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  4445-09M Datasheet PDF File

For 4445-09M Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | <11> | 12 | 13 | 14 | 15 |   

    0014445313 A-70475-2357

Molex Electronics Ltd.
Part No. 0014445313 A-70475-2357
Description 2.54mm (.100) Pitch SL?/a> Insulation Displacement Connector Assembly, Male, Single Row, Version D, Back Ribs, for Wire Size 22, 0.38μm (15μ) Gold (Au), 13 Circuits
File Size 150.52K  /  2 Page

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Amphenol Communications Solutions
Part No. 444-5025-062
Description VHDM-HSD™, Backplane connectors, Vertical Orientation, Press Fit Termination, 5 Row eHSD+, 25 positions, open, 6.25mm (0.246in), Header.
Tech specs 　 　

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HUA FENG CIRCUIT





    0014445315 70475-2359 A-70475-2359

Molex Electronics Ltd.
Part No. 0014445315 70475-2359 A-70475-2359
Description 2.54mm (.100) Pitch SL?/a> Insulation Displacement Connector Assembly, Male, Single Row, Version D, Back Ribs, for Wire Size 22, 0.38μm (15μ) Gold (Au), 15 Circuits
File Size 151.64K  /  3 Page

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Amphenol Communications Solutions
Part No. 444-5010-062
Description VHDM-HSD™, Backplane connectors, Vertical Orientation, Press Fit Termination, 5 Row eHSD+, 10 positions, open, 6.25mm (0.246in), Header.
Tech specs 　 　

Official Product Page

    0014445317 70475-2361

Molex Electronics Ltd.
Part No. 0014445317 70475-2361
Description 2.54mm (.100) Pitch SL?/a> Insulation Displacement Connector Assembly, Male, Single Row, Version D, Back Ribs, for Wire Size 22, 0.38μm (15μ) Gold (Au), 17 Circuits
File Size 150.51K  /  2 Page

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Amphenol Communications Solutions
Part No. 444-5025-064
Description VHDM-HSD™, Backplane connectors, Vertical Orientation, Press Fit Termination, 5 Row eHSD+, 25 positions, open, 5.15mm (0.202in), Header.
Tech specs 　 　

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    Z0109MN0

NXP Semiconductors
Part No. Z0109MN0
Description 4Q Triac Rev. 3 ?12 May 2011
File Size 620.09K  /  17 Page

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Amphenol Communications Solutions
Part No. 444-5010-064
Description VHDM-HSD™, Backplane connectors, Vertical Orientation, Press Fit Termination, 5 Row eHSD+, 10 positions, open, 5.15mm (0.202in), Header.
Tech specs 　 　

Official Product Page

    LV5809MX

Sanyo Semicon Device
Part No. LV5809MX
Description Step-down Switching Regulator
File Size 112.58K  /  5 Page

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Renesas Electronics Corporation
Part No. SC14445
Description Fully integrated, monolithic DECT/CAT-iq processor ICs
Tech specs 　 　

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    RD09MUP2

Mitsubishi Electric Semiconductor
Part No. RD09MUP2
Description Silicon MOSFET Power Transistor, 520MHz, 8W
File Size 148.99K  /  7 Page

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Amphenol Communications Solutions
Part No. 74445-588
Description Modular Jack, CAT 3, Low Profile, 8P8C, Right Angle, Through Hole, with Shield, 1 Port.
Tech specs 　 　

Official Product Page

    Z0109MA0

NXP Semiconductors
Part No. Z0109MA0
Description Logic level four-quadrant triac
File Size 569.46K  /  13 Page

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Amphenol Communications Solutions
Part No. RJMG221044451ER
Description RJ Magnetic (RJMG) - 2xN, Input Output Connectors, Right angle, dip type, 2x1, 1000 base-T, Green-Yellow/Green-Yellow.
Tech specs 　 　

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    LB1909MC LB1909MC-BH

ON Semiconductor
Part No. LB1909MC LB1909MC-BH
Description Stepping Motor Driver IC
File Size 54.59K  /  4 Page

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Amphenol Communications Solutions
Part No. 10061290-444545PLF
Description AirMax® Power Connectors, Backplane Connectors, 2-Pair, 3 Column, Vertical Receptacle, Press-Fit
Tech specs 　 　

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    557109M2

Glenair, Inc.
Part No. 557109M2
Description EMI/RFI Banding Backshell Assembly
File Size 35.44K  /  2 Page

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    LB1909MC

Sanyo Semicon Device
Part No. LB1909MC
Description Monolithic Digital IC Stepping Motor Driver IC
File Size 86.04K  /  4 Page

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