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  KMF1.1163.11 Datasheet PDF File

For KMF1.1163.11 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | <10> | 11 | 12 | 13 | 14 | 15 |   

    Samsung Electronics Inc
Part No. K4H511638D
Description IC,SDRAM,DDR,4X8MX16,CMOS,TSSOP,66PIN,PLASTIC
File Size 53.66K  /  12 Page

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Amphenol Communications Solutions
Part No. 54122-116322000LF
Description BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 32 position, 2.54mm (0.100in) pitch
Tech specs 　 　

Official Product Page

HUA FENG CIRCUIT





    0638116300

Molex Electronics Ltd.
Part No. 0638116300
Description Hand Crimp Tool Specification Sheet
File Size 202.79K  /  5 Page

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Amphenol Communications Solutions
Part No. 10145891-1631J13LF
Description DDR4 DIMM, Storage and Server Connector, Vertical, Surface Mount, 288 Position, 0.85mm (0.033in) Pitch
Tech specs 　 　

Official Product Page

    K4X51163PE-L

Samsung semiconductor
Part No. K4X51163PE-L
Description 32Mx16 Mobile DDR SDRAM
File Size 307.93K  /  20 Page

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Amphenol Communications Solutions
Part No. 10106116-3006001LF
Description PwrBlade+® , Power Connectors, 3ACP+24S STB, Right Angle, Header.
Tech specs 　 　

Official Product Page

    90663-1163 0906631163

Molex Electronics Ltd.
Part No. 90663-1163 0906631163
Description 2.54mm (.100") Pitch QF-50 Vertical, MIL Keying with Latch/Eject Levers, Shrouded Header, 16 Circuits
2.54mm (.100) Pitch QF-50 Vertical, MIL Keying with Latch/Eject Levers, Shrouded Header, 16 Circuits
File Size 184.28K  /  4 Page

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Amphenol Communications Solutions
Part No. 54112-116342000LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 34 Positions, 2.54mm (0.100in) Pitch.
Tech specs 　 　

Official Product Page

    90635-1163 0906351163

Molex Electronics Ltd.
Part No. 90635-1163 0906351163
Description 1.27mm (.050) Pitch QF-50, Single Beam, Vertical MIL/DIN Version, 0.38μm (15u) Gold (Au)
File Size 219.16K  /  4 Page

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Amphenol Communications Solutions
Part No. 54122-116302000RLF
Description BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 30 position, 2.54mm (0.100in) pitch
Tech specs 　 　

Official Product Page

    51163-0500 0511630500

Molex Electronics Ltd.
Part No. 51163-0500 0511630500
Description 2.50mm (.098) Pitch Wire-to-Board Receptacle Housing, Positive Lock, With Retainer,5 Circuits
2.50mm (.098") Pitch Wire-to-Board Receptacle Housing, Positive Lock, With Retainer,5 Circuits
File Size 280.27K  /  5 Page

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Amphenol Communications Solutions
Part No. GSB3116346FHR
Description USB 3.2, Type A, Receptacle, Upright Reverse, 9 Pins, Shell Kink with Nickel Plating, 30u\\ Gold, Dip 4.4mm, Blue High Temperature Housing, Tray Packaging
Tech specs 　 　

Official Product Page

    87831-1635 0878311635

Molex Electronics Ltd.
Part No. 87831-1635 0878311635
Description 2.00mm (.079) Pitch Milli-Grid Header, Vertical, Through Hole, Shrouded, Lead-free, 16 Circuits, 0.76μm (15μ) Gold (Au) Plating, PCB Locator, Center Polarization Slot
File Size 134.93K  /  3 Page

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Amphenol Communications Solutions
Part No. RJE7B1881163
Description Modular Jack - High Performance, Input Output Connectors 8P8C, CAT 6A, RA, Shield, with LEDs.
Tech specs 　 　

Official Product Page

    K4H511638F

Samsung semiconductor
Part No. K4H511638F
Description 512Mb F-die DDR SDRAM Specification
File Size 397.07K  /  24 Page

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Amphenol Communications Solutions
Part No. GSB4116343HR
Description USB 3.2 GEN2, Type A, Upright Reverse, 9 Pins, Shell Kink with Nickel Plating, 30u\\ Gold, Dip 2.8mm, Blue High Temperature Housing, Tray Packaging
Tech specs 　 　

Official Product Page

    87831-1631 0878311631

Molex Electronics Ltd.
Part No. 87831-1631 0878311631
Description 2.00mm (.079) Pitch Milli-Grid Header, Vertical, Shrouded, Lead-free, 16 Circuits, 0.38μm (15μ) Gold (Au) Plating, Center Polarization Slot, with Locking Windows
File Size 151.01K  /  3 Page

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Amphenol Communications Solutions
Part No. GSB4116344HR
Description USB 3.2 GEN2, Type A, Upright Reverse, 9 Pins, Shell Kink with Nickel Plating, 30u\\ Gold, Dip 3.1mm, Blue High Temperature Housing, Tray Packaging
Tech specs 　 　

Official Product Page

    K4H511638G

Samsung semiconductor
Part No. K4H511638G
Description 512Mb G-die DDR SDRAM Specification
File Size 394.04K  /  24 Page

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Amphenol Communications Solutions
Part No. RJE714881163
Description Modular Jacks, Input Output Connectors, 8P8C, With Shield, With LEDs.
Tech specs 　 　

Official Product Page

For KMF1.1163.11 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | <10> | 11 | 12 | 13 | 14 | 15 |   

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