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For unsawn Found Datasheets File :: 292 Search Time::1.015ms
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				ST Microelectronics STMicroelectronics
Part No.	ST16SF42
OCR Text	...SF42 can be delivered either in unsawn or sawn wafers, 180 or 275 micron thickness as well as in micromodule package. Figure 1. Block Diagram V GENERATION PP RAM 8 BIT 384 SYSTEM ROM 1.5 KBtyte ROM 1615 KBytes CPU BYTE...
Description	Smartcard MCU With 2048 Bytes EEPROM
File Size	27.06K / 2 Page	View it Online	Download Datasheet

				STMicroelectronics
Part No.	ST16SF44
OCR Text	...SF44 can be delivered either in unsawn or sawn wafers, 180 or 275 micron thickness as well as in micromodule package. Figure 1. Block Diagram V GENERATION PP RAM 8 BIT 384 SYSTEM ROM 1.5 KBtyte ROM 1615 KBytes CPU BYTE...
Description	Smartcard MCU With 4096 Bytes EEPROM
File Size	27.20K / 2 Page	View it Online	Download Datasheet

				STMicroelectronics
Part No.	ST16SF4F
OCR Text	...SF4F can be delivered either in unsawn or sawn wafers, 180 or 275 micron thickness as well as in micromodule package. Figure 1. Block Diagram V GENERATION PP RAM 8 BIT 384 SYSTEM ROM 1.5 KBtyte ROM 1615 KBytes CPU BYTE...
Description	Smartcard MCU With 16352 Bytes EEPROM
File Size	27.13K / 2 Page	View it Online	Download Datasheet

				STMicroelectronics
Part No.	ST16ST2G
OCR Text	...ST2G can be delivered either in unsawn or sawn wafers, 180 or 275 micron thickness as well as in micromodule package. For ordering information and request for quotation (RTQ) please contact your nearest ST sales office. Figure 1. Block D...
Description	Smartcard MCU With up to 16352 Bytes EEPROM & T2G Authentication Library
File Size	28.23K / 2 Page	View it Online	Download Datasheet

				INFINEON[Infineon Technologies AG]
Part No.	Q67041-S2856-A001 Q67041-S2856-A002 SIGC18T60SNC SGP20N60
OCR Text	...4.3 mm2 Package sawn on foil unsawn Ordering Code Q67041-S2856A001 Q67041-S2856A002 MECHANICAL PARAMETER: Raster size Area total / active Emitter pad size Gate pad size Thickness Wafer size Flat position Max.possible chips per wafe...
Description	IGBTs - HV Chips - SIGC18T60SNC, 600V, 20A IGBT Chip in NPT-technology
File Size	63.85K / 4 Page	View it Online	Download Datasheet

				INFINEON[Infineon Technologies AG]
Part No.	C67078-A4675-A001 C67078-A4675-A002 SIGC42T120CL
OCR Text	....49 mm2 Package sawn on foil unsawn Ordering Code C67078-A4675A001 C67078-A4675A002 MECHANICAL PARAMETER: Raster size Emitter pad size Gate pad size Area total / active Thickness Wafer size Flat position Max.possible chips per wafe...
Description	IGBT Chip in NPT-technology
File Size	64.33K / 4 Page	View it Online	Download Datasheet

				SGS Thomson Microelectronics STMicroelectronics ST Microelectronics
Part No.	STV7697A STV7697AWAF STV7697WAF
OCR Text	...DER CODE: STV7697A/WAF (1) (1): unsawn Tested Wafer Version 4.2 June 2000 This is preliminary information on a new product in development or undergoing evaluation. Details are subject to change without notice. 1/15 1 TABLE OF ...
Description	PLASMA DISPLAY PANEL SCAN DRIVER
File Size	109.12K / 15 Page	View it Online	Download Datasheet

