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Amphenol Communications Solutions |
| Part No. |
47744-000LF
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| Description |
PV® Wire-to-Board Connector System, 2.54mm (0.1inch) Centerline Crimp-to-Wire Receptacle.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
47714-000LF
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| Description |
PV® Wire-to-Board Connector System, 2.54mm (0.1inch) Centerline Crimp-to-Wire Receptacle.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
48234-000LF
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| Description |
PV® Wire-to-Board Connector System, 2.54mm (0.1inch) Centerline Crimp-to-Wire Receptacle.
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| Tech specs |
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Official Product Page
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L-com, Inc.
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| Part No. |
PUMA2S4000L-55 PUMA2S4000I-45 PUMA2S4000M-55 PUMA2S4000M-45 PUMA2S4000-55 PUMA2S4000MB-45
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| Description |
10MHZ, 8 DIP, IND TEMP(FPGA)
10MHZ, 20 SOIC, 5K MOQ(FPGA)
30MHZ, 3.3V, 44 PLCC, COM TEMP(FPGA)
10MHZ, 8 SOIC, IND TEMP, 5K MOQ(FPGA) X32号的SRAM模块
10MHZ, 20 PLCC, COM TEMP(FPGA) X32号的SRAM模块
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| File Size |
301.04K /
8 Page |
 View
it Online |
Download Datasheet
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Amphenol Communications Solutions |
| Part No. |
47564-000LF
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| Description |
PV® Wire-to-Board Connector System, 2.54mm (0.1inch) Centerline Crimp-to-Wire Receptacle.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
54112-127204000LF
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| Description |
BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 20 Positions, 2.54mm (0.100in) Pitch.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
48244-000LF
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| Description |
PV® Wire-to-Board Connector System, 2.54mm (0.1inch) Centerline Crimp-to-Wire Receptacle.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
48254-000LF
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| Description |
PV® Wire-to-Board Connector System, 2.54mm (0.1inch) Centerline Crimp-to-Wire Receptacle.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
10127403-01H4000LF
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| Description |
PwrBlade® ULTRA Connector System, Power Connectors, Receptacle, 2HP+12S, Vertical, Through Hole.
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| Tech specs |
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Official Product Page
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| Part No. |
PUMA68S4000LM-020 PUMA68S4000LM-025 PUMA68S4000LM-35 PUMA68S4000LI-35 PUMA68S4000L-020
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| Description |
24MHZ, TQFP, IND TEMP, GREEN(MCU 5X)
24MHZ, PLCC, IND TEMP(MCU 5X)
24MHZ, PDIP, COM TEMP(MCU 5X)
8051 MCU, 4K FLASH, 24MHZ, PDIP, IND GRN(MCU 5X)
x32 SRAM Module X32号的SRAM模块
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| File Size |
834.90K /
8 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
54122-127104000LF
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| Description |
BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 10 position, 2.54mm (0.100in) pitch
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| Tech specs |
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Official Product Page
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| Part No. |
PUMA2S4000LM-12 PUMA2S4000LI-70 PUMA2S4000LM-10 PUMA2S4000LM-85 PUMA2S4000LI-85 PUMA2S4000I-70 PUMA2S4000I-10 PUMA2S4000I-12 PUMA2S4000M-85 PUMA2S4000-12 PUMA2S4000-85 PUMA2S4000L-12 PUMA2S4000LI-12
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| Description |
10MHZ, 8 LAP, COM TEMP(FPGA)
10 MHZ, 3.3V, 44 PLCC, COM TEMP(FPGA)
10MHZ, 8 LAP, COM TEMP, 5K MOQ(FPGA)
10 MHZ, 20 SOIC, IND TEMP(FPGA)
10MHZ, 20 SOIC, IND TEMP(FPGA)
x32 SRAM Module
10MHZ, 8 PDIP, IND TEMP(FPGA)
256K CONFIG MEM, 20 PLCC, IND(FPGA)
DIE WAFER(FPGA)
10 MHZ, 3.3V, 44 TQFP, COM TEMP(FPGA)
30MHZ, 3.3V, 44 TQFP, COM TEMP(FPGA)
10MHZ, 20 SOIC, COM TEMP(FPGA)
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| File Size |
375.03K /
8 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
10142708-04000LF
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| Description |
Minitek®Pwr 5.7, Vertical Through Hole Header, Dual Row, Black Color, 4 Positions, 30u\\ Gold (100u\\ Tin on Tails) plating, GW Compatible LCP, With Pegs, Tray.
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| Tech specs |
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Official Product Page
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Bom2Buy.com
Price and Availability
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