Metal 2: AlCu (2%) Thickness: 16kA 0.8kA SUBSTRATE POTENTIAL (POWERED UP): Floating (Recommend Connection to V-) PASSIVATION: Type: Nitride Thickness: 4kA 0.5kA TRANSIST... |
| Description |
200MHz, Video Op Amp with High Speed Sync Stripper
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| File Size |
138.18K /
7 Page |
View
it Online |
Download Datasheet |
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Price and Availability
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