| |
|
 |
Amphenol Communications Solutions |
| Part No. |
131-6116-11H
|
| Description |
Paladin® 112Gb/s Backplane Connector, 6-Pair, 6 Column, Open Wall, Backplane Module, 1.5mm Wipe, APP.
|
| Tech specs |
|
|
|
Official Product Page
|
| |
|
|
Amphenol Communications Solutions |
| Part No. |
131-6116-11D
|
| Description |
Paladin® 112Gb/s Backplane Connector, 6-Pair, 6 Column, Open Wall, Backplane Module, 1.5mm Wipe, Nickel Sulfamate.
|
| Tech specs |
|
|
|
Official Product Page
|
| |
|
|
Amphenol Communications Solutions |
| Part No. |
20021611-00012T1LF
|
| Description |
1.27mm (0.05in.) pitch, Header with eject latch, 12 contacts
|
| Tech specs |
|
|
|
Official Product Page
|
| |
|
|
Amphenol Communications Solutions |
| Part No. |
20021611-00030T1LF
|
| Description |
1.27mm (0.05in.) pitch, Header with eject latch, 30 contacts
|
| Tech specs |
|
|
|
Official Product Page
|
| |
|
|
Amphenol Communications Solutions |
| Part No. |
87916-113HLF
|
| Description |
BergStik® 2.54mm, Board To Board Connector, Unshrouded Header, Through Hole, Single Row, 13 Positions, 2.54mm Pitch, Vertical, 21.08mm (0.83in) Mating, 3.25mm (0.128in) Tail.
|
| Tech specs |
|
|
|
Official Product Page
|
| |
|
|
Amphenol Communications Solutions |
| Part No. |
20021611-00040T8LF
|
| Description |
1.27mm (0.05in.) pitch, Header with eject latch, 40 contacts
|
| Tech specs |
|
|
|
Official Product Page
|
| |
|
|
TY Semiconductor Co., Ltd
|
| Part No. |
2SD1611
|
| Description |
High forward current transfer ratio hFE High collector-base voltage (Emitter open) VCBO
|
| File Size |
107.98K /
2 Page |
 View
it Online |
Download Datasheet
|
| |
|
|
Amphenol Communications Solutions |
| Part No. |
87916-111HLF
|
| Description |
BergStik® 2.54mm, Board To Board Connector, Unshrouded Header, Through Hole, Single Row, 11 Positions, 2.54mm Pitch, Vertical, 21.08mm (0.83in) Mating, 3.25mm (0.128in) Tail.
|
| Tech specs |
|
|
|
Official Product Page
|
| |
|
|
Amphenol Communications Solutions |
| Part No. |
20021611-00008T1LF
|
| Description |
1.27mm (0.05in.) pitch, Header with eject latch, 8 contacts
|
| Tech specs |
|
|
|
Official Product Page
|
| |
|
|
Amphenol Communications Solutions |
| Part No. |
U90H161100A
|
| Description |
ExpressPort QSFP+, High Speed Input Output Connectors, QSFP 12.73MM HS 1X1.
|
| Tech specs |
|
|
|
Official Product Page
|
| |
|
|
PANASONIC[Panasonic Semiconductor]
|
| Part No. |
2SD1611
|
| Description |
Silicon NPN triple diffusion planar type Darlington(For power amplification)
|
| File Size |
62.42K /
2 Page |
View
it Online |
Download Datasheet |
| |
|
|
Amphenol Communications Solutions |
| Part No. |
131-3516-11D
|
| Description |
Paladin® 112Gb/s Backplane Connector, 3-Pair, 6 Column, Left Polarized, Backplane Module, 1.5mm Wipe, Nickel Sulfamate.
|
| Tech specs |
|
|
|
Official Product Page
|
|
Bom2Buy.com
Price and Availability
|
