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  87587-0158 Datasheet PDF File

For 87587-0158 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | <10> | 11 | 12 | 13 | 14 | 15 |   

    0015800425

Molex Electronics Ltd.
Part No. 0015800425
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 42 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating

File Size 1,218.29K  /  7 Page

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Amphenol Communications Solutions

Part No. 10070158-00419XLF
Description D-Sub MicroTCA Connectors, Input Output Connectors, Single PCB Connector 24A 48V, Pin-in-Paste, Insert UNC 4.40, Carton Box.
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    0015800721

Molex Electronics Ltd.
Part No. 0015800721
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 72 Circuits, Tin (Sn) Plating

File Size 1,218.25K  /  7 Page

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Amphenol Communications Solutions

Part No. 77313-801-58LF
Description BergStik®, Board to Board connector, Unshrouded Header, 2.54 mm Pitch, Vertical, Double Row,Through Hole, 58 Positions
Tech specs    

Official Product Page

    0015800449 15-80-0449

Molex Electronics Ltd.
Part No. 0015800449 15-80-0449
Description 2.54mm (.100") Pitch C-Grid庐 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature
2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature

File Size 1,218.39K  /  7 Page

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Amphenol Communications Solutions

Part No. 77313-101-58LF
Description BergStik®, Board to Board connector, Unshrouded Header, 2.54 mm Pitch, Vertical, Double Row,Through Hole, 58 Positions
Tech specs    

Official Product Page

    0015800265

Molex Electronics Ltd.
Part No. 0015800265
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 26 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating

File Size 1,218.30K  /  7 Page

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Amphenol Communications Solutions

Part No. 68020-158HLF
Description BergStik®, Board to Board connector, Unshrouded Right angled Header, Through Hole, Double Row, 58 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    15-80-0385 0015800385

Molex Electronics Ltd.
Part No. 15-80-0385 0015800385
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 38 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating

File Size 1,218.29K  /  7 Page

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Amphenol Communications Solutions

Part No. 10070158-00119LLF
Description D-Sub MicroTCA Connectors, Input Output Connectors, Dual PCB Connector 24A 48V, Solder-to-Board, Insert M3, Carton Box.
Tech specs    

Official Product Page

    15-80-0401 0015800401

Molex Electronics Ltd.
Part No. 15-80-0401 0015800401
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 40 Circuits, Tin (Sn) Plating

File Size 1,218.27K  /  7 Page

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Amphenol Communications Solutions

Part No. 86840-158HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 58 Positions, 2.54 mm Pitch, Right Angle, 8.08 mm (0.318in) Mating, 5.84 mm (0.23in) Tail.
Tech specs    

Official Product Page

    0015800203 15-80-0203

Molex Electronics Ltd.
Part No. 0015800203 15-80-0203
Description 2.54mm (.100) Pitch C-Grid庐 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 20 Circuits, 0.38渭m (15渭) Gold (Au) Selective Plat
2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 20 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating

File Size 1,218.27K  /  7 Page

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Amphenol Communications Solutions

Part No. 10070158-00412XLF
Description D-Sub MicroTCA Connectors, Input Output Connectors, Single PCB Connector 24A 48V, Pin-in-Paste, Insert UNC 4.40, Tape and Reel.
Tech specs    

Official Product Page

    0015800641

Molex Electronics Ltd.
Part No. 0015800641
Description 2.54mm (.100) Pitch C-Grid庐 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 64 Circuits, Tin (Sn) Plating

File Size 1,218.24K  /  7 Page

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Amphenol Communications Solutions

Part No. 68690-158HLF
Description BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 58 Positions, 2.54 mm (0.100in)Pitch.
Tech specs    

Official Product Page

    15-80-0383 0015800383

Molex Electronics Ltd.
Part No. 15-80-0383 0015800383
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 38 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating

File Size 1,218.08K  /  7 Page

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Amphenol Communications Solