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  106a Datasheet PDF File

For 106a Found Datasheets File :: 278    Search Time::3.859ms    
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    PROTEC[Protek Devices]
Part No. PKFC36C PKFC05C PKFC08C PKFC12C PKFC15C PKFC24C PKFC3.3C
OCR Text ...ound No Clean OSP(Entek Cu Plus 106a) 50m 20m 60 Seconds 270C REQUIREMENTS Temperature: TP for Lead-Free (SnAgCu): 260-270C TP for Tin-Lead: 240-245C Preheat time and temperature depends on solder paste and flux activation temperature, ...
Description PACKAGED FLIP CHIP ARRAY

File Size 64.09K  /  5 Page

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    PROTEC[Protek Devices]
Part No. PRSB68C PRSB6.8C
OCR Text ...ound No Clean OSP(Entek Cu Plus 106a) 50m 20m 60 Seconds 270C REQUIREMENTS Temperature: TP for Lead-Free (SnAgCu): 260-265C TP for Tin-Lead: 240-245C Preheat time and temperature depends on solder paste and flux activation temperature, ...
Description STANDARD TVS COMPONENTS

File Size 86.75K  /  5 Page

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    PROTEC[Protek Devices]
Part No. SFC05-4
OCR Text ...ound No Clean OSP(Entek Cu Plus 106a) 50m 20m 60 Seconds 270C REQUIREMENTS Temperature: TP for Lead-Free (SnAgCu): 260-265C TP for Tin-Lead: 240-245C Preheat time and temperature depends on solder paste and flux activation temperature, ...
Description FLIP CHIP ARRAY

File Size 126.18K  /  6 Page

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    Littelfuse, Inc.
LITTELFUSE[Littelfuse]
Part No. SP0516BACT SP0504BACT SP0508BACT SP0504BAC
OCR Text .../50 No Clean OSP (Entek Cu Plus 106a) 225 200 Temperature (oC) 175 150 125 100 75 50 25 0 48 97 145 194 242 290 339 387 435 Solder Mask Opening Solder Stencil Thickness Solder Stencil Aperature Opening Solder Flux Ratio Solder P...
Description (SP0504BAC / SP0508BAC / SP0516BAC) Silicon Protection Circuits - TVS Avalanche Diode Array in a Unipolar Chip Scale Package

File Size 152.54K  /  3 Page

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    LITTELFUSE[Littelfuse]
Part No. SP0516BBCT SP0504BBC SP0504BBCT SP0508BBC SP0508BBCT SP0516BBC
OCR Text .../50 No Clean OSP (Entek Cu Plus 106a) 225 200 Temperature (oC) 175 150 125 100 75 50 25 0 48 97 145 194 242 290 339 387 435 Solder Mask Opening Solder Stencil Thickness Solder Stencil Aperature Opening Solder Flux Ratio Solder P...
Description (SP0504BBC / SP0508BBC / SP0516BBC) SP0504BBCT - TVS Avalanche Diode Array in a Bipolar Chip Scale Package

File Size 167.33K  /  3 Page

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    hitachi
Part No. PF1010A
OCR Text 106a (Z) 2nd. Edition July 1996 Features * * * * Frequency range: 806 to 824 MHz Surface mounted small package: 1 cc, 3g with shielded cover Loe voltage operation: 6 V Low power control current: 300 A Typ Pin Arrangement * RF-E 4 1: P...
Description From old datasheet system

File Size 72.08K  /  12 Page

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    PROTEC[Protek Devices]
Part No. U0402FC36C U0402FC05C U0402FC08C U0402FC12C U0402FC15C U0402FC24C U0402FC3.3C U0402FC33C
OCR Text ...ound No Clean OSP(Entek Cu Plus 106a) 50m 20m 60 Seconds 270C REQUIREMENTS Temperature: TP for Lead-Free (SnAgCu): 260-265C TP for Tin-Lead: 240-245C Preheat time and temperature depends on solder paste and flux activation temperature, ...
Description UNBUMPED FLIP CHIP ARRAY

File Size 76.18K  /  5 Page

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    PROTEC[Protek Devices]
Part No. U0404FC36C U0404FC05C U0404FC08C U0404FC12C U0404FC15C U0404FC24C U0404FC3.3C U0404FC33C
OCR Text ...ound No Clean OSP(Entek Cu Plus 106a) 50m 20m 60 Seconds 270C REQUIREMENTS Temperature: TP for Lead-Free (SnAgCu): 260-265C TP for Tin-Lead: 240-245C Preheat time and temperature depends on solder paste and flux activation temperature, ...
Description UNBUMPED FLIP CHIP ARRAY

File Size 98.88K  /  6 Page

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    PROTEC[Protek Devices]
Part No. U0406FC36C U0406FC05C U0406FC08C U0406FC12C U0406FC15C U0406FC24C U0406FC3.3C U0406FC33C
OCR Text ...ound No Clean OSP(Entek Cu Plus 106a) 50m 20m 60 Seconds 270C REQUIREMENTS Temperature: TP for Lead-Free (SnAgCu): 260-265C TP for Tin-Lead: 240-245C Preheat time and temperature depends on solder paste and flux activation temperature, ...
Description UNBUMPED FLIP CHIP ARRAY

File Size 102.32K  /  6 Page

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    PROTEC[Protek Devices]
Part No. U0408FC36C U0408FC05C U0408FC08C U0408FC12C U0408FC15C U0408FC24C U0408FC3.3C U0408FC33C
OCR Text ...ound No Clean OSP(Entek Cu Plus 106a) 50m 20m 60 Seconds 270C REQUIREMENTS Temperature: TP for Lead-Free (SnAgCu): 260-265C TP for Tin-Lead: 240-245C Preheat time and temperature depends on solder paste and flux activation temperature, ...
Description    UNBUMPED FLIP CHIP ARRAY

File Size 105.62K  /  6 Page

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For 106a Found Datasheets File :: 278    Search Time::3.859ms    
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