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  TES2N-1223 Datasheet PDF File

For TES2N-1223 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | <11> | 12 | 13 | 14 | 15 |   

    SG12232S

ETC
Part No. SG12232S
Description LCD_Module

File Size 137.36K  /  2 Page

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Amphenol Communications Solutions

Part No. 75168-122-30LF
Description BergStik®, Board to Board connector, Unshrouded Right Angled header, Through Hole, Single Row, 30 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    SG12232N

ETC
Part No. SG12232N
Description LCD_Module

File Size 182.93K  /  2 Page

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Amphenol Communications Solutions

Part No. 77313-122-32LF
Description BergStik®, Board to Board connector, Unshrouded Header, 2.54 mm Pitch, Vertical, Double Row,Through Hole, 32 Positions
Tech specs    

Official Product Page

    SG12232Q

ETC
Part No. SG12232Q
Description LCD_Module

File Size 167.70K  /  2 Page

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Amphenol Communications Solutions

Part No. 77311-122-34LF
Description BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 34 Positions, 2.54 mm Pitch.
Tech specs    

Official Product Page

    Pilot
Part No. PL-G122324A
Description LCD PANEL

File Size 324.91K  /  1 Page

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Amphenol Communications Solutions

Part No. 10083987-41223TLF
Description PCI Express® GEN 3 Card Edge, Storage and Server Connector, Integrated Type, Vertical, Through Hole, x16, 164 Positions, 1.00mm (0.039in) Pitch
Tech specs    

Official Product Page

    Pilot
Part No. PL-G122323A
Description LCD PANEL

File Size 340.45K  /  1 Page

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Amphenol Communications Solutions

Part No. 10085429-41223TLF
Description PCI Express® GEN 3 Card Edge, Storage and Server Connector, Integrated R-Type, Vertical, Through Hole, x16, 164 Positions, 1.00mm (0.039in) Pitch
Tech specs    

Official Product Page

    Endicott Research Group
Part No. 8M122359
Description DC to AC Inverter

File Size 58.74K  /  2 Page

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Amphenol Communications Solutions

Part No. 75160-122-36LF
Description BergStik®, Board to Board connector, Unshrouded vertical header, through hole, single Row,36 position, 2.54mm pitch
Tech specs    

Official Product Page

    Laurel
Part No. LG122323-LY
Description LCD Module

File Size 60.89K  /  1 Page

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Amphenol Communications Solutions

Part No. RJE714881223
Description Modular Jacks, Input Output Connectors, 8P8C, With Shield, With LEDs.
Tech specs    

Official Product Page

    Bolymin
Part No. BG12232C
Description Display

File Size 133.04K  /  1 Page

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Amphenol Communications Solutions

Part No. 10131931-223ULF
Description Minitek®, Board to Board, Receptacle, Surface Mount, Single row, 23 Positions, 2mm (0.079inch), horizontal.
Tech specs    

Official Product Page

    Bolymin
Part No. BG12232A
Description Display

File Size 156.61K  /  1 Page

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Amphenol Communications Solutions

Part No. 77313-122-30LF
Description BergStik®, Board to Board connector, Unshrouded Header, 2.54 mm Pitch, Vertical, Double Row,Through Hole, 30 Positions
Tech specs    

Official Product Page

    SG12232B

ETC
Part No. SG12232B
Description LCD_Module

File Size 139.60K  /  2 Page

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Amphenol Communications Solutions

Part No. 77315-122-36LF
Description BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 36 Positions 2.54mm (0.100in) Pitch, Right Angle
Tech specs    

Official Product Page

For TES2N-1223 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | <11> | 12 | 13 | 14 | 15 |   

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