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Amphenol Communications Solutions |
| Part No. |
51915-448LF
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| Description |
PwrBlade®, Power Connectors, 3DCP 16S 3ACP Right Angle Receptacle, Solder To Board
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
0713086474
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| Description |
2.54mm (.100) Pitch C-Grid? Header, Surface Mount, Dual Row, Vertical, 74 Circuits1.50μm (59μ) Minimum Bright Tin (Sn) Over Nickel (Ni) Plating, with 3.30mm (.130)
2.54mm (.100") Pitch C-Grid垄莽 Header, Surface Mount, Dual Row, Vertical, 74 Circuits1.50楼矛m (59楼矛") Minimum Bright Tin (Sn) Over Nickel (Ni) Plating, with 3.30m
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| File Size |
1,475.71K /
8 Page |
 View
it Online |
Download Datasheet
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Amphenol Communications Solutions |
| Part No. |
68405-448HLF
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| Description |
BergStik®, Board to Board connector, Unshrouded Right Angled Header, Through Hole, Double Row, 48 Positions, 2.54 mm (0.100in)Pitch.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
68695-448HLF
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| Description |
BergStik® 2.54mm, Board To Board Connector, Unshrouded Header, Through Hole, Double Row, 48 Positions, 2.54mm Pitch, Right Angle, 5.84mm (0.23in) Mating, 2.29mm (0.09in) Tail.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
79425-448HLF
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| Description |
BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 48 Positions, 2.54 mm Pitch, Vertical, 4.83 mm (0.19 in.) Mating, 3.05 mm (0.12 in.) Tail.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
68685-448LF
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| Description |
Dubox®, Board to Board connector, PCB Mounted Receptacle, Vertical, Through Hole, Top Entry, Single Row, 48 positions, 2.54mm (0.100in) Pitch.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
10135448-002LF
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| Description |
HPCE VT Receptacle 24P Without Peg
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
0713086472
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| Description |
2.54mm (.100) Pitch C-Grid? Header, Surface Mount, Dual Row, Vertical, 72 Circuits,1.50μm (59μ) Minimum Bright Tin (Sn) Over Nickel (Ni) Plating, with 3.30mm (.130)
2.54mm (.100") Pitch C-Grid垄莽 Header, Surface Mount, Dual Row, Vertical, 72 Circuits,1.50楼矛m (59楼矛") Minimum Bright Tin (Sn) Over Nickel (Ni) Plating, with 3.30
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| File Size |
1,475.71K /
8 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
75915-448HLF
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| Description |
Dubox® 2.54mm, Board to Board Connector,Vertical Receptacle, Through Hole, Single row , 48 Positions, 2.54mm (0.100in) Pitch.
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
0713086470
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| Description |
2.54mm (.100) Pitch C-Grid? Header, Surface Mount, Dual Row, Vertical, 70 Circuits 1.50μm (59μ) Minimum Bright Tin (Sn) Over Nickel (Ni) Plating, with 3.30mm (.130)
2.54mm (.100") Pitch C-Grid垄莽 Header, Surface Mount, Dual Row, Vertical, 70 Circuits 1.50楼矛m (59楼矛") Minimum Bright Tin (Sn) Over Nickel (Ni) Plating, with 3.30
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| File Size |
1,475.71K /
8 Page |
View
it Online |
Download Datasheet |
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Price and Availability
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