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Noritake Co., Inc.
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| Part No. |
PUMA68F4006X-12 PUMA68F4006X-90
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| OCR Text |
...-5% for high temperature device containers or b : 192 hours at 40 o c +5 o c/-0 o c and <5% rh for low temperature device containers . packaging standard devices packaged in dry nitrogen, jed-std-020. packaged in trays as standard. tape and... |
| Description |
6K GATE, 2NS, 132 BQFP, COM TEMP(FPGA)
6K GATE, 4NS, 84 PLCC, COM TEMP(FPGA) EEPROM
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| File Size |
120.64K /
5 Page |
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it Online |
Download Datasheet
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Noritake Co., Inc.
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| Part No. |
PUMA68F16006X-12 PUMA68F16006X-90
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| OCR Text |
...-5% for high temperature device containers or b : 192 hours at 40 o c +5 o c/-0 o c and <5% rh for low temperature device containers . packaging standard devices packaged in dry nitrogen, jed-std-020. packaged in trays as standard. tape and... |
| Description |
45NS, VSOP, IND TEMP(FLASH)
45NS, PLCC, IND TEMP(FLASH) EEPROM
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| File Size |
125.76K /
5 Page |
View
it Online |
Download Datasheet |
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NTE Electronics, Inc.
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| Part No. |
NTE424
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| OCR Text |
...water spray may be used to cool containers. do not allow, contaminated water to enter sewers or waterways. fire fighting instructions: in case of fire, use normal fire fighting equipment including a niosh approved self-contained breath... |
| Description |
Non-Silicone Heat Sink Compound
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| File Size |
28.53K /
5 Page |
View
it Online |
Download Datasheet |
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Price and Availability
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