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  LR19-8000 Datasheet PDF File

For LR19-8000 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | <11> | 12 | 13 | 14 | 15 |   

    XV-8000LK

Epson ToYoCom
Part No. XV-8000LK
Description MINIATURE SIZE INCLINED GYRO SENSOR

File Size 365.71K  /  2 Page

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Amphenol Communications Solutions

Part No. 68000-401HLF
Description BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 1 Positions, 2.54 mm Pitch, Vertical, 5.84 mm (0.23 in.) Mating, 2.41 mm (0.095 in.) Tail
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    XV-8000CB

Epson ToYoCom
Part No. XV-8000CB
Description SENSOR ULTRA MINIATURE SIZE GYRO SENSOR

File Size 335.47K  /  2 Page

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Amphenol Communications Solutions

Part No. CE1208000110111
Description Cool Edge 0.80mm Hybrid Power and Signal Connectors, Storage and Server System, Through Hole/Surface mount, 2 power pins, 80 signal pins, Vertical
Tech specs    

Official Product Page

    980001

Infineon Technologies AG
Part No. 980001
Description REED RELAY 干簧继电

File Size 191.01K  /  2 Page

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Amphenol Communications Solutions

Part No. 68000-232HLF
Description BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 32 Positions, 2.54 mm Pitch, Vertical, 5.84 mm (0.23 in.) Mating, 2.41 mm (0.095 in.) Tail
Tech specs    

Official Product Page

    Pasternack Enterprises,...
Part No. PE8000-75
Description 75 OHM BNC MALE TO OHM BNC FEMALE DETECTOR, FREQUENCY RANGE:100 KHz=1,000 MHz

File Size 103.26K  /  1 Page

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Amphenol Communications Solutions

Part No. 68000-434HLF
Description BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 34 Positions, 2.54 mm Pitch, Vertical, 5.84 mm (0.23 in.) Mating, 2.41 mm (0.095 in.) Tail
Tech specs    

Official Product Page

    M80002-4

List of Unclassifed Manufacturers
ETC
Electronic Theatre Controls, Inc.
Part No. M80002-4
Description 4 STRINGS XMAS LIGHT CONTROL 4串圣诞装饰品灯光控制

File Size 103.50K  /  4 Page

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Amphenol Communications Solutions

Part No. 68000-119HLF
Description BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 19 Positions, 2.54 mm Pitch, Vertical, 5.84 mm (0.23 in.) Mating, 2.41 mm (0.095 in.) Tail
Tech specs    

Official Product Page

    304-11-114-41-780000

Mill-Max Mfg. Corp.
Part No. 304-11-114-41-780000
Description    Interconnect Socket Solderless Press-Fit Socket

File Size 128.37K  /  3 Page

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Amphenol Communications Solutions

Part No. 68000-403HLF
Description BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 3 Positions, 2.54 mm Pitch, Vertical, 5.84 mm (0.23 in.) Mating, 2.41 mm (0.095 in.) Tail
Tech specs    

Official Product Page

    162-10-656-00-180000

Mill-Max Mfg. Corp.
Part No. 162-10-656-00-180000
Description DIP Header Solder Tail Shrink DIP (.070 Spacing) Open Frame Through Hole

File Size 217.38K  /  2 Page

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Amphenol Communications Solutions

Part No. 68000-228HLF
Description BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 28 Positions, 2.54 mm Pitch, Vertical, 5.84 mm (0.23 in.) Mating, 2.41 mm (0.095 in.) Tail
Tech specs    

Official Product Page

    162-10-664-00-180000

Mill-Max Mfg. Corp.
Part No. 162-10-664-00-180000
Description DIP Header Solder Tail Shrink DIP (.070 Spacing) Open Frame Through Hole

File Size 217.39K  /  2 Page

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Amphenol Communications Solutions

Part No. 10035388-000LF
Description Power Card Edge, Power Connectors, 2 x 29P STB Right Angle.
Tech specs    

Official Product Page

    162-10-652-00-180000

Mill-Max Mfg. Corp.
Part No. 162-10-652-00-180000
Description DIP Header Solder Tail Shrink DIP (.070 Spacing) Open Frame Through Hole

File Size 217.38K  /  2 Page

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Amphenol Communications Solutions

Part No. 68000-123HLF
Description BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 23 Positions, 2.54 mm Pitch, Vertical, 5.84 mm (0.23 in.) Mating, 2.41 mm (0.095 in.) Tail
Tech specs    

Official Product Page

    162-10-430-00-180000

Mill-Max Mfg. Corp.
Part No. 162-10-430-00-180000
Description DIP Header Solder Tail Shrink DIP (.070 Spacing) Open Frame Through Hole

File Size 217.39K  /  2 Page

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Amphenol Communications Solutions

Part No. 68000-101HLF
Description BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 1 Positions, 2.54 mm Pitch, Vertical, 5.84 mm (0.23 in.) Mating, 2.41 mm (0.095 in.) Tail
Tech specs    

Official Product Page

For LR19-8000 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | <11> | 12 | 13 | 14 | 15 |   

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