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Molex Electronics Ltd.
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| Part No. |
0444320802 44432-0802
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| Description |
3.00mm (.118) Pitch Micro-Fit 3.0 BMI?/a> Header, Surface Mount Compatible, Dual Row, Vertical, with PCB Polarizing Peg, 8 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating
3.00mm (.118) Pitch Micro-Fit 3.0 BMI Header, Surface Mount Compatible, Dual Row, Vertical, with PCB Polarizing Peg, 8 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating
MOLEX Connector
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| File Size |
224.13K /
5 Page |
 View
it Online |
Download Datasheet
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Amphenol Communications Solutions |
| Part No. |
93944-430HLF
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| Description |
BergStik® 2.54mm, Board To Board Connector, Unshrouded Vertical Header, Through Hole, Single Row, 30 Positions, 2.54mm (0.100in) Pitch.
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
93944-436HLF
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| Description |
BergStik® 2.54mm, Board To Board Connector, Unshrouded Vertical Header, Through Hole, Single Row, 36 Positions, 2.54mm (0.100in) Pitch.
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
93944-433HLF
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| Description |
BergStik® 2.54mm, Board To Board Connector, Unshrouded Vertical Header, Through Hole, Single Row, 33 Positions, 2.54mm (0.100in) Pitch.
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
93944-435HLF
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| Description |
BergStik® 2.54mm, Board To Board Connector, Unshrouded Vertical Header, Through Hole, Single Row, 35 Positions, 2.54mm (0.100in) Pitch.
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
74443-125CALF
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| Description |
Assembly, Top Mount, S/D(68Pins), R/A, 5V, 10.3mm s/o, Left Push Rod Eject, 8mm Card Travel
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
74443-105CALF
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| Description |
Assembly, Top Mount, S/D(68Pins), R/A, 5V, 8.6mm s/o, Left Push Rod Eject, 8mm Card Travel
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
0444322001 44432-2001
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| Description |
3.00mm (.118) Pitch Micro-Fit 3.0 BMI?/a> Header, Surface Mount Compatible, Dual Row, Vertical, with PCB Polarizing Peg, 20 Circuits, Tin (Sn) Plating
3.00mm (.118) Pitch Micro-Fit 3.0 BMI Header, Surface Mount Compatible, Dual Row, Vertical, with PCB Polarizing Peg, 20 Circuits, Tin (Sn) Plating
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| File Size |
223.89K /
5 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
93944-434HLF
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| Description |
BergStik® 2.54mm, Board To Board Connector, Unshrouded Vertical Header, Through Hole, Single Row, 34 Positions, 2.54mm (0.100in) Pitch.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
74443-100CALF
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| Description |
Assembly, Top Mount, S/D(68Pins), R/A, 5V, 0mm s/o, Left Push Rod Eject, 8mm Card Travel
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
RJMG221044430ER
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| Description |
RJMG, Input output Connectors, 2x1,1G,with LEDs
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
44432-1201 0444321201
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| Description |
3.00mm (.118) Pitch Micro-Fit 3.0 BMI?/a> Header, Surface Mount Compatible, Dual Row, Vertical, with PCB Polarizing Peg, 12 Circuits, Tin (Sn) Plating
3.00mm (.118") Pitch Micro-Fit 3.0 BMI垄芒 Header, Surface Mount Compatible, Dual Row, Vertical, with PCB Polarizing Peg, 12 Circuits, Tin (Sn) Plating
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| File Size |
224.08K /
5 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
RJE451884443
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| Description |
Modular Jack - 8P8C, Vertical, Cat6, THT, No Panel Stops, Single Port, Shield No EMI Tabs, With LEDs
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| Tech specs |
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Official Product Page
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Bom2Buy.com
Price and Availability
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