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For backside Found Datasheets File :: 5950 Search Time::1.234ms
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				IXYS Corporation
Part No.	DSB60C45PB
OCR Text	...meets ul 94v-0 rohs compliant backside: cathode ixys reserves the right to change limits, conditions and dimensi ? 2006 ixys all rights reserved 0629 data according to iec 60747and per diode unless otherwise specified dsb 60 c 45pb adva...
Description	Schottky
File Size	88.64K / 2 Page	View it Online	Download Datasheet

				IXYS Corporation
Part No.	DSB60C45HB
OCR Text	...meets ul 94v-0 rohs compliant backside: cathode ixys reserves the right to change limits, conditions and dimensi ? 2006 ixys all rights reserved 0629 data according to iec 60747and per diode unless otherwise specified dsb 60 c 45hb adva...
Description	High Performance Schottky Diode Low Loss and Soft Recovery Common Cathode
File Size	88.23K / 2 Page	View it Online	Download Datasheet

				Hittite Microwave Corporation
Part No.	HMC-MDB207
OCR Text	...nals. All bond pads and the die backside are Ti/Au metallized and the Shottky devices are fully passivated for reliable operation. The HMC-MDB207 I/Q MMIC Mixer is compatible with conventional die attach methods, as well as thermocompressio...
Description	GaAs MMIC I/Q MIXER 55 - 64 GHz
File Size	237.64K / 8 Page	View it Online	Download Datasheet

				Hittite Microwave Corporation
Part No.	HMC-XDB112
OCR Text	...ency. All bond pads and the die backside are Ti/Au metallized and the HBT devices are fully passivated for reliable operation. The HMC-XDB112 Passive Doubler MMIC is compatible with conventional die attach methods, as well as thermocompress...
Description	GaAs MMIC PASSIVE FREQUENCY DOUBLER, 10 - 15 GHz INPUT
File Size	154.20K / 6 Page	View it Online	Download Datasheet

				Hittite Microwave Corporation
Part No.	HMC25607
OCR Text	...G CENTER TO CENTER IS .006". 4. backside METALLIZATION: GOLD. 5. BOND PAD METALLIZATION: GOLD. 6. backside METAL IS GROUND. 7. CONNECTION NOT REQUIRED FOR UNLABELED BOND PADS. Outline Drawing Die Packaging Information [1] Standard WP...
Description	GaAs MMIC I/Q MIXER 5.9 - 12 GHz
File Size	131.01K / 5 Page	View it Online	Download Datasheet

				MIMIX[Mimix Broadband]
Part No.	8OSC0464
OCR Text	... and provide a rugged part with backside via holes and gold metallization to allow either a conductive epoxy or eutectic solder die attach process. This device is well suited for Millimeter-wave Point-to-Point Radio, LMDS, SATCOM and VSAT a...
Description	7.4-8.6 GHz GaAs MMIC Voltage Controlled Oscillator
File Size	272.82K / 5 Page	View it Online	Download Datasheet

				MIMIX BROADBAND INC MIMIX[Mimix Broadband]
Part No.	44MPA0478
OCR Text	... and provide a rugged part with backside via holes and gold metallization to allow either a conductive epoxy or eutectic solder die attach process. This device is well suited for Millimeter-wave Point-to-Point Radio, LMDS, SATCOM and VSAT a...
Description	43.5-46.5 GHz GaAs MMIC Power Amplifier
File Size	432.82K / 5 Page	View it Online	Download Datasheet

				Mimix Broadband, Inc. MIMIX[Mimix Broadband]
Part No.	30SPA0536
OCR Text	... and provide a rugged part with backside via holes and gold metallization to allow either a conductive epoxy or eutectic solder die attach process. This device is well suited for Millimeter-wave Point-to-Point Radio, LMDS, SATCOM and VSAT a...
Description	27.0-33.0 GHz GaAs MMIC Power Amplifier 27000 MHz - 33000 MHz RF/MICROWAVE WIDE BAND HIGH POWER AMPLIFIER
File Size	292.42K / 5 Page	View it Online	Download Datasheet

				MIMIX[Mimix Broadband]
Part No.	30MPA0562
OCR Text	... and provide a rugged part with backside via holes and gold metallization to allow either a conductive epoxy or eutectic solder die attach process. This device is well suited for Millimeter-wave Pointto-Point Radio, LMDS, SATCOM and VSAT ap...
Description	28000 MHz - 31000 MHz RF/MICROWAVE WIDE BAND MEDIUM POWER AMPLIFIER 28.0-31.0 GHz GaAs MMIC Power Amplifier
File Size	255.50K / 5 Page	View it Online	Download Datasheet

For backside Found Datasheets File :: 5950 Search Time::1.234ms
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