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Ablestik ETC[ETC]
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| Part No. |
2815A
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| OCR Text |
...ity @ RT
Test Description 10 x 10 mm Si die on glass slide
30 min ramp RT to 200C + 30 min @ 200C in N2 oven ABLEBOND 2815A < 10 ppm <...cube which retains its shape at -40C. If the ABLECUBE is exposed to temperatures higher than -40C, t... |
| Description |
THERMALLY CONDUCTIVE DIE ATTACH ADHESIVE
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| File Size |
317.05K /
3 Page |
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Vishay Intertechnology,Inc. VISAY[Vishay Siliconix]
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| Part No. |
AN817
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| OCR Text |
...PLOSS = (VBAT(max) - VBAT(min)) x IOUT
with 60C as the benchmark. Therefore, to optimize the power dissipation to the smallest MOSFET package the following thermal equation can be used:
PD = (TJ(max) - Tamb)/RthJA
Where:
PD = 0.79 W... |
| Description |
A Discrete Approach to Battery Charging for Cellular Phones
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| File Size |
37.07K /
5 Page |
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it Online |
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Atmel Corp. ATMEL[ATMEL Corporation]
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| Part No. |
AT61162E-PM40MMN AT61162E AT61162E-PM40M-E
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| OCR Text |
x 8 bits Single 3.3V Power Supply Stacks of 16 SRAM 128K x 865609E Die Access Time: 40 ns Very Low Power Consumption - Active: 100 mW (Typ) ...cube technology, and it is assembled and tested by 3D+, using Atmel 65609E 1-Mbit SRAM die: it is bu... |
| Description |
Rad Hard 2-Mbit x 8 SRAM Cube
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| File Size |
580.06K /
14 Page |
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DYNEX[Dynex Semiconductor]
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| Part No. |
DCR1003SF
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| OCR Text |
...e = 125oC VR = 0 Max. 21.0 2.21 x 106 26.25 3.44 x 106 Units kA A2s kA A2s
THERMAL AND MECHANICAL DATA
Symbol Parameter Conditions Doubl...cube clamps for single side cooling of `T' 22mm Clamps are available for single or double side cooli... |
| Description |
Phase Control Thyristor
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| File Size |
114.83K /
8 Page |
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it Online |
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Price and Availability
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