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solderless Datasheet PDF File

For solderless Found Datasheets File :: 317 Search Time::0.828ms
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				Semikron International
Part No.	SKIM909GD066HD11
OCR Text	...igbt 3 trench gate technology ? solderless sinter technology ?v ce(sat) with positive temperature coefficient ? low inductance case ? isolated by al 2 o 3 dcb (direct copper bonded) ceramic substrate ? pressure contact technology for t...
Description	Trench IGBT Modules
File Size	309.39K / 5 Page	View it Online	Download Datasheet

				Semikron International
Part No.	SKIM429GD17E4HD11
OCR Text	...igbt 4 trench gate technology ? solderless sinter technology ? low inductance case ? isolated by al 2 o 3 dcb (direct copper bonded) ceramic substrate ? pressure contact technology for thermal contacts and electrical contacts ? high sho...
Description	Trench IGBT Modules
File Size	375.11K / 5 Page	View it Online	Download Datasheet

				MolexKits
Part No.	19037-0004 64001-1400 19038-0007 19039-0007 19033-0007 19038-0035 64003-1200 19035-0009 64001-0100 76650-0155 19034-0009 64001-2100
OCR Text	...y: Certificates: Molex / Waldom solderless Terminal Kit PVC and Nylon Insulated Bullet Snap Plug and Receptacle, and Insulated Double Bullet Snap Coupler and Non-Insulated Bullet Snap Plug and Receptacle Snap Bullet (Molex Parts within this...
Description	PVC and Nylon Insulated Bullet Snap Plug and Receptacle, and Insulated Double Bullet Snap Coupler and Non-Insulated Bullet Snap Plug and Receptacle
File Size	30.02K / 2 Page	View it Online	Download Datasheet

				Semikron International
Part No.	SKIM406GD066HD11
OCR Text	...igbt 3 trench gate technology ? solderless sinter technology ?v ce(sat) with positive temperature coefficient ? low inductance case ? isolated by al 2 o 3 dcb (direct copper bonded) ceramic substrate ? pressure contact technology for t...
Description	Trench IGBT Modules
File Size	289.89K / 5 Page	View it Online	Download Datasheet

				Agilent(Hewlett-Packard) 飞思卡尔半导体(中国)有限公司
Part No.	HPWT-FL00 HPWT-FH00
OCR Text	...rmal resistance ? low profile ? solderless mounting technique ? mounted on formable substrate ? meets sae/ece/jis automotive color requirements applications ? automotive lighting C rear combination lamps C front turn signal lamps C high ...
Description	SnapLED 70 LEDs(用于大电流的高光通量LED) SnapLED 70LED（用于大电流的高光通量发光二极管）
File Size	128.62K / 4 Page	View it Online	Download Datasheet

				ITT CANNON
Part No.	055-604-9172310
OCR Text	...i-507 (page 123) straight plug, solderless version, without center contact* part number cable number 055-624-6703890 rg402/u * center conductor of cable is used as contact. assembly instruction ai-521 (page 123) straight plug, solderless ve...
Description	PANEL MOUNT, CABLE TERMINATED, FEMALE, SMA CONNECTOR, SOLDER, JACK
File Size	35.13K / 1 Page	View it Online	Download Datasheet

				J S T MFG CO LTD
Part No.	VC-1.25
OCR Text	...oo oo oo o o o o bct-0514 o o o solderless splices butt l certificate no.: e42024 lr20812 vc fvc nc fnc vinyl nylon note :1 ) delivery lead times may vary depending on the product. contact jst for details. ?d ? d 1 ...
Description	1.65 mm2, WIRE TERMINAL
File Size	146.20K / 2 Page	View it Online	Download Datasheet

				AGILENT TECHNOLOGIES INC
Part No.	HPWS-TH00N4000
OCR Text	...rmal resistance ? low profile ? solderless mounting technique ? mounted on formable substrate ? meets sae/ece/jis automotive color requirements applications ? automotive lighting C rear combination lamps C front turn signal lamps C high ...
Description	SINGLE COLOR LED, RED-ORANGE, 5 mm
File Size	129.68K / 4 Page	View it Online	Download Datasheet

				List of Unclassifed Manufacturers List of Unclassifed Manufac... List of Unclassifed Man...
Part No.	6010 6011 6023 6024 6022 6025 6021 6020 6026 6009 6033 6007 6034
OCR Text	... with nut. solder tip plugs solderless tip plugs standard phone tip .080 (2.0) diameter tip designed for miniaturization where space is criti- cal. solder lead connection. maximum reliability with minimum contact re...
Description	PLUGS AND JACKS
File Size	367.14K / 1 Page	View it Online	Download Datasheet

				Semikron International
Part No.	SKIM306GD12E4
OCR Text	...IGBT 4 Trench Gate Technology * solderless sinter technology * VCE(sat) with positive temperature coefficient * Low inductance case * Isolated by Al2O3 DCB (Direct Copper Bonded) ceramic substrate * Pressure contact technology forthermal co...
Description	Trench IGBT Modules
File Size	172.83K / 5 Page	View it Online	Download Datasheet

For solderless Found Datasheets File :: 317 Search Time::0.828ms
Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | <10> | 11 | 12 | 13 | 14 | 15 |