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  0181 Datasheet PDF File

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    24-00135 24-00150 24-00178 24-00181 24-00166 24-00168 24-00138 24-00141 24-00167 24-00171 24-00144 24-00172 24-00173 24-

JDS Uniphase Corporation
Part No. 24-00135 24-00150 24-00178 24-00181 24-00166 24-00168 24-00138 24-00141 24-00167 24-00171 24-00144 24-00172 24-00173 24-00147 24-00179 24-00180
Description Diode Lasers, High Brightness 0.6 to 8.5 W, 8xx nm

File Size 517.62K  /  11 Page

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Amphenol Communications Solutions

Part No. 10060018-10202TLF
Description PCI Express® GEN 1 Card Edge, Storage and Server Connector, Vertical, Press-Fit, x8, 98 Positions, 1.00mm (0.039in) Pitch
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    0010181122 A30991203 10-18-1122 A-3099-1203

Molex Electronics Ltd.
Part No. 0010181122 A30991203 10-18-1122 A-3099-1203
Description 2.36mm (.093) Diameter Standard .093 Pin and Socket Header, 3 Rows, Shrouded, Unfilled Polyester, UL 94V-0, 12 Circuits, 12 Female Terminals
2.36mm (.093") Diameter Standard .093" Pin and Socket Header, 3 Rows, Shrouded, Unfilled Polyester, UL 94V-0, 12 Circuits, 12 Female Terminals
MOLEX Connector

File Size 106.10K  /  3 Page

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Amphenol Communications Solutions

Part No. 10060018-10011TLF
Description PCI Express® GEN 1 Card Edge, Storage and Server Connector, Vertical, Press-Fit, x4, 64 Positions, 1.00mm (0.039in) Pitch
Tech specs    

Official Product Page

    0010181091 10-18-1091 A-3099-0902 A30990902

Molex Electronics Ltd.
Part No. 0010181091 10-18-1091 A-3099-0902 A30990902
Description 2.36mm (.093) Diameter Standard .093 Pin and Socket Header, 3 Rows, Shrouded, Unfilled Polyester, UL 94V-0, 9 Circuits, 9 Female Terminals
2.36mm (.093") Diameter Standard .093" Pin and Socket Header, 3 Rows, Shrouded, Unfilled Polyester, UL 94V-0, 9 Circuits, 9 Female Terminals

File Size 108.18K  /  3 Page

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Amphenol Communications Solutions

Part No. 59112-T40-18-140LF
Description Minitek® 2.00mm, Board to Board Connector, Unshrouded Stacking Header - Through Hole - Double row - 36 Positions - 2mm (0.079inch) - Vertical.
Tech specs    

Official Product Page

    Samsung Electronic
Part No. K7P801811M K7P803611M
Description 256Kx36 & 512Kx18 Synchronous Pipelined SRAM Data Sheet

File Size 312.70K  /  13 Page

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Amphenol Communications Solutions

Part No. 10060018-10212TLF
Description PCI Express® GEN 1 Card Edge, Storage and Server Connector, Vertical, Press-Fit, x8, 98 Positions, 1.00mm (0.039in) Pitch
Tech specs    

Official Product Page

   
Part No. K7P403611A-H30 K7P401811A-H30
Description 128K X 36 STANDARD SRAM, 1.8 ns, PBGA119 14 X 22 MM, BGA-119

File Size 296.05K  /  13 Page

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Amphenol Communications Solutions

Part No. 10060018-10203TLF
Description PCI Express® GEN 1 Card Edge, Storage and Server Connector, Vertical, Press-Fit, x16, 164 Positions, 1.00mm (0.039in) Pitch
Tech specs    

Official Product Page

    K7P803611M-H21 K7P801811M K7P801811M-H20 K7P801811M-H21 K7P801811M-H25 K7P803611M K7P803611M-H20 K7P803611M-H25

SAMSUNG[Samsung semiconductor]
Part No. K7P803611M-H21 K7P801811M K7P801811M-H20 K7P801811M-H21 K7P801811M-H25 K7P803611M K7P803611M-H20 K7P803611M-H25
Description 256Kx36 & 512Kx18 SRAM

File Size 212.19K  /  13 Page

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Amphenol Communications Solutions

Part No. 10138980-1811LF
Description Minitek® Pwr 3.0 BMI, Dual Row, Vertical Through Hole Header, Tin plating, 18 Positions, Black Color, LCP, GW Compatible, Tray packing, With Kink Tails.
Tech specs    

Official Product Page

    SAMSUNG SEMICONDUCTOR CO. LTD.
Part No. K7P801811M-H20 K7P801811M-H21 K7P801811M-H25 K7P803611M-H20 K7P803611M-H21 K7P803611M-H25
Description 256Kx36 & 512Kx18 SRAM
256Kx36 & 512Kx18 SRAM

File Size 213.93K  /  13 Page

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Amphenol Communications Solutions

Part No. 10127720-181LF
Description Minitek® Pwr 3.0, Dual Row, Right Angle Through Hole Header, 18 Positions, 100u\\ Tin plating, Non GW Compatible LCP, With Pegs, Tray Packing.
Tech specs    

Official Product Page

    54002203RWC 54002203RWA 54001818

FCI connector
Part No. 54002203RWC 54002203RWA 54001818
Description
File Size 89.03K  /  1 Page

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Amphenol Communications Solutions

Part No. 10060018-10213TLF
Description PCI Express® GEN 1 Card Edge, Storage and Server Connector, Vertical, Press-Fit, x16, 164 Positions, 1.00mm (0.039in) Pitch
Tech specs    

Official Product Page

    UPD30181AYF1-131-GA3 UPD30181A UPD30181AF1-131-GA3-A UPD30181AYF1-131-GA3-A UPD30181AY UPD30181AF1-131-GA3

NEC[NEC]
Part No. UPD30181AYF1-131-GA3 UPD30181A UPD30181AF1-131-GA3-A UPD30181AYF1-131-GA3-A UPD30181AY UPD30181AF1-131-GA3
Description 64-/32-BIT MICROPROCESSOR

File Size 561.63K  /  72 Page

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Amphenol Communications Solutions

Part No. 10060018-10003TLF
Description PCI Express® GEN 1 Card Edge, Storage and Server Connector, Vertical, Press-Fit, x16, 164 Positions, 1.00mm (0.039in) Pitch
Tech specs    

Official Product Page

    K7P803611B K7P803611B-HC33 K7P803611B-HC30 K7P801811B K7P801811B-HC25 K7P801811B-HC27 K7P801811B-HC30 K7P801811B-HC33 K7

SAMSUNG[Samsung semiconductor]
Part No. K7P803611B K7P803611B-HC33 K7P803611B-HC30 K7P801811B K7P801811B-HC25 K7P801811B-HC27 K7P801811B-HC30 K7P801811B-HC33 K7P803611B-HC25 K7P803611B-HC27
Description 256Kx36 & 512Kx18 Synchronous Pipelined SRAM

File Size 247.30K  /  13 Page

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Amphenol Communications Solutions

Part No. RJLSE4018101
Description Modular Jack - Right Angle, Input Output Connectors 6P6C, SMT, Shield, Without LEDs.
Tech specs    

Official Product Page

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