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  90663-1162 Datasheet PDF File

For 90663-1162 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | <10> | 11 | 12 | 13 | 14 | 15 |   

    LB11620T

Sanyo Semicon Device
Part No. LB11620T
Description Monolithic Digital IC Brushless Motor Driver

File Size 124.45K  /  11 Page

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Toshiba Electronic Devices & Storage Corporation

Part No. 2SA1162
Description PNP Bipolar Transistor / VCEO=-50 V / IC=-0.15 A / hFE=70~400 / VCE(sat)=-0.3 V / AEC-Q101 / SOT-346
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    Atmel
Part No. AT61162E
Description Radiation Hard 2Mbit x 8 SRAM Cube. Made of 16 stacked 128K x 8 SRAMs.

File Size 220.89K  /  14 Page

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Amphenol Communications Solutions

Part No. 79821-162HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 62 Positions, 2.54 mm Pitch, Vertical, 10.92 mm (0.43 in.) Mating, 5.08 mm (0.2 in.) Tail.
Tech specs    

Official Product Page

    TY Semiconductor Co., L...
Part No. 2SC1162-TO126
Description TO-126 Plastic-Encapsulate Transistors

File Size 4,138.30K  /  1 Page

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Amphenol Communications Solutions

Part No. 131-5116-21D
Description Paladin® 112Gb/s Backplane Connector, 5-Pair, 6 Column, Open Wall, Backplane Module, 2.25mm Wipe, Nickel Sulfamate.
Tech specs    

Official Product Page

    LB11620T-TLM-E

ON Semiconductor
Part No. LB11620T-TLM-E
Description Brushless Motor Driver

File Size 147.77K  /  13 Page

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Amphenol Communications Solutions

Part No. 131-4116-21H
Description Paladin® 112Gb/s Backplane Connector, 4-Pair, 6 Column, Open Wall, Backplane Module, 2.25mm Wipe, APP.
Tech specs    

Official Product Page

    0906631601 90663-1601

Molex Electronics Ltd.
Part No. 0906631601 90663-1601
Description 2.54mm (.100") Pitch QF-50 Vertical, MIL Keying with Latch/Eject Levers, Shrouded Header, 60 Circuits
2.54mm (.100) Pitch QF-50 Vertical, MIL Keying with Latch/Eject Levers, Shrouded Header, 60 Circuits

File Size 184.32K  /  4 Page

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Amphenol Communications Solutions

Part No. 77311-162-36LF
Description BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 36 Positions, 2.54 mm Pitch.
Tech specs    

Official Product Page

    90663-1103 0906631103

Molex Electronics Ltd.
Part No. 90663-1103 0906631103
Description 2.54mm (.100") Pitch QF-50 Vertical, MIL Keying with Latch/Eject Levers, Shrouded Header, 10 Circuits
2.54mm (.100) Pitch QF-50 Vertical, MIL Keying with Latch/Eject Levers, Shrouded Header, 10 Circuits

File Size 184.37K  /  4 Page

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Amphenol Communications Solutions

Part No. 10127721-162GLF
Description Minitek® Pwr 3.0, Dual Row, Vertical Through Hole Header, 16 Position, 3.2mm Kink Tail (Gold Flash) plating, GW Compatible LCP, Black Color,Tray Packing.
Tech specs    

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    90663-1102 0906631102

Molex Electronics Ltd.
Part No. 90663-1102 0906631102
Description 2.54mm (.100") Pitch QF-50 Vertical, MIL Keying with Latch/Eject Levers, Shrouded Header, 10 Circuits
2.54mm (.100) Pitch QF-50 Vertical, MIL Keying with Latch/Eject Levers, Shrouded Header, 10 Circuits

File Size 184.47K  /  4 Page

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Amphenol Communications Solutions

Part No. 75168-116-20LF
Description BergStik®, Board to Board connector, Unshrouded Right Angled header, Through Hole, Single Row, 20 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    90663-1101 0906631101

Molex Electronics Ltd.
Part No. 90663-1101 0906631101
Description 2.54mm (.100") Pitch QF-50 Vertical, MIL Keying with Latch/Eject Levers, Shrouded Header, 10 Circuits
2.54mm (.100) Pitch QF-50 Vertical, MIL Keying with Latch/Eject Levers, Shrouded Header, 10 Circuits

File Size 184.37K  /  4 Page

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Amphenol Communications Solutions

Part No. 54242-811162350LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Surface Mount, Double Row, 16 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    90663-0501 0906630501

Molex Electronics Ltd.
Part No. 90663-0501 0906630501
Description 2.54mm (.100") Pitch QF-50 Vertical, MIL Keying with Latch/Eject Levers, Shrouded Header, 50 Circuits
2.54mm (.100) Pitch QF-50 Vertical, MIL Keying with Latch/Eject Levers, Shrouded Header, 50 Circuits

File Size 149.05K  /  3 Page

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Amphenol Communications Solutions

Part No. 131-3116-21D
Description Paladin® 112Gb/s Backplane Connector, 3-Pair, 6 Column, Open Wall, Backplane Module, 2.25mm Wipe, Nickel Sulfamate.
Tech specs    

Official Product Page

    90663-0161 0906630161

Molex Electronics Ltd.
Part No. 90663-0161 0906630161
Description 2.54mm (.100) Pitch QF-50 Vertical, MIL Keying with Latch/Eject Levers

File Size 149.23K  /  3 Page

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Amphenol Communications Solutions

Part No. 131-8116-21D
Description Paladin® 112Gb/s Backplane Connector, 8-Pair, 6 Column, Open Wall, Backplane Module, 2.25mm Wipe, Nickel Sulfamate.
Tech specs    

Official Product Page

For 90663-1162 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | <10> | 11 | 12 | 13 | 14 | 15 |   

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