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Microchip
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| Part No. |
24C02SC 24C01SC/WF 24C02SC/W08
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| OCR Text |
...lectrically Erasable PROMs with bondpad positions optimized for smart card applications. The devices are organized as a single block of 128 x 8-bit or 256 x 8-bit memory with a two-wire serial interface. The 24C01SC and 24C02SC also have pa... |
| Description |
串行EEPROM的| 256X8 |CMOS |晶圆
SERIAL EEPROM|128X8|CMOS|WAFER
The 24C02SC is a 2K bit Electrically Erasable PROM with bondpad positions optimized for smart card specific applications. The 24C02SC is organized as a single block of 256 x 8-bit memory with an I2C™ compatible 2-wire seria
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| File Size |
124.34K /
13 Page |
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it Online |
Download Datasheet
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Osram Opto Semiconductors
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| Part No. |
F1047A
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| OCR Text |
... bondpaddurchmesser diameter of bondpad d 130 m weitere informationen additional information 2) vorderseitenmetallisierung metallization frontside aluminium aluminum r ckseitenmetallisierung metallization backside goldlegierung au-alloy tr... |
| Description |
Infrared Emitting Diode Chip
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| File Size |
100.32K /
6 Page |
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it Online |
Download Datasheet |
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Microchip Technology Inc.
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| Part No. |
24C01SC-/W08
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| OCR Text |
...lectrically erasable proms with bondpad positions optimized for smart card applications. the devices are organized as a single block of 128 x 8-bit or 256 x 8-bit memory with a two-wire serial interface. the 24c01sc and 24c02sc also have pa... |
| Description |
1K/2K 5.0V I2C Serial EEPROMs for Smart Cards
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| File Size |
153.34K /
16 Page |
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it Online |
Download Datasheet |
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Microchip Technology, Inc.
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| Part No. |
24C01SCWF 24C01SCW08
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| OCR Text |
...lectrically erasable proms with bondpad positions optimized for smart card applications. the devices are organized as a sin- gle block of 128 x 8-bit or 256 x 8-bit memory with a two-wire serial interface. the 24c01sc and 24c02sc also have ... |
| Description |
I2C Serial EEPROM
SCSI Terminator I2C串行EEPROM
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| File Size |
159.98K /
12 Page |
View
it Online |
Download Datasheet |
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Price and Availability
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