crack pdf Datasheet P10 Full Text Search --- IC-ON-LINE


	Part Number	Hot Search : 53100 ON1750 CCLM2000 47382 NCP12 TISP3082 SM160307 KE220
	Product Description
	Full Text Search

crack Datasheet PDF File

For crack Found Datasheets File :: 595 Search Time::1.219ms
Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | <10> | 11 | 12 | 13 | 14 | 15 |

				N.A.
Part No.	NFV10D391K
OCR Text	...ark, Date code Without dirt and crack, marking should be clear D(max.) k(max.) T(max.) F 12.5 5.0 DESCRIPTION (1) 7.5 1.0 0.8 0.1 75 25.0 3.5 Dimensions d (max.) L(min.) Unit: mm (1) See Page 3, Dimensions Table TY...
Description	Varistor.
File Size	65.25K / 6 Page	View it Online	Download Datasheet

				Toshiba Semiconductor
Part No.	TLP1243
OCR Text	...ay cause the package to melt or crack. When attaching the device to the metal board, always hold the body of the device. Do not hold it by the connector. Ensure that the board is flat, and not warped or twisted. Attach the device to a metal...
Description
File Size	226.92K / 9 Page	View it Online	Download Datasheet

				Agilent(Hewlett-Packard... HP[Agilent(Hewlett-Packard)] Agilent (Hewlett-Packard)
Part No.	HBCR-1611 HBCR-1610 HBCR-1612 HBCR-1697
OCR Text	...tures, may cause the package to crack from internal stresses. There is a reliability concern that moisture may then enter the package over a period of time, and metal corrosion may take place, degrading the IC performance. To reduce the ...
Description	Single Chip Bar Code Decode IC
File Size	189.41K / 10 Page	View it Online	Download Datasheet

				FAIRCHILD[Fairchild Semiconductor]
Part No.	RMPA1850
OCR Text	...iner grain structure and a more crack-resistant solder joint. The illustration below indicates the recommended soldering profile. * Solder Joint Characteristics: Proper operation of this device depends on a reliable void-free attachment of ...
Description	Quad Band GSM/GPRS Power Amplifier Module
File Size	116.02K / 9 Page	View it Online	Download Datasheet

				Mitsubishi Electric, Corp. MITSUBISHI[Mitsubishi Electric Semiconductor] Mitsubishi Electric Corporation
Part No.	RA07M3340M RA07M3340M-E01 RA07M3340M-01
OCR Text	...amic substrate in the module to crack by bending forces, either immediately when driving screws or later when thermal expansion forces are added). A thermal compound between module and heat sink is recommended for low thermal contact resist...
Description	MITSUBISHI RF MOSFET MODULE 三菱射频MOSFET模块
File Size	66.40K / 9 Page	View it Online	Download Datasheet

				Mitsubishi Electric Semiconductor
Part No.	RA07M3843M RA07M3843M-101
OCR Text	...amic substrate in the module to crack by bending forces, either immediately when driving screws or later when thermal expansion forces are added). A thermal compound between module and heat sink is recommended for low thermal contact resist...
Description	ROHS COMPLIANCE , 378-430MHZ 7W 7.2V, 2STAGE AMP. FOR PORTABLE RADIO
File Size	94.61K / 8 Page	View it Online	Download Datasheet

				http:// Mitsubishi Electric Semiconductor
Part No.	RA45H4045MR RA45H4045MR-101
OCR Text	...amic substrate in the module to crack by bending forces, either immediately when screwing or later when thermal expansion forces are added). Thermal compound between module and heat sink is recommended for low thermal contact resistance and...
Description	400-450MHZ 45W 12.5V, 3 STAGE AMP. FOR MOBILE RADIO
File Size	93.42K / 8 Page	View it Online	Download Datasheet

				MITSUBISHI[Mitsubishi Electric Semiconductor]
Part No.	RA45H4452M-01 RA45H4452M-E01 RA45H4452M
OCR Text	...amic substrate in the module to crack by bending forces, either immediately when driving screws or later when thermal expansion forces are added). A thermal compound between module and heat sink is recommended for low thermal contact resist...
Description	440-520MHZ 45W 12.5V MOBILE RADIO
File Size	91.37K / 9 Page	View it Online	Download Datasheet

				AUO ETC List of Unclassifed Manufacturers
Part No.	M150XN07 M150XN07V1
OCR Text	... made of glass, it may break or crack if dropped or bumped on hard surface. Since CMOS LSI is used in this module, take care of static electricity and insure human earth when handling. Do not open nor modify the Module Assembly. Do not pres...
Description	15.0” XGA COLOR TFT-LCD MODULE 15.0 XGA Color TFT-LCD Module
File Size	238.80K / 26 Page	View it Online	Download Datasheet

				MITSUBISHI[Mitsubishi Electric Semiconductor]
Part No.	RA13H3340M RA13H3340M-E01 RA13H3340M-01
OCR Text	...amic substrate in the module to crack by bending forces, either immediately when driving screws or later when thermal expansion forces are added). A thermal compound between module and heat sink is recommended for low thermal contact resist...
Description	330-400MHz 13W 12.5V MOBILE RADIO
File Size	64.34K / 9 Page	View it Online	Download Datasheet

For crack Found Datasheets File :: 595 Search Time::1.219ms
Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | <10> | 11 | 12 | 13 | 14 | 15 |