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  082-5373 Datasheet PDF File

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    Hewlett-Packard / Agilent
Part No. 5082-0112
Description Glass Packaged Step Recovery Diodes

File Size 88.16K  /  3 Page

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Amphenol Communications Solutions

Part No. GSB3115373FHR
Description USB 3.2, Type A, Receptacle, Right Angle Stacked Sink, 9.91mm Height, 18 Pins, Shell with Nickel Plating, Shell Dip Pitch 15.6mm, 30u\\ Gold, Dip 3mm, Blue High Temperature Housing, Tray Packaging
Tech specs    

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HUA FENG CIRCUIT





   
Part No. 3082A
Description Low-Power, Single-/Dual-Level Battery Monitors with Hysteresis and Integrated µP Reset

File Size 70.57K  /  2 Page

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Amphenol Communications Solutions

Part No. 51915-373LF
Description PwrBlade®, Power Connectors, 3ACP 20S Right Angle Receptacle, Solder To Board
Tech specs    

Official Product Page

    Hewlett-Packard
Part No. 5082-3001
Description (5082-3xxx) PIN Diodes for RF Switching and Attenuating

File Size 211.34K  /  4 Page

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Amphenol Communications Solutions

Part No. GSB3115373T1F3HR
Description USB 3.2, Type A, Receptacle, Right Angle Stacked Sink, 11.42mm Height, 18 Pins, Shell Without Flange(T/B), Shell Dip 3.2mm, Shell with Nickel Plating, Shell Dip Pitch 15.6mm, 30u\\ Gold, Dip 3.0mm, Blue High Temperature Housing, Tray Packaging
Tech specs    

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    BEL[Bel Fuse Inc.]
Part No. SI-60082-F
Description SI-60082-F

File Size 440.63K  /  4 Page

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Amphenol Communications Solutions

Part No. GSB3115373TF3HR
Description USB 3.2, Type A, Receptacle, Right Angle Stacked Sink, 11.42mm Height, 18 Pins, Shell Without Flange(T/B), Shell Dip 3.2mm, Shell with Nickel Plating, Shell Dip Pitch 15.6mm, 30u\\ Gold, Dip 3.0mm, Blue High Temperature Housing, Tray Packaging
Tech specs    

Official Product Page

    BEL[Bel Fuse Inc.]
Part No. 0826-1XX1-46-F
Description INTEGRATED CONNECTOR MODULES

File Size 180.41K  /  3 Page

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Amphenol Communications Solutions

Part No. GSB3115373RF1HR
Description USB 3.2, Type A, Receptacle, Right Angle Stacked Sink, 9.91mm Height, 18 Pins, Shell Without Flange(T/B), Shell with Nickel Plating, Shell Dip Pitch 15.6mm, 30u\\ Gold, Dip 3.0mm, Blue High Temperature Housing, Tape and Reel Packaging
Tech specs    

Official Product Page

    Hewlett-Packard / Agilent
Part No. 5082-2800
Description Schottky Barrier Diodes for General Purpose Applications

File Size 180.97K  /  6 Page

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Amphenol Communications Solutions

Part No. RJE1R288225373
Description Modular Jack - 8P8C, RA, Cat5e, Stacked, 2x1 Two Port, Shield With Top and Side EMI Tabs, With LEDs
Tech specs    

Official Product Page

    40822

Advanced Semiconductor
Part No. 40822
Description MOS FIELD-EFFECT TRANSISTOR

File Size 36.71K  /  1 Page

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Amphenol Communications Solutions

Part No. GSB3115373RFHR
Description USB3.2, A, GEN1, RightAngle, STACK SINK, DIP, 30u\\ GOLD, BLUE, TL 3MM, H: 9.91mm
Tech specs    

Official Product Page

    Bel Fuse, Inc.
Part No. 0826-1X4T-43-F
Description INTEGRATED CONNECTOR MODULES DATACOM TRANSFORMER FOR ETHERNET APPLICATION(S)

File Size 215.64K  /  4 Page

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Texas Instruments

Part No. CSD95373AQ5M
Description 45A Synchronous Buck NexFET&#153; Power Stage with temperature sense 12-LSON-CLIP -55 to 150
Tech specs    

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    Hewlett-Packard / Agilent
Part No. 5082-0015
Description 1.2pF Capacitance Varactor Diode

File Size 47.97K  /  2 Page

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Texas Instruments

Part No. CSD95373BQ5M
Description 45A Synchronous Buck NexFET&#153; Smart Power Stage 12-LSON-CLIP -55 to 150
Tech specs    

Get Free Sample

Official Product Page

    08245

Qualtek Electronics Corporation
Part No. 08245
Description WIRE FORM FAN GUARD (25mm)

File Size 148.09K  /  1 Page

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Texas Instruments

Part No. CSD95373BQ5MT
Description 45A Synchronous Buck NexFET&#153; Smart Power Stage 12-LSON-CLIP -55 to 150
Tech specs    

Official Product Page

For 082-5373 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | <11> | 12 | 13 | 14 | 15 |   

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