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17820 KF465AS 10275 5Q128 PT66002L RC11A125 TP2424ND SR8021
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  IPT-2009 Datasheet PDF File

For IPT-2009 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | <11> | 12 | 13 | 14 | 15 |   

    NMA2009-A2S

Micronetics, Inc.
Part No. NMA2009-A2S
Description Legacy 500 Hz to 500 MHz

File Size 158.24K  /  2 Page

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Amphenol Communications Solutions

Part No. 67292-009
Description BergStik® 2.54mm, Board To Board, Vertical 2 Row Guide Pin Header 18 Positions 2.54mm Pitch 3.81um (150u\\.) Tin-Lead Mating plating.
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    555-2003F 555-2403 555-2001 555-2009 555-2007

Dialight Corporation
Part No. 555-2003F 555-2403 555-2001 555-2009 555-2007
Description 2mm LED CBI Circuit Board Indicator Single
   2mm LED CBI Circuit Board Indicator Single

File Size 40.36K  /  3 Page

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Amphenol Communications Solutions

Part No. 10121002-009LF
Description HPCE R/A Receptacle 16P12S
Tech specs    

Official Product Page

    NMA2009-A1D

Micronetics, Inc.
Part No. NMA2009-A1D
Description Legacy 500 Hz to 500 MHz

File Size 290.07K  /  2 Page

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Amphenol Communications Solutions

Part No. 61082-142009LF
Description BergStak® 0.80mm Pitch, Receptacle, Vertical, Double Row, 140 Positions.
Tech specs    

Official Product Page

    TE Connectivity, Ltd.
Part No. DS2009-50 DS2009-80 DS2009-65 DS2009R-120 DS2009R-35
Description x9 Asynchronous FIFO X9热卖异步FIFO

File Size 395.67K  /  14 Page

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Amphenol Communications Solutions

Part No. 59112-T40-20-090LF
Description Minitek® 2.00mm, Board To Board, Unshrouded Vertical Stacking Header, Through Hole, Double Row, 40 Positions.
Tech specs    

Official Product Page

    EM2009-E3GM EM2009-DSGM

MRV Communications, Inc.
Part No. EM2009-E3GM EM2009-DSGM
Description LambdaDriver E3/DS3 TDM Muxponder Module (EM2009-E3GM/DSGM)

File Size 697.00K  /  2 Page

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Amphenol Communications Solutions

Part No. 54242-103200950LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Surface Mount, Double Row, 20 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    IP SEMICONDUCTOR CO., L...
Part No. IPT1206-CEB IPT1206-SEB IPT1206-TEB
Description    High current density due to double mesa technology

File Size 201.22K  /  4 Page

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Amphenol Communications Solutions

Part No. 54242-807200950LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Surface Mount, Double Row, 20 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    IP SEMICONDUCTOR CO., L...
Part No. IPT1206-TEA IPT1206-CEA IPT1206-BEA IPT1206-SEA
Description    High current density due to double mesa technology

File Size 201.34K  /  4 Page

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Amphenol Communications Solutions

Part No. 54122-106200950LF
Description BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 20 position, 2.54mm (0.100in) pitch
Tech specs    

Official Product Page

    IPT1208-SEF IPT1208-TEF IPT1208-CEF IPT1208-BEF

IP SEMICONDUCTOR CO., LTD.
IP SEMICONDUCTOR CO., L...
Part No. IPT1208-SEF IPT1208-TEF IPT1208-CEF IPT1208-BEF
Description High current density due to double mesa technology
   High current density due to double mesa technology

File Size 208.32K  /  4 Page

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Amphenol Communications Solutions

Part No. 10142632-009LF
Description Minitek MicroSpace™ 1.80mm Crimp-to-Wire Connector Platform, Wire to Board Connector, Receptacle, 9 Position<br><br>(For product qualification latest status, please submit <a href=\\javascript:;\\ class=\\button product-enquiry\\ style=\\background: none;color: red;\\><span>Product Enquiry</span></a>)
Tech specs    

Official Product Page

    TS831 TS831-3I TS831-4I TS831-5I TS831-3IP TS831-4IP TS831-5IP TS831-5ID TS831-5IZ TS831-5IDT TS831-4ID TS831-4IZ TS831-

意法半导
STMicroelectronics
ST Microelectronics
Part No. TS831 TS831-3I TS831-4I TS831-5I TS831-3IP TS831-4IP TS831-5IP TS831-5ID TS831-5IZ TS831-5IDT TS831-4ID TS831-4IZ TS831-4IPT TS831-4IDT -TS831-3IZ
Description MICROPOWER VOLTAGE SUPERVISOR RESET ACTIVE LOW

File Size 89.81K  /  11 Page

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Amphenol Communications Solutions

Part No. 10119109-372009LF
Description BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Double Row, 72 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

    IP SEMICONDUCTOR CO., L...
Part No. IPT1206-BEF IPT1206-TEF IPT1206-CEF IPT1206-SEF
Description    High current density due to double mesa technology

File Size 210.58K  /  4 Page

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Amphenol Communications Solutions

Part No. 73932-2009LF
Description 5 Row Signal Header, Straight, Press-Fit, Wide body, 3 Mod
Tech specs    

Official Product Page

For IPT-2009 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | <11> | 12 | 13 | 14 | 15 |   

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