				AMD[Advanced Micro Devices]
Part No.	AM29F200B01 AM29F200BT-90DWI1 AM29F200B AM29F200BB-120DG1 AM29F200BB-120DGC1 AM29F200BB-120DGE1 AM29F200BB-120DGI1 AM29F200BB-120DP1 AM29F200BB-120DPC1 AM29F200BB-120DPE1 AM29F200BB-120DPI1 AM29F200BB-120DT1 AM29F200BB-120DTC1 AM29F200BB-120DTE1 AM29F200BB-120DTI1 AM29F200BB-120DW1 AM29F200BB-120DWC1 AM29F200BB-120DWE1 AM29F200BB-120DWI1 AM29F200BB-75DG1 AM29F200BB-75DGE1 AM29F200BB-75DGI1 AM29F200BB-75DP1 AM29F200BB-75DPC1 AM29F200BB-75DPE1 AM29F200BB-75DPI1 AM29F200BB-75DT1 AM29F200BB-75DTC1 AM29F200BB-75DTE1 AM29F200BB-75DTI1 AM29F200BB-75DW1 AM29F200BB-75DWC1 AM29F200BB-75DWE1 AM29F200BB-75DWI1 AM29F200BB-90DG1 AM29F200BB-90DGC1 AM29F200BB-90DGE1 AM29F200BB-90DGI1 AM29F200BB-90DP1 AM29F200BB-90DPC1 AM29F200BB-90DPE1 AM29F200BB-90DPI1 AM29F200BB-90DT1 AM29F200BB-90DTC1 AM29F200BB-90DTE1 AM29F200BB-90DTI1 AM29F200BB-90DW1 AM29F200BB-90DWC1 AM29F200BB-90DWE1 AM29F200BB-90DWI1 AM29F200BKGD AM29F200BT-120DG1 AM29F200BT-120DGC1 AM29F200BT-120DGE1 AM29F200BT-120DGI1 AM29F200BT-120DP1 AM29F200BT-120DPC1 AM29F200BT-120DPE1 AM29F200BT-120DPI1 AM29F200BT-120DT1 AM29F200BT-120DTC1 AM29F200BT-120DTE1 AM29F200BT-120DTI1 AM29F200BT-120DW1 AM29F200BT-120DWC1 AM29F200BT-120DWE1 AM29F200BT-120DW
OCR Text	...d in waffle pack, surftape, and unsawn wafer 500 m die/wafer thickness Publication# 21257 Rev: D Amendment/+4 Issue Date: June 27, 2001 SUPPLEMENT GENERAL DESCRIPTION The Am29F200B in Known Good Die (KGD) form is a 2 Mbit, 5.0 Vo...
Description	2 Megabit (256 K x 8-Bit/128 K x 16-Bit) CMOS 5.0 Volt-only, Sectored Flash Memory-Die Revision 1
File Size	429.61K / 11 Page	View it Online	Download Datasheet

				EMMICRO[EM Microelectronic - MARIN SA]
Part No.	EMTCG128-3G
OCR Text	...les Chip Forms 8" Wafer sawn or unsawn Back grinding and distressing options 180 microns max thickness Modules EMTCG128-3G is Software Compatibility with EMTG256-3G Emulation and Debug Development tools fully integrated within Keil uVisi...
Description	128KB Flash Smart Card IC Cryptography Engine
File Size	178.76K / 3 Page	View it Online	Download Datasheet

				EMMICRO[EM Microelectronic - MARIN SA]
Part No.	EMTCG176-3G
OCR Text	...les Chip Forms 8" Wafer sawn or unsawn Back grinding and distressing options 180 microns max thickness Modules EMTCG176-3G is Software Compatibility with EMTG256-3G Emulation and Debug Development tools fully integrated within Keil uVisi...
Description	176KB Flash Smart Card IC Cryptography Engine
File Size	60.50K / 3 Page	View it Online	Download Datasheet

For unsawn Found Datasheets File :: 292 Search Time::1.015ms
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