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Amphenol Communications Solutions |
| Part No. |
54122-112081950RLF
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| Description |
BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 8 position, 2.54mm (0.100in) pitch
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
54242-812081900LF
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| Description |
BergStik®, Board to Board connector, Unshrouded vertical stacked header, Surface Mount, Double Row, 8 Positions, 2.54mm (0.100in) Pitch.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
54112-809081900LF
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| Description |
BergStik<sup>®<sup>, Board to Board connector, 2.54mm (0.100in), Unshrouded vertical stacking Header, Through Hole, Double Row, 8 Positions
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
54122-112081950LF
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| Description |
BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 8 position, 2.54mm (0.100in) pitch
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
54112-811081900LF
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| Description |
BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 8 Positions, 2.54mm (0.100in) Pitch.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
57102-F08-19LF
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| Description |
Minitek®, Board/Wire to Board Connectors, Unshrouded Headers - Through Hole - Double row - 38 Positions - 2mm (0.079inch) - Vertical
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| Tech specs |
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Official Product Page
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Molex, Inc.
MOLEX INC
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| Part No. |
43650-0813 43650-1214 43650-0410 43650-0414 43650-1010 43650-1013
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| Description |
Header; No. of Contacts:8; Pitch Spacing:0.118"; No. of Rows:1; Series:Micro-Fit 3.0; Body Material:Liquid Crystal Polymer 8 CONTACT(S), MALE, RIGHT ANGLE TWO PART BOARD CONNECTOR, SURFACE MOUNT
MicroFit 3.0 SR RA SMT Nail 30Au 12Ckt 12 CONTACT(S), MALE, RIGHT ANGLE TWO PART BOARD CONNECTOR, SURFACE MOUNT
CONN HEADER 4POS R/A W/CLIP SMD 4 CONTACT(S), MALE, RIGHT ANGLE TWO PART BOARD CONNECTOR, SURFACE MOUNT
MicroFit 3.0 SR RA SMT Nail 30Au 4Ckt 4 CONTACT(S), MALE, RIGHT ANGLE TWO PART BOARD CONNECTOR, SURFACE MOUNT
Header; Number of Contacts:10; Pitch Spacing:0.118"; Number of Rows:1; Series:Micro-Fit 3.0; Body Material:Liquid Crystal Polymer
Multipole Connector; Gender:Male; No. of Contacts:10; Series:43650; Body Material:Polyester; Connecting Termination:Crimp; Mounting Type:Wire-to-wire; No. of Rows:2; Operating Voltage:250V; Pitch Spacing:3mm RoHS Compliant: Yes
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| File Size |
81.53K /
1 Page |
 View
it Online |
Download Datasheet
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Amphenol Communications Solutions |
| Part No. |
57102-S08-19LF
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| Description |
Minitek® 2.00mm, Board/Wire to Board Connector, 2.00mm (0,079in), Unshrouded Vertical Header, Through Hole, Double Row, 38 Positions
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| Tech specs |
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Official Product Page
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Molex, Inc.
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| Part No. |
43650-0330 43650-0417 43650-9915 43650-1116 43650-0917 43650-1115
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| Description |
MicroFit 3.0 SR Vert TH/Void Tin 3 Ckt 2 CONTACT(S), FEMALE, STRAIGHT TWO PART BOARD CONNECTOR, SOLDER
HEADER,4 POS,VERTICAL,.118 PIT. SELCT GOLD PLATING,15U MIN 4 CONTACT(S), FEMALE, STRAIGHT TWO PART BOARD CONNECTOR, SOLDER
MicroFit 3.0 SR Vert TH/Void Tin 5Ckt 4 CONTACT(S), FEMALE, STRAIGHT TWO PART BOARD CONNECTOR, SOLDER
Header; No. of Contacts:11; Pitch Spacing:0.118"; No. of Rows:1; Series:Mini-Fit 3.0; Body Material:Liquid Crystal Polymer 11 CONTACT(S), FEMALE, STRAIGHT TWO PART BOARD CONNECTOR, SOLDER
MicroFit 3.0 SR Vert TH Peg 30Au 9Ckt 9 CONTACT(S), FEMALE, STRAIGHT TWO PART BOARD CONNECTOR, SOLDER
CONN HEADER 11POS 3MM VERT TIN 11 CONTACT(S), FEMALE, STRAIGHT TWO PART BOARD CONNECTOR, SOLDER
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| File Size |
249.45K /
3 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
54202-T0819LF
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| Description |
BergStik®, Board to Board connector, Unshrouded Vertical Header, Surface Mount, Double Row, 38 Positions, 2.54 mm (0.100in) Pitch.
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| Tech specs |
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Official Product Page
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Molex, Inc.
MOLEX INC
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| Part No. |
43650-0301 43650-0700 43650-1200 43650-1102 43650-1202 43650-1001
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| Description |
CONN HEADER 3POS 3MM RT ANG GOLD 3 CONTACT(S), MALE, POWER CONNECTOR, SOLDER
Header; No. of Contacts:7; Pitch Spacing:0.118"; No. of Rows:1; Series:Micro-Fit 3.0; Body Material:Liquid Crystal Polymer RoHS Compliant: Yes 7 CONTACT(S), MALE, POWER CONNECTOR, SOLDER
CONN HEADER 12POS 3MM RT ANG TIN 12 CONTACT(S), MALE, POWER CONNECTOR, SOLDER
MicroFit 3.0 SR RA TH Peg 30Au 11Ckt 11 CONTACT(S), MALE, POWER CONNECTOR, SOLDER
MicroFit 3.0 SR RA TH Peg 30Au 12Ckt 12 CONTACT(S), MALE, POWER CONNECTOR, SOLDER
Header; No. of Contacts:10; Pitch Spacing:0.118"; No. of Rows:1; Series:Micro-Fit 3.0; Body Material:Liquid Crystal Polymer RoHS Compliant: Yes
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| File Size |
121.86K /
1 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
57102-G08-19LF
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| Description |
Minitek®, Board/Wire to Board Connectors, Unshrouded Headers - Through Hole - Double row - 38 Positions - 2mm (0.079inch) - Vertical
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
54121-112081950LF
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| Description |
BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Single Row, 8 Positions, 2.54mm (0.100in) Pitch.
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| Tech specs |
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Official Product Page
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Price and Availability
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