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  50837-8000 Datasheet PDF File

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    TX8000

rfsolutions.ltd
Part No. TX8000
Description Synthesised Radio Modules

File Size 363.92K  /  4 Page

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Amphenol Communications Solutions

Part No. 68000-401HLF
Description BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 1 Positions, 2.54 mm Pitch, Vertical, 5.84 mm (0.23 in.) Mating, 2.41 mm (0.095 in.) Tail
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    Murata Manufacturing Co...
Part No. DR8000-DK
Description 916.5MHz Development kit

File Size 34.51K  /  1 Page

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Amphenol Communications Solutions

Part No. CE1208000110111
Description Cool Edge 0.80mm Hybrid Power and Signal Connectors, Storage and Server System, Through Hole/Surface mount, 2 power pins, 80 signal pins, Vertical
Tech specs    

Official Product Page

    162-10-628-00-180000

Mill-Max Mfg. Corp.
Part No. 162-10-628-00-180000
Description DIP Header Solder Tail Shrink DIP (.070 Spacing) Open Frame Through Hole

File Size 217.37K  /  2 Page

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Amphenol Communications Solutions

Part No. 68000-232HLF
Description BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 32 Positions, 2.54 mm Pitch, Vertical, 5.84 mm (0.23 in.) Mating, 2.41 mm (0.095 in.) Tail
Tech specs    

Official Product Page

    SI-8000Q SI-8005Q

Sanken electric
Part No. SI-8000Q SI-8005Q
Description Surface Mount, Current Mode Cntrol Step-down Switching Mode

File Size 61.22K  /  2 Page

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Amphenol Communications Solutions

Part No. 68000-434HLF
Description BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 34 Positions, 2.54 mm Pitch, Vertical, 5.84 mm (0.23 in.) Mating, 2.41 mm (0.095 in.) Tail
Tech specs    

Official Product Page

    MILL-MAX MFG CORP
Part No. 162-90-430-00-180000
Description DIP30, IC SOCKET

File Size 219.02K  /  1 Page

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Amphenol Communications Solutions

Part No. 68000-119HLF
Description BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 19 Positions, 2.54 mm Pitch, Vertical, 5.84 mm (0.23 in.) Mating, 2.41 mm (0.095 in.) Tail
Tech specs    

Official Product Page

    304-11-114-41-780000

Mill-Max Mfg. Corp.
Part No. 304-11-114-41-780000
Description    Interconnect Socket Solderless Press-Fit Socket

File Size 128.37K  /  3 Page

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Amphenol Communications Solutions

Part No. 68000-403HLF
Description BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 3 Positions, 2.54 mm Pitch, Vertical, 5.84 mm (0.23 in.) Mating, 2.41 mm (0.095 in.) Tail
Tech specs    

Official Product Page

    304-11-115-41-780000

Mill-Max Mfg. Corp.
Part No. 304-11-115-41-780000
Description    Interconnect Socket Solderless Press-Fit Socket

File Size 128.36K  /  3 Page

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Amphenol Communications Solutions

Part No. 68000-228HLF
Description BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 28 Positions, 2.54 mm Pitch, Vertical, 5.84 mm (0.23 in.) Mating, 2.41 mm (0.095 in.) Tail
Tech specs    

Official Product Page

    304-11-105-41-780000

Mill-Max Mfg. Corp.
Part No. 304-11-105-41-780000
Description    Interconnect Socket Solderless Press-Fit Socket

File Size 128.37K  /  3 Page

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Amphenol Communications Solutions

Part No. 10035388-000LF
Description Power Card Edge, Power Connectors, 2 x 29P STB Right Angle.
Tech specs    

Official Product Page

    162-10-652-00-180000

Mill-Max Mfg. Corp.
Part No. 162-10-652-00-180000
Description DIP Header Solder Tail Shrink DIP (.070 Spacing) Open Frame Through Hole

File Size 217.38K  /  2 Page

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Amphenol Communications Solutions

Part No. 68000-123HLF
Description BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 23 Positions, 2.54 mm Pitch, Vertical, 5.84 mm (0.23 in.) Mating, 2.41 mm (0.095 in.) Tail
Tech specs    

Official Product Page

    162-10-642-00-180000

Mill-Max Mfg. Corp.
Part No. 162-10-642-00-180000
Description DIP Header Solder Tail Shrink DIP (.070 Spacing) Open Frame Through Hole

File Size 217.38K  /  2 Page

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Amphenol Communications Solutions

Part No. 68000-101HLF
Description BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 1 Positions, 2.54 mm Pitch, Vertical, 5.84 mm (0.23 in.) Mating, 2.41 mm (0.095 in.) Tail
Tech specs    

Official Product Page

For 50837-8000 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | <11> | 12 | 13 | 14 | 15 |   

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