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For reflow Found Datasheets File :: 44777    Search Time::1.719ms    
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    74AHCT1G86 74AHCT1G86GW 74AHC1G86 74AHC1G86GW

Philips Semiconductors
Part No. 74AHCT1G86 74AHCT1G86GW 74AHC1G86 74AHC1G86GW
OCR Text ... densities. In these situations reflow soldering is often used. reflow soldering reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen pri...
Description 2-input EXCLUSIVE-OR gate

File Size 61.06K  /  12 Page

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    VISHAY SEMICONDUCTORS
Part No. TSOP35130 TSOP35330
OCR Text ...llimeters assembly instructions reflow soldering ? reflow soldering must be done within 72 h while stored under a max. temperature of 30 c, 60 % rh after opening the dry pack envelope ? set the furnace temperatures for pre-heating and heat...
Description LINEAR OUTPUT PHOTO DETECTOR

File Size 329.28K  /  12 Page

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    TriQuint Semiconductor,Inc.
Part No. TGA2925-SG
OCR Text ...chment. Follow solder paste and reflow oven vendors' recommendations when developing a solder reflow profile. Typical solder reflow profiles are listed in the table below. Hand soldering is not recommended. Solder paste can be applied using...
Description 5.6 Watt 3.5GHz Packaged HPA

File Size 269.24K  /  10 Page

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    AT5608

List of Unclassifed Manufacturers
ETC
Part No. AT5608
OCR Text ... Bi-directional Motor Driver reflow Condition (IR/Convection or VPR reflow) Reference JEDEC Standard J-STD-020A Classification reflow Profiles Convection or IR/Convction Average Heating Rate(180C to peak) Preheat Temperature(12520C)...
Description Bi-directional Motor Driver

File Size 203.38K  /  7 Page

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    TriQuint Semiconductor, Inc.
Part No. CV110-1AF
OCR Text ...h both lead-free (maximum 260 C reflow temperature) and leaded (maximum 245 C reflow temperature) soldering processes. Outline Drawing Product Marking The component will be lasermarked with a "CV110-1AF" product label with an alphanu...
Description
File Size 409.38K  /  5 Page

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    Electronic Theatre Controls, Inc.
Part No. B1117T-X B1117T-2.85 B1117T-2.5 B1117S-1.5 B1117D-1.5 B1117D-1.8 B1117M-1.8 B1117N-1.8 B1117N-3.3 B1117N-2.5 B1117S-3.3 117M-3.3 B1117S-X
OCR Text ... to be compatible with infrared reflow or vapor-phase reflow soldering techniques. During soldering the non-active or mildly active fluxes may be used. The B1117 die is attached to the heat sink lead which exits opposite the input, output, ...
Description 1.0Amp Low Dropout Voltage Regulator 1.0Amp低压差稳压器

File Size 343.80K  /  7 Page

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    67-21SUBC 67-21SUBC09

A-BRIGHT Inc
Part No. 67-21SUBC 67-21SUBC09
OCR Text ...age outlines & Re-flow Profile reflow Temp/Time Soldering iron Basic spec is 5sec when 260. If temperature is higher, time should be shorter (+10 -1sec ).Power dissipation of iron should be smaller than 15W, and temperatures should be c...
Description SURFACE MOUNT CHIP LED LAMPS

File Size 273.79K  /  5 Page

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    57-11UTC-S827-1-TR8

Everlight Electronics Co., Ltd
Part No. 57-11UTC-S827-1-TR8
OCR Text ...00 110 2000 -40 ~ +85 -40 ~ +90 reflow Soldering : 260 Hand Soldering : 350 for 10 sec. for 3 sec. Unit V mA mA mW V Soldering Temperature Tsol Electro-Optical Characteristics (Ta=25 Parameter Luminous Intensity Viewing Angle Forw...
Description Side View White SMD LEDs

File Size 212.92K  /  11 Page

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    Mimix Broadband, Inc.
Part No. XD1005-QT-EV1 XD1005-QT-0G00 MIMIXBROADBANDINC.-XD1005-QT-EV1
OCR Text ...oduct due to thermal stress. reflow Profile Ramp Up Rate Activation Time and Temperature Time Above Melting Point Max Peak Temperature Time Within 5 C of Peak Ramp Down Rate SnPb 3-4 C/sec 60-120 sec @ 140-160 C 60-150 sec 240 C 10-20...
Description 10.0-40.0 GHz GaAs MMIC Distributed Amplifier, QFN 10000 MHz - 40000 MHz RF/MICROWAVE WIDE BAND HIGH POWER AMPLIFIER
10.0-40.0 GHz GaAs MMIC Distributed Amplifier, QFN 10.0-40.0千兆赫的GaAs MMIC分布式放大器QFN封装

File Size 194.27K  /  5 Page

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    TOSHIBA
Part No. TPCL4202
OCR Text ... onto a pc board with up to two reflow passes at the recommended reflow conditions. the second reflow process should be performed within two weeks after the first reflow process. 9.1. 9.1. 9.1. 9.1. using infrared reflow using infrared ...
Description Power MOSFET (N-ch dual)

File Size 392.58K  /  12 Page

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