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Molex Electronics Ltd.
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| Part No. |
0877156006 87715-6006
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| Description |
1.00mm (.039) Pitch, PCI Express* Connector, 36 Circuits, Nylon 6/6 Glass-filled,Black Housing, Phosphor Bronze, 0.76μm (30μ) Gold (Au) Plating, with Plastic Pegs,
1.00mm (.039") Pitch, PCI Express* Connector, 36 Circuits, Nylon 6/6 Glass-filled,Black Housing, Phosphor Bronze, 0.76楼矛m (30楼矛") Gold (Au) Plating, with Plasti
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| File Size |
329.92K /
6 Page |
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it Online |
Download Datasheet
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Amphenol Communications Solutions |
| Part No. |
65039-017LF
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| Description |
PV® Wire-to-Board Connector System, 2.54mm (0.1inch) Centerline Crimp-to-Wire PV Receptacle Housing, Single Row.
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
0877156007 87715-6007
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| Description |
1.00mm (.039) Pitch, PCI Express* Connector, 36 Circuits, Nylon 6/6 Glass-filledBlack Housing, Phosphor Bronze, Gold (Au) Flash, with Plastic Pegs, 2.30mm (.091)Soldertail, Lead Free
1.00mm (.039") Pitch, PCI Express* Connector, 36 Circuits, Nylon 6/6 Glass-filledBlack Housing, Phosphor Bronze, Gold (Au) Flash, with Plastic Pegs, 2.30mm (.09
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| File Size |
329.68K /
6 Page |
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it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
65039-017ELF
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| Description |
PV® Wire-to-Board Connector System, 2.54mm (0.1inch) Centerline Crimp-to-Wire PV Receptacle Housing, Single Row.
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
0877159302
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| Description |
1.00mm (.039) Pitch, PCI Express* Connector, 164 Circuits, Nylon 4/6 Glass-filled, Black Housing, Phosphor Bronze, 0.38μm (15μ) Gold (Au) Plating
1.00mm (.039) Pitch, PCI Express* Connector, 164 Circuits, Nylon 4/6 Glass-filled, Black Housing, Phosphor Bronze, 0.38楼矛m (15楼矛) Gold (Au) Plating
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| File Size |
618.68K /
10 Page |
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it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
65239-017LF
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| Description |
Dubox® 2.54mm, Crimp-to-Wire Housing, Double Row, 34 Position.
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
68690-170HLF
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| Description |
BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 70 Positions, 2.54 mm (0.100in)Pitch.
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
68690-172
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| Description |
BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 72 Positions, 2.54 mm (0.100in)Pitch.
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
0877159018
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| Description |
1.00mm (.039) Pitch, PCI Express* Connector, 36 Circuits, Nylon 4/6 Glass-filled, White Housing, Phosphor Bronze, 0.38μm (15μ) Gold (Au) Plating, with Plastic Pegs
1.00mm (.039) Pitch, PCI Express* Connector, 36 Circuits, Nylon 4/6 Glass-filled, White Housing, Phosphor Bronze, 0.38渭m (15渭) Gold (Au) Plating, with Plastic P
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| File Size |
335.98K /
6 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
68690-172HLF
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| Description |
BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 72 Positions, 2.54 mm (0.100in)Pitch.
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
0877159901 87715-9901
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| Description |
Phosphor Bronze, 0.38μm (15μ) Gold (Au) Plating, with Plastic Pegs, 2.54mm (.100)Soldertail, PCB Thickness 1.58mm (.062), 26 Circuits, Lead Free
Phosphor Bronze, 0.38渭m (15渭") Gold (Au) Plating, with Plastic Pegs, 2.54mm (.100")Soldertail, PCB Thickness 1.58mm (.062"), 26 Circuits, Lead Free
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| File Size |
132.16K /
3 Page |
View
it Online |
Download Datasheet |
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Molex Electronics Ltd.
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| Part No. |
0877159322
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| Description |
1.00mm (.039) Pitch, PCI Express* Connector, 164 Circuits, Nylon 4/6 Glass-filled, Blue (287U) Housing, Phosphor Bronze, 0.38μm (15μ) Gold (Au) Plating
1.00mm (.039) Pitch, PCI Express* Connector, 164 Circuits, Nylon 4/6 Glass-filled, Blue (287U) Housing, Phosphor Bronze, 0.38楼矛m (15楼矛) Gold (Au) Plating
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| File Size |
627.46K /
10 Page |
View
it Online |
Download Datasheet |
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