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Molex Electronics Ltd.
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| Part No. |
0877580816 87758-0816
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| Description |
2.00mm (.079) Pitch Milli-Grid?/a> Header, Through Hole, Vertical, 8 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Pocket Tray Packaging, Lead-free 2.00mm (.079) Pitch Milli-Grid垄芒 Header, Through Hole, Vertical, 8 Circuits, 0.38楼矛m (15楼矛) Gold (Au) Selective Plating, Pocket Tray Packaging, Lead-free
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| File Size |
170.91K /
4 Page |
View
it Online |
Download Datasheet
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Texas Instruments |
| Part No. |
5962-87758012A
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| Description |
Octal Bus Transceivers With 3-State Outputs 20-LCCC -55 to 125
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
0877580817 87758-0817
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| Description |
2.00mm (.079) Pitch Milli-Grid?/a> Header, Through Hole, Vertical, 8 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, Pocket Tray Packaging, Lead-free 2.00mm (.079") Pitch Milli-Grid垄芒 Header, Through Hole, Vertical, 8 Circuits, 0.76楼矛m (30楼矛") Gold (Au) Selective Plating, Pocket Tray Packaging, Lead-free
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| File Size |
170.96K /
4 Page |
View
it Online |
Download Datasheet
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Texas Instruments |
| Part No. |
5962-8775801RA
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| Description |
Octal Bus Transceivers With 3-State Outputs 20-CDIP -55 to 125
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| Tech specs |
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Official Product Page
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Texas Instruments |
| Part No. |
5962-8775801VSA
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| Description |
Octal Bus Transceivers With 3-State Outputs 20-CFP -55 to 125
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
87758-4017 0877584017
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| Description |
2.00mm (.079) Pitch Milli-Grid?/a> Header, Through Hole, Vertical, 40 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, Pocket Tray Packaging, Lead-free 2.00mm (.079) Pitch Milli-Grid Header, Through Hole, Vertical, 40 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, Pocket Tray Packaging, Lead-free
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| File Size |
170.76K /
4 Page |
View
it Online |
Download Datasheet
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Texas Instruments |
| Part No. |
5962-8775801SA
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| Description |
Octal Bus Transceivers With 3-State Outputs 20-CFP -55 to 125
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
87758-5016 0877585016
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| Description |
2.00mm (.079) Pitch Milli-Grid?/a> Header, Through Hole, Vertical, 50 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Pocket Tray Packaging, Lead-free 2.00mm (.079) Pitch Milli-Grid?Header, Through Hole, Vertical, 50 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Pocket Tray Packaging, Lead-free
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| File Size |
170.71K /
4 Page |
View
it Online |
Download Datasheet
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Amphenol Communications Solutions |
| Part No. |
54112-109461700LF
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| Description |
BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 46 Positions, 2.54mm (0.100in) Pitch.
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
0877583650 87758-3650
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| Description |
2.00mm (.079) Pitch Milli-Grid?/a> Header, Through Hole, Vertical, 36 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Tray Packaging, Lead-free 2.00mm (.079) Pitch Milli-Grid Header, Through Hole, Vertical, 36 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Tray Packaging, Lead-free
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| File Size |
135.77K /
4 Page |
View
it Online |
Download Datasheet
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Amphenol Communications Solutions |
| Part No. |
10146173-120KLF
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| Description |
Minitek MicroSpace™ 1.80mm Crimp-to-Wire Connector Platform, Wire to Board Connector, Vertical, Header, Surface mount, 20 position
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
0877581250 87758-1250
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| Description |
2.00mm (.079) Pitch Milli-Grid?/a> Header, Through Hole, Vertical, 12 Circuits, 0.38μm(15μ) Gold (Au) Selective Plating, Tray Packaging, Lead-free 2.00mm (.079) Pitch Milli-Grid Header, Through Hole, Vertical, 12 Circuits, 0.38μm(15μ) Gold (Au) Selective Plating, Tray Packaging, Lead-free
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| File Size |
135.77K /
4 Page |
View
it Online |
Download Datasheet
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Amphenol Communications Solutions |
| Part No. |
10146173-216KLF
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| Description |
Minitek MicroSpace™ 1.80mm Crimp-to-Wire Connector Platform, Wire to Board Connector, Vertical, Header, Surface mount, 16 position
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
0877582250 87758-2250
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| Description |
2.00mm (.079) Pitch Milli-Grid?/a> Header, Through Hole, Vertical, 22 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Tray Packaging, Lead-free 2.00mm (.079) Pitch Milli-Grid Header, Through Hole, Vertical, 22 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Tray Packaging, Lead-free
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| File Size |
135.77K /
4 Page |
View
it Online |
Download Datasheet
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Amphenol Communications Solutions |
| Part No. |
10146173-312KLF
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| Description |
Minitek MicroSpace™ 1.80mm Crimp-to-Wire Connector Platform, Wire to Board Connector, Vertical, Header, Surface mount, 12 position
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
87758-4050 0877584050
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| Description |
2.00mm (.079) Pitch Milli-Grid?/a> Header, Through Hole, Vertical, 40 Circuits, 0.38μm(15μ) Gold (Au) Selective Plating, Tray Packaging, Lead-free 2.00mm (.079) Pitch Milli-Grid Header, Through Hole, Vertical, 40 Circuits, 0.38μm(15μ) Gold (Au) Selective Plating, Tray Packaging, Lead-free
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| File Size |
135.77K /
4 Page |
View
it Online |
Download Datasheet
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Amphenol Communications Solutions |
| Part No. |
10146175-104KLF
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| Description |
Minitek MicroSpace™ 1.80mm Crimp-to-Wire Connector Platform, Wire to Board Connector, Vertical, Header, Surface mount, 4 position
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
87758-4016 0877584016
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| Description |
2.00mm (.079) Pitch Milli-Grid?/a> Header, Through Hole, Vertical, 40 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Pocket Tray Packaging, Lead-free 2.00mm (.079) Pitch Milli-Grid Header, Through Hole, Vertical, 40 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Pocket Tray Packaging, Lead-free
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| File Size |
170.71K /
4 Page |
View
it Online |
Download Datasheet
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Amphenol Communications Solutions |
| Part No. |
10146175-124KLF
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| Description |
Minitek MicroSpace™ 1.80mm Crimp-to-Wire Connector Platform, Wire to Board Connector, Vertical, Header, Surface mount, 24 position
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| Tech specs |
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Official Product Page
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