| |
|
 |
High Voltage Power Solutions, Inc.
|
| Part No. |
ACP2132L12 ACP2132L8 ACN2132L12 ACN2132L8
|
| OCR Text |
...nting: Cable-ties, glue, epoxy, rtv, or silicon. If glued, recommend glue be applied to two surfaces. Primary Wires: 22 AWG PVC, 600 V, UL Style 1015, 105C, 2 wire or 3 wire available High Voltage Wires: 22 AWG, 15 KVDC, UL Style 3239, 105C... |
| Description |
HIGH VOLTAGE POWER SUPPLIES
|
| File Size |
52.60K /
2 Page |
 View
it Online |
Download Datasheet
|
| |
|
|
FREESCALE[Freescale Semiconductor, Inc]
|
| Part No. |
MPX5999D
|
| OCR Text |
...ame Thermoplastic Case
P2
rtv Die Bond
Figure 3. Cross-Sectional Diagrams (not to scale)
+5 V
Vout Vs IPS 1.0 F 0.01 F GND
Output
470 pF
Figure 4. Recommended Power Supply Decoupling and Output Filtering (For additiona... |
| Description |
Integrated Silicon Pressure Sensor On-Chip Signal Conditioned, Temperature Compensated and Calibrated
|
| File Size |
158.56K /
8 Page |
View
it Online |
Download Datasheet |
| |
|
|
FREESCALE[Freescale Semiconductor, Inc]
|
| Part No. |
MPX5500DP MPX5500 MPX5500D
|
| OCR Text |
...
Lead Frame Epoxy Case
P2
rtv Die Bond
Figure 3. Cross-Sectional Diagrams (not to scale)
+5 V
Vout Vs IPS 1.0 F 0.01 F GND
Output
470 pF
Figure 4. Recommended Power Supply Decoupling and Output Filtering (For additiona... |
| Description |
Integrated Silicon Pressure Sensor On-Chip Signal Conditioned, Temperature Compensated and Calibrated
|
| File Size |
167.92K /
8 Page |
View
it Online |
Download Datasheet |
| |
|
|
FREESCALE[Freescale Semiconductor, Inc]
|
| Part No. |
MPX4200A
|
| OCR Text |
...e P2 Sealed Vacuum Reference
rtv Die Bond
Figure 2. Cross Sectional Diagram (not to scale)
5.0 4.5 4.0 Vout Vs IPS 1.0 F 0.01 F GND 470 pF Output Output (Volts) 3.5 3.0 2.5 2.0 1.5 1.0 0.5 0 MIN MAX Transfer Function: Vout = Vs* (0.0... |
| Description |
Integrated Silicon Pressure Sensor for Manifold Absolute Pressure Applications On-Chip Signal Conditioned, Temperature
|
| File Size |
154.87K /
6 Page |
View
it Online |
Download Datasheet |
| |
|
|
Motorola Mobility Holdings, Inc.
Motorola, Inc.
MOTOROLA[Motorola, Inc]
|
| Part No. |
MPX12GSX MPX12 MPX12D MPX12DP MPX12GP MPX12GS
|
| OCR Text |
... EEEEEEEEEEE EEEEEEEEEEE
P2
rtv DIE BOND
3
MPX12 SERIES
PRESSURE (P1)/VACUUM (P2) SIDE IDENTIFICATION TABLE
Motorola designates the two sides of the pressure sensor as the Pressure (P1) side and the Vacuum (P2) side. The Pressur... |
| Description |
0 to 10 kPa (0-1.45 psi) 35 mV FULL SCALE SPAN (TYPICAL) 00千帕-1.45 PSI）的35压全尺寸跨度（典型）
|
| File Size |
156.16K /
8 Page |
View
it Online |
Download Datasheet |
| |
|
|
FREESCALE[Freescale Semiconductor, Inc]
|
| Part No. |
MPX12GP MPX12 MPX12D MPX12DP
|
| OCR Text |
... Epoxy Case
Lead Frame P2
rtv Die Bond
Figure 4. Unibody Package -- Cross-Sectional Diagram (not to scale)
Figure 4 illustrates the differential or gauge configuration in the basic chip carrier (Case 344). A silicone gel isolate... |
| Description |
10 kPa Uncompensated Silicon Pressure Sensors
|
| File Size |
183.57K /
8 Page |
View
it Online |
Download Datasheet |
|
Price and Availability
|
