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Molex Electronics Ltd.
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| Part No. |
0901303240 90130-3240
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| Description |
2.54mm (.100) Pitch C-Grid III?/a> Header, Dual Row, Right Angle, Shrouded, Fully Loaded, 40 Circuits, Black 0.38μm (15μ) Gold (Au) Selective Plating
2.54mm (.100) Pitch C-Grid III Header, Dual Row, Right Angle, Shrouded, Fully Loaded, 40 Circuits, Black 0.38μm (15μ) Gold (Au) Selective Plating
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| File Size |
168.45K /
4 Page |
 View
it Online |
Download Datasheet
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Amphenol Communications Solutions |
| Part No. |
68690-130HLF
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| Description |
BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 30 Positions, 2.54 mm (0.100in)Pitch.
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
92090-130LF
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| Description |
Minitek® 2.00mm, Board to Board, PCB mounted Receptacle, Vertical, Surface Mount, Double Row, Top Entry, 30 Positions, 2.00mm (0.079in) Pitch..
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
10065490-130TRLF
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| Description |
Minitek® 2.00mm, Board To Board, Receptacle, Vertical, Surface Mount, Double Row, 30 Positions, 2.00mm (0.079in) Pitch.
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
0901301126 90130-1126
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| Description |
2.54mm (.100) Pitch C-Grid III Header, Dual Row, Vertical, Shrouded, Fully Loaded, 26 Circuits, Black, 3μm (118μ) Tin (Sn) over Nickel (Ni)
2.54mm (.100) Pitch C-Grid III垄芒 Header, Dual Row, Vertical, Shrouded, Fully Loaded, 26 Circuits, Black, 3楼矛m (118楼矛) Tin (Sn) over Nickel (Ni)
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| File Size |
586.04K /
7 Page |
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it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
78290-130HLF
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| Description |
BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 30 Positions, 2.54 mm Pitch, Vertical, 16.51 mm (0.65in) Mating, 12.7 mm (0.5in) Tail.
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
0901301128 90130-1128
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| Description |
2.54mm (.100) Pitch C-Grid III Header, Dual Row, Vertical, Shrouded, Fully Loaded, 28 Circuits, Black, 3μm (118μ) Tin (Sn) over Nickel (Ni)
2.54mm (.100) Pitch C-Grid III垄芒 Header, Dual Row, Vertical, Shrouded, Fully Loaded, 28 Circuits, Black, 3楼矛m (118楼矛) Tin (Sn) over Nickel (Ni)
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| File Size |
585.88K /
7 Page |
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it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
L17H2990130
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| Description |
Dsub, Stamped Signal 3A, Dual Port Right Angle PCB Thru Hole, F=19.05mm (0.750in), 26/26 (Socket/Socket), Flash Gold, Bright Tin Shell, 4-40 Threaded Rear Insert, 4*Arrowhead Boardlock
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
0901303208 90130-3208
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| Description |
2.54mm (.100) Pitch C-Grid III Header, Dual Row, Right Angle, Shrouded, Fully Loaded, 8 Circuits, Black 0.38μm (15μ) Gold (Au) Selective Plating
2.54mm (.100) Pitch C-Grid III?/a> Header, Dual Row, Right Angle, Shrouded, Fully Loaded, 8 Circuits, Black 0.38μm (15μ) Gold (Au) Selective Plating
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| File Size |
168.45K /
4 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
69190-130HLF
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| Description |
BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Single Row, 30 Positions, 2.54 mm (0.100in) Pitch.
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
0901303244 90130-3244
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| Description |
2.54mm (.100) Pitch C-Grid III?/a> Header, Dual Row, Right Angle, Shrouded, Fully Loaded, 44 Circuits, Black 0.38μm (15μ) Gold (Au) Selective Plating
2.54mm (.100) Pitch C-Grid III Header, Dual Row, Right Angle, Shrouded, Fully Loaded, 44 Circuits, Black 0.38μm (15μ) Gold (Au) Selective Plating
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| File Size |
168.54K /
4 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
10125112-080012CLF
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| Description |
HPCE BTB R/A Receptacle 8P12S WITH GUIDE
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
10132798-021120LF
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| Description |
BergStak® 0.5mm Mezzanine Connector, Board To Board Connectors, 20 position, 2.15mm height receptacle connector.
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
54122-112081950RLF
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| Description |
BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 8 position, 2.54mm (0.100in) pitch
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
G832MC111202122HR
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| Description |
0.80mm Board-to-Board 100Ω Connector, Pitch 0.8mm, Height 4.7 mm, 120 Positions, Dual Row, BTB Vertical Plug SMT, 15u\\ Gold Black.
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Official Product Page
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