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Amphenol Communications Solutions |
| Part No. |
54101-T10-06LF
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| Description |
BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 6 Positions, 2.54 mm Pitch.
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| Tech specs |
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Official Product Page
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Littelfuse, Inc.
Maxim Integrated Products, Inc.
Honeywell International, Inc.
NIC Components, Corp.
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| Part No. |
5962-87530013A 5962-8753101UX 5962-8753103TX 5962-8753003LX 5962-8753004LX 5962-8753002LX 5962-8753001LX 5962-8753102ZX 5962-8753001KX 5962-8753101TX 5962-8753002KA 5962-8753102UX 5962-8753101ZX
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| Description |
TFT LCD DC-DC Converter with Integrated Charge Pumps
28V Linear Li Battery Charger with Smart Autoboot Assistant
High-Speed, Step-Down Controller with Accurate Current Limit for Notebook Computers
Evaluation Kit for the MAX8760
Low-Cost, SMBus, CCFL Backlight Controller
Low-Dropout, 300mA Linear Regulator in µMAX X9热卖异步FIFO
Evaluation Kit for the MAX8753 保险丝，可编程的PLD
Evaluation Kit for the MAX8808 X9热卖异步FIFO
Low-Power, Low-Drift, 2.5V/ 5V/ 10V Precision Voltage Reference 保险丝，可编程的PLD
x9 Asynchronous FIFO X9热卖异步FIFO
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| File Size |
503.22K /
17 Page |
 View
it Online |
Download Datasheet
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Amphenol Communications Solutions |
| Part No. |
54101-T30-08
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| Description |
BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 8 Positions, 2.54 mm Pitch.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
55101-T1109LF
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| Description |
BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 9 Positions, 2.54 mm Pitch, Right Angle
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
10018783-00101TLF
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| Description |
PCI Express® GEN 3 Card Edge, Storage and Server Connector, Vertical, Through Hole, x4, 64 Positions, 1.00mm (0.039in) Pitch
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| Tech specs |
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Official Product Page
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STMicroelectronics
ST Microelectronics
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| Part No. |
STM32F101T6U6A VFQFPN36 LQFP48 LQFP64 STM32F101C6T6A STM32F101T4U6A STM32F101C4T6A
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| Description |
Mainstream Access line, ARM Cortex-M3 MCU with 16 Kbytes Flash, 36 MHz CPU
Low-density access line, ARM-based 32-bit MCU with 16 or 32 KB Flash, 5 timers, ADC and 4 communication interfaces
Mainstream Access line, ARM Cortex-M3 MCU with 32 Kbytes Flash, 36 MHz CPU
Low-density access line, ARM-based 32-bit MCU with 16 or 32 KB Flash, 5 timers, ADC and 4 communication interfaces
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| File Size |
990.29K /
79 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
54101-T30-00
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| Description |
BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 0 Positions, 2.54 mm Pitch.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
54101-T06-00
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| Description |
BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 0 Positions, 2.54 mm Pitch.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
55101-T1108LF
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| Description |
BergStik®, Board to Board connector, Unshrouded Right Angled Header, Through Hole, Single Row, 8 Positions, 2.54 mm (0.100in)Pitch.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
10069690-10101TLF
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| Description |
PCI Express® GEN 3 Card Edge, Storage and Server Connector, Straddle Mount, x4, 64 Positions, 1.00mm (0.039in) Pitch
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
54101-T06-07LF
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| Description |
BergStik<sup>®<sup>, Board to Board connector, 2.54mm (0.100in), Unshrouded vertical Header, Through Hole, Single Row, 7 Positions
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| Tech specs |
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Official Product Page
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AEROFLEX[Aeroflex Circuit Technology]
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| Part No. |
5962-0151101TXC 5962-0151101QXC 5962-0151101 UT9Q512K32-SWC 9Q512K32 UT9Q512K32 UT9Q512K32-SPC 5962D0151101QXC 5962D0151101TXC 5962L0151101TXC 5962L0151101QXC 5962P0151101QXC 5962P0151101TXC
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| Description |
512K32 16Megabit SRAM MCM: SDM. 25ns access time, 5.0V operation. Lead finish gold. QML class T. Total dose 3E4(30krad(Si)).
512K32 16Megabit SRAM MCM: SDM. 25ns access time, 5.0V operation. Lead finish gold. QML class Q. Total dose 3E4(30krad(Si)).
512K32 16Megabit SRAM MCM: SDM. 25ns access time, 5.0V operation. Lead finish gold. QML class T. Total dose 5E4(50krad(Si)).
512K32 16Megabit SRAM MCM: SDM. 25ns access time, 5.0V operation. Lead finish gold. QML class Q. Total dose 1E4(10krad(Si)).
UT9Q512K32 16Megabit SRAM MCM
UT9Q512K32 16Megabit SRAM MCM
512K32 16Megabit SRAM MCM: SDM. 25ns access time, 5.0V operation. Lead finish gold. QML class Q. Total dose none
512K32 16Megabit SRAM MCM: SDM. 25ns access time, 5.0V operation. Lead finish gold. QML class T. Total dose none
512K32 16Megabit SRAM MCM: SDM. 25ns access time, 5.0V operation. Lead finish gold. QML class T. Total dose 1E4(10krad(Si)).
512K32 16Megabit SRAM MCM: SDM. 25ns access time, 5.0V operation. Lead finish gold. QML class Q. Total dose 5E4(50krad(Si)).
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| File Size |
135.00K /
14 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
54101-T1102LF
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| Description |
BERGSTIK 0.100,TH HEADER-TIN
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| Tech specs |
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Official Product Page
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Bom2Buy.com
Price and Availability
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JITONG
TECHNOLOGY
(CHINA HK & SZ)
Datasheet.hk's Sponsor |
| Part: ICS8432DYI-101LF |
| Maker: IDT, Integrated Device Technology Inc |
| Pack: ETC |
| Stock: Reserved |
| Unit price
for : |
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50: $0.00 |
|
100: $0.00 |
| 1000:
$0.00 |
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