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  70287-1011 Datasheet PDF File

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    0702871044

Molex Electronics Ltd.
Part No. 0702871044
Description 2.54mm (.100) Pitch C-Grid Header, Breakaway, Dual Row, Vertical, with Retention Pin, 92 Circuits, 6.10mm
File Size 308.20K  /  6 Page

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Amphenol Communications Solutions
Part No. 10118085-101-12LF
Description Unshrouded Right Angle header,Surface Mount, Double Row, 12 Positions, 2.54mm (0.100in) Pitch.
Tech specs 　 　

Official Product Page

HUA FENG CIRCUIT





    0702871034

Molex Electronics Ltd.
Part No. 0702871034
Description 2.54mm (.100) Pitch C-Grid? Header, Breakaway, Dual Row, Vertical, with RetentionPin, 72 Circuits, 6.10mm (.240) Mating Pin Length, Tin (Sn) Plating
File Size 308.32K  /  6 Page

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Amphenol Communications Solutions
Part No. 10119333-101-15LF
Description BergStik®, Board to Board connector, Unshrouded horizontal header, Surface mount, Single Row, 15 Positions, 2.54mm (0.100in) Pitch.
Tech specs 　 　

Official Product Page

    0702871035

Molex Electronics Ltd.
Part No. 0702871035
Description 2.54mm (.100) Pitch C-Grid? Header, Breakaway, Dual Row, Vertical, with RetentionPin, 74 Circuits, 6.10mm (.240) Mating Pin Length, Tin (Sn) Plating
File Size 308.32K  /  6 Page

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Amphenol Communications Solutions
Part No. 10114829-10110LF
Description 1.25mm Wire to Board Wafer, Vertical, Through Hole, 10 Positions
Tech specs 　 　

Official Product Page

    0702871036

Molex Electronics Ltd.
Part No. 0702871036
Description 2.54mm (.100) Pitch C-Grid? Header, Breakaway, Dual Row, Vertical, with RetentionPin, 76 Circuits, 6.10mm (.240) Mating Pin Length, Tin (Sn) Plating
File Size 308.32K  /  6 Page

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Amphenol Communications Solutions
Part No. 10114831-10113LF
Description 1.25mm Wire-to-Board Connector System WAFER THROUGH HOLE RIGHT ANGLE, 13 POSITIONS, TIN PLATING
Tech specs 　 　

Official Product Page

    0702871039

Molex Electronics Ltd.
Part No. 0702871039
Description 2.54mm (.100) Pitch C-Grid? Header, Breakaway, Dual Row, Vertical, with RetentionPin, 82 Circuits, 6.10mm (.240) Mating Pin Length, Tin (Sn) Plating
File Size 308.20K  /  6 Page

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Amphenol Communications Solutions
Part No. 10114831-10114LF
Description 1.25mm Wire-to-Board Connector System WAFER THROUGH HOLE RIGHT ANGLE, 14 POSITIONS, TIN PLATING
Tech specs 　 　

Official Product Page

    0702871037

Molex Electronics Ltd.
Part No. 0702871037
Description 2.54mm (.100) Pitch C-Grid? Header, Breakaway, Dual Row, Vertical, with Retention Pin, 78 Circuits, 6.10mm (.240) Mating Pin Length, Tin (Sn) Plating
File Size 308.33K  /  6 Page

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Amphenol Communications Solutions
Part No. 10114829-10114LF
Description 1.25mm Wire to Board Wafer, Vertical, Through Hole, 14 Positions
Tech specs 　 　

Official Product Page

    0702871038

Molex Electronics Ltd.
Part No. 0702871038
Description 2.54mm (.100) Pitch C-Grid? Header, Breakaway, Dual Row, Vertical, with Retention Pin, 80 Circuits, 6.10mm (.240) Mating Pin Length, Tin (Sn) Plating
File Size 308.32K  /  6 Page

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Amphenol Communications Solutions
Part No. 10114828-10115LF
Description 1.25mm Wire to Board Wafer,Vertical, Surface Mount, 15 Positions
Tech specs 　 　

Official Product Page

    0702871032

Molex Electronics Ltd.
Part No. 0702871032
Description 2.54mm (.100) Pitch C-Grid? Header, Breakaway, Dual Row, Vertical, with RetentionPin, 68 Circuits, 6.10mm (.240) Mating Pin Length, Tin (Sn) Plating
File Size 308.32K  /  6 Page

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Amphenol Communications Solutions
Part No. 10114830-10111LF
Description 1.25mm Wire to Board Wafer, Right Angle, Surface Mount, 11 Positions
Tech specs 　 　

Official Product Page

    0702871033

Molex Electronics Ltd.
Part No. 0702871033
Description 2.54mm (.100) Pitch C-Grid? Header, Breakaway, Dual Row, Vertical, with RetentionPin, 70 Circuits, 6.10mm (.240) Mating Pin Length, Tin (Sn) Plating
File Size 308.32K  /  6 Page

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Amphenol Communications Solutions
Part No. 10114829-10115LF
Description 1.25mm Wire to Board Wafer, Vertical, Through Hole, 15 Positions
Tech specs 　 　

Official Product Page

    0702871030

Molex Electronics Ltd.
Part No. 0702871030
Description 2.54mm (.100) Pitch C-Grid? Header, Breakaway, Dual Row, Vertical, with RetentionPin, 64 Circuits, 6.10mm (.240) Mating Pin Length, Tin (Sn) Plating
File Size 308.32K  /  6 Page

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Amphenol Communications Solutions
Part No. 10114831-10115LF
Description 1.25mm Wire-to-Board Connector System WAFER THROUGH HOLE RIGHT ANGLE, 15 POSITIONS, TIN PLATING
Tech specs 　 　

Official Product Page

For 70287-1011 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | <11> | 12 | 13 | 14 | 15 |   

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