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Toshiba Electronic Devices & Storage Corporation |
| Part No. |
TPD2017FN
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| Description |
Intelligent power device (Low side switch) / VDD=6 V / 8ch / SSOP30
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
54242-108201750LF
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| Description |
BergStik®, Board to Board connector, Unshrouded vertical stacked header, Surface Mount, Double Row, 20 Positions, 2.54mm (0.100in) Pitch.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
75844-201-72LF
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| Description |
BERGSTIK
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
54122-110201700LF
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| Description |
BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 20 position, 2.54mm (0.100in) pitch
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
59202-F40-20-174LF
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| Description |
Minitek® 2.00mm, Board To Board, Unshrouded Vertical Header, Surface Mount, Double Row, 40 Positions.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
59202-G40-20-174LF
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| Description |
Minitek® 2.00mm, Board To Board, Unshrouded Vertical Header, Surface Mount, Double Row, 40 Positions.
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
0877584616 87758-4616
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| Description |
2.00mm (.079) Pitch Milli-Grid Header, Through Hole, Vertical, 46 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Pocket Tray Packaging, Lead-free
2.00mm (.079) Pitch Milli-Grid?/a> Header, Through Hole, Vertical, 46 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Pocket Tray Packaging, Lead-free
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| File Size |
170.71K /
4 Page |
 View
it Online |
Download Datasheet
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Amphenol Communications Solutions |
| Part No. |
54112-109201700LF
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| Description |
BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 20 Positions, 2.54mm (0.100in) Pitch.
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
87758-5016 0877585016
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| Description |
2.00mm (.079) Pitch Milli-Grid?/a> Header, Through Hole, Vertical, 50 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Pocket Tray Packaging, Lead-free
2.00mm (.079) Pitch Milli-Grid?Header, Through Hole, Vertical, 50 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Pocket Tray Packaging, Lead-free
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| File Size |
170.71K /
4 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
67292-017
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| Description |
BergStik® 2.54mm, Board To Board, Vertical 2 Row Guide Pin Header 34 Positions 2.54mm Pitch 3.81um (150u\\.) Tin-Lead Mating plating.
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
87758-4017 0877584017
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| Description |
2.00mm (.079) Pitch Milli-Grid?/a> Header, Through Hole, Vertical, 40 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, Pocket Tray Packaging, Lead-free
2.00mm (.079) Pitch Milli-Grid Header, Through Hole, Vertical, 40 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, Pocket Tray Packaging, Lead-free
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| File Size |
170.76K /
4 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
72017-212LF
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| Description |
5 Row Signal Receptacle, 150 Position, Straight, Solder to Board
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
87758-3217 0877583217
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| Description |
2.00mm (.079) Pitch Milli-Grid?/a> Header, Through Hole, Vertical, 32 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, Pocket Tray Packaging, Lead-free
2.00mm (.079) Pitch Milli-Grid Header, Through Hole, Vertical, 32 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, Pocket Tray Packaging, Lead-free
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| File Size |
170.71K /
4 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
90312-017LF
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| Description |
Crimp-to-Wire Housing, Single Row, Pol. w/Latch, 17 Position
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| Tech specs |
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Official Product Page
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Bom2Buy.com
Price and Availability
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