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Amphenol Communications Solutions |
| Part No. |
10115859-012LF
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| Description |
HPCE R/A Receptacle 36P24S
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
10115859-006LF
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| Description |
HPCE R/A Receptacle 36P24S
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
10115859-004LF
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| Description |
HPCE R/A REC 36P24S
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| Tech specs |
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Official Product Page
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Mitsubishi Electric, Corp.
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| Part No. |
PUMA2X0211I-1570 PUMA2X0211M-9070 PUMA2X0211M-9085 PUMA2X0211I-1555 PUMA2X0211I-1585 PUMA2X0211M-9055 PUMA2X0211-1570 PUMA2X0211MB-1285 PUMA2X0211MB-1270 PUMA2X0211M-1285
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| Description |
10MS, 8 TSSOP, IND TEMP, GREEN, 1.8V(SERIAL EE) 10MS, 8 SOIC, IND TEMP, GREEN, 2.7V(SERIAL EE) 10MS, DIE 1.8V, 11 MILS THICKNESS(SERIAL EE) 10MS, 8 SOIC, COM TEMP(SERIAL EE) SRAM/EPROM 静态存储器/存储
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| File Size |
685.49K /
14 Page |
View
it Online |
Download Datasheet
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Amphenol Communications Solutions |
| Part No. |
10115859-008LF
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| Description |
HPCE R/A Receptacle 36P24S
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
10115859-011LF
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| Description |
HPCE R/A Receptacle 36P24S
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
77313-158-56LF
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| Description |
BergStik®, Board to Board connector, Unshrouded Header, 2.54 mm Pitch, Vertical, Double Row,Through Hole, 56 Positions
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
77313-158-54LF
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| Description |
BergStik<sup>®<sup>, Board to Board connector, 2.54mm (0.100in), Unshrouded vertical Header, Through Hole, Double Row, 54 Positions
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
10115859-002LF
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| Description |
HPCE R/A Receptacle 36P24S
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
75915-850HLF
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| Description |
Dubox® 2.54mm, Board to Board Connector,Vertical Receptacle, Through Hole, Single row , 50 Positions, 2.54mm (0.100in) Pitch.
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| Tech specs |
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Official Product Page
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TDK, Corp. TE Connectivity, Ltd.
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| Part No. |
PUMA2US2500I-2512 PUMA2US2500I-2510 PUMA2US2500I-2515 PUMA2US2500M-1710 PUMA2US2500M-1715 PUMA2US2500M-1712 PUMA2US2500I-1515 PUMA2US2500I-1585 PUMA2US2500I-1510 PUMA2US2500I-1512 PUMA2US2500MB-1015 PUMA2US2500-2512 PUMA2US2500MB-1585 PUMA2US2500MB-1512 PUMA2US2500MB-1515 PUMA2US2500MB-2515 PUMA2US2500MB-1215 PUMA2US2500-2510 PUMA2US2500M-2512 PUMA2US2500M-2510 PUMA2US2500-2585 PUMA2US2500M-2585 PUMA2US2500MB-2585 PUMA2US2500-2515 PUMA2US2500I-2585 PUMA2US2500M-2515 PUMA2US2500MB-2512 PUMA2US2500-1515 PUMA2US2500-1512 PUMA2US2500-1510 PUMA2US2500-1010 PUMA2US2500-1012 PUMA2US2500-1015 PUMA2US2500-2010 PUMA2US2500-2012 PUMA2US2500-2015 PUMA2US2500I-1010 PUMA2US2500MB-1785 PUMA2US2500MB-1285 PUMA2US2500I-1712 PUMA2US2500M-1215 PUMA2US2500M-1285
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| Description |
10MS, 8 PDIP, IND TEMP, GREEN, 1.8V(SERIAL EE) 10MS, 8 EIAJ SOIC, IND TEMP, GREEN, 2.7V(SERIAL EE) 10MS, 8 SOIC, EXT TEMP, GREEN, 2.7V(SERIAL EE) 10MS, 8 SOIC, IND TEMP, GREEN, 2.7(SERIAL EE) 10MS, 8 TSSOP, IND TEMP, GREEN, 2.7(SERIAL EE) 10MS, 8 TSSOP, EXT TEMP, GREEN, 2.7V(SERIAL EE) 10MS, 8 SOIC, IND TEMP, GREEN, 2.7V(SERIAL EE) 10MS, DIE, 2.7V, 11 MILS THICKNESS(SERIAL EE) 10MS, 8 MINI-MAP, IND TEMP, GREEN, 1.8V(SERIAL EE) 10MS, 8 LAP, IND TEMP, GREEN, 2.7V(SERIAL EE) SRAM/EPROM 静态存储器/存储 10MS, DIE, 1.8V, 11 MILS THICKNESS(SERIAL EE) 静态存储器/存储
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| File Size |
732.06K /
17 Page |
View
it Online |
Download Datasheet
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Amphenol Communications Solutions |
| Part No. |
75844-158-50LF
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| Description |
BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Double Row, 50 Positions, 2.54mm (0.100in) Pitch.
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| Tech specs |
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Official Product Page
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Bom2Buy.com

Price and Availability
  |
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JITONG
TECHNOLOGY
(CHINA HK & SZ)
Datasheet.hk's Sponsor |
| Part: 1582595H |
| Maker: MOTOROLA(摩托罗拉) |
| Pack: CDIP |
| Stock: 129 |
| Unit price
for : |
|
50: $1.85 |
|
100: $1.75 |
| 1000:
$1.66 |
|
Email: oulindz@gmail.com |
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