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bondpad Datasheet PDF File

For bondpad Found Datasheets File :: 130 Search Time::1.672ms
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				Maxim Integrated Products
Part No.	MAX1532ETL
OCR Text	...h: F. Minimum Metal Spacing: G. bondpad Dimensions: H. Isolation Dielectric: I. Die Separation Method: 130 x 172 mils Si3N4/SiO2 (Silicon nitride/ Silicon dioxide) Aluminum/Si (Si = 1%) None 1.2 microns (as drawn) 1.2 microns (as drawn) 5 m...
Description	PLASTIC ENCAPSULATED DEVICES
File Size	119.07K / 8 Page	View it Online	Download Datasheet

				Maxim Integrated Products
Part No.	MAX803SEXR
OCR Text	...h: F. Minimum Metal Spacing: G. bondpad Dimensions: H. Isolation Dielectric: I. Die Separation Method: 30 x 30 mils Si3N4/SiO2 (Silicon nitride/ Silicon dioxide) Aluminum/Si (Si = 1%) None 0.8 microns (as drawn) 0.8 microns (as drawn) 5 mil...
Description	PLASTIC ENCAPSULATED DEVICES
File Size	62.64K / 8 Page	View it Online	Download Datasheet

				NXP Semiconductors N.V. Philips Semiconductors
Part No.	HT2MOA3S20 HT2MOA3S20_E_1 HT2MOA3S20_E_3 HT2MOA3S20/E/3 HT2MOA3S20/E/1 HT2MOA2S20/E/3118
OCR Text	...verall Thickness Film Thickness bondpad Size for Transponder Coil / Module Interconnection 0.45 mm 0.03 mm 0.16 mm 0.005 mm 1.9 x 3.5 mm Suitable for Welding/Soldering/ Conductive Gluing see also drawing in chapter 3 2.2 Materials Tap...
Description	HITAGTM2 Chip Module
File Size	158.03K / 22 Page	View it Online	Download Datasheet

				OSRAM GmbH
Part No.	Q67220-C1268 F0094U F0094V
OCR Text	... bondpaddurchmesser Diameter of bondpad Symbol Symbol min. 0.28 0.28 Wert1) Value1) typ. 0.3 0.3 76.2 170 185 135 200 max. 0.32 0.32 mm mm mm m m Einheit Unit Lx Ly D H d Bezeichnung Parameter Vorderseitenmetallisierung Metallization...
Description	GaAs Infrared Light Emitting Diode (950 nm, 12 mil)
File Size	66.15K / 7 Page	View it Online	Download Datasheet

				Maxim Integrated Products
Part No.	MAX8796GTJ
OCR Text	...h: F. Minimum Metal Spacing: G. bondpad Dimensions: H. Isolation Dielectric: I. Die Separation Method: 77 X 73 mils Si3N4/SiO2 (Silicon nitride/ Silicon dioxide Aluminum/Si (Si = 1%) None Metal1 = 0.5 / Metal2 = 0.6 / Metal3 = 0.6 microns (...
Description	PLASTIC ENCAPSULATED DEVICES
File Size	28.58K / 5 Page	View it Online	Download Datasheet

				NXP Semiconductors N.V. Philips Semiconductors
Part No.	HT1MOA3S30/E/3 HT1MOA3S30/E/1 HT1MOA2S30/E/3118
OCR Text	...verall Thickness Film Thickness bondpad Size for Transponder Coil / Module Interconnection 0.45 mm 0.03 mm 0.16 mm 0.005 mm 1.9 x 3.5 mm Suitable for Welding/Soldering/ Conductive Gluing see also drawing in chapter 3 2.2 Materials Tap...
Description	HITAGTM1 Chip Module
File Size	153.60K / 24 Page	View it Online	Download Datasheet

				MAXIM - Dallas Semiconductor MAXIM[Maxim Integrated Products] Maxim Integrated Products, Inc.
Part No.	MAX6023EBT
OCR Text	...h: F. Minimum Metal Spacing: G. bondpad Dimensions: H. Isolation Dielectric: I. Die Separation Method: 63 x 43 mils SiN/SiO (nitride/oxide) Aluminum/Si (Si = 1%) None 1.2 microns (as drawn) 1.2 microns (as drawn) 5 mil. Sq. SiO2 Wafer Saw ...
Description	CHIP SCALE DEVICES 3.3-V ABT Octal Transparent D-type Latches With 3-State Outputs 20-CFP -55 to 125 芯片级器
File Size	90.85K / 8 Page	View it Online	Download Datasheet

				OSRAM
Part No.	F0118G
OCR Text	... bondpaddurchmesser Diameter of bondpad Weitere Informationen Additional information2) Vorderseitenmetallisierung Metallization frontside Ruckseitenmetallisierung Metallization backside Trennverfahren Dicing Verbindung Chip - Trager Die bon...
Description	GaAs Infrared Emitting Diode
File Size	65.53K / 6 Page	View it Online	Download Datasheet

For bondpad Found Datasheets File :: 130 Search Time::1.672ms
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