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heating cooling Datasheet PDF File

For heating cooling Found Datasheets File :: 2883 Search Time::0.609ms
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				MOTOROLA INC Motorola, Inc. MOTOROLA[Motorola, Inc]
Part No.	MMQA MMQA18VT1
OCR Text	...data sheet. When using infrared heating with the reflow soldering method, the difference should be a maximum of 10C. * Soldering a device wi...cooling should be used since the use of forced cooling will increase the temperature gradient and wi...
Description	150 W, UNIDIRECTIONAL, 4 ELEMENT, SILICON, TVS DIODE SC-59 Quad Monolithic Common Anode
File Size	102.36K / 8 Page	View it Online	Download Datasheet

				Wurth Elektronik GmbH & Co. KG, Germany.
Part No.	82357240030
OCR Text	...ase kunde / customer : rapid heating, partial heating or rapid cooling wil l easily cause defect of the component. so preheati ng and gradual cooling process is suggested. ir soldering has the highest yields due to controlled heating r...
Description	0402 ESD Suppressor LC
File Size	346.82K / 4 Page	View it Online	Download Datasheet

				ON Semiconductor
Part No.	DA121TT1 DA121TT1/D
OCR Text	...data sheet. When using infrared heating with the reflow soldering method, the difference should be a maximum of 10C. * The soldering tempera...cooling should be used as the use of forced cooling will increase the temperature gradient and resul...
Description	Silicon Switching Diode
File Size	124.23K / 8 Page	View it Online	Download Datasheet

				ON Semiconductor MOTOROLA[Motorola, Inc]
Part No.	DTA143EE DTA143EE_D ON0279
OCR Text	...data sheet. When using infrared heating with the reflow soldering method, the difference should be a maximum of 10C. * The soldering temp...cooling should be used as the use of forced cooling will increase the temperature gradient and resul...
Description	Bias Resistor Transistor CASE 463-01, STYLE 1 SOT-416/SC-90 CASE 463-1, STYLE 1 SOT-16/SC-0 From old datasheet system
File Size	93.71K / 4 Page	View it Online	Download Datasheet

				Wurth Elektronik GmbH & Co. KG, Germany.
Part No.	82357240010
OCR Text	...ase kunde / customer : rapid heating, partial heating or rapid cooling wil l easily cause defect of the component. so preheati ng and gradual cooling process is suggested. ir soldering has the highest yields due to controlled heating r...
Description	0402 ESD Suppressor LC
File Size	346.82K / 4 Page	View it Online	Download Datasheet

				Wurth Elektronik GmbH & Co. KG, Germany.
Part No.	82357120100
OCR Text	...ase kunde / customer : rapid heating, partial heating or rapid cooling wil l easily cause defect of the component. so preheati ng and gradual cooling process is suggested. ir soldering has the highest yields due to controlled heating r...
Description	0402 ESD Suppressor
File Size	346.72K / 4 Page	View it Online	Download Datasheet

				ONSEMI[ON Semiconductor]
Part No.	MMFT960T1
OCR Text	...data sheet. When using infrared heating with the reflow soldering method, the difference should be a maximum of 10C. 80 0.0 Figure...cooling should be used as the use of forced cooling will increase the temperature gradient and resul...
Description	Power MOSFET 300 mA, 60 Volts
File Size	78.46K / 8 Page	View it Online	Download Datasheet

				Agilent (Hewlett-Packard) HP[Agilent(Hewlett-Packard)]
Part No.	LSC2110-622-ST LSC2110-622 LSC2110-622-BI LSC2110-622-DN LSC2110-622-FP LSC2110-622-SA LSC2110-622-SC LSC2110-622-SF
OCR Text	...ns Tc = -40C to +85C, T = +65C (heating) T = -40C (cooling), CW, Pf = 2.5 mW unless otherwise stated Min. Max. Units Threshold Current Peak Optical Output Power Optical Output Power Slope Efficiency Forward Voltage Differential Resistanc...
Description	2.5 mW 14 Pin DIL Cooled Laser Module
File Size	106.48K / 6 Page	View it Online	Download Datasheet

				Seoul Semicondutctor Inc. SEOUL[Seoul Semiconductor]
Part No.	HBTGFR421-S
OCR Text	... (1) Lead Solder -Preliminary heating to be at 150max. for 2 minutes max. -Soldering heat to be at 240max. for 5 seconds max. LED Surface...cooling: -5C/sec. 120 0 60 to 120 sec. 5sec. max (2) Lead-Free Solder -Preliminary heating ...
Description	CHIP LED DEVICE
File Size	428.71K / 7 Page	View it Online	Download Datasheet

				Fujitsu Limited Fujitsu Microelectronics FUJITSU[Fujitsu Media Devices Limited] Fujitsu Component Limited.
Part No.	FTR-B2NA4.5Z FTR-B2 FTR-B2MA012Z FTR-B2MA4.5Z FTR-B2NA012Z
OCR Text	...d, status of parts mounting and heating method. T 16 30 sec Max. 0 60 sec Max. 60 sec Max. 90 sec Max. FO 2 4 s PACKAGIN...cooling 170 130 D Soldering Iron Temperature: maximum 360C Duration: maximum 3 sec. 90~1...
Description	4 POLE (2 FORM C 2 FORM A) SIGNAL RELAY FOR CENTRAL SWITCHING/ DATA TRANSMISSION
File Size	144.59K / 8 Page	View it Online	Download Datasheet

For heating cooling Found Datasheets File :: 2883 Search Time::0.609ms
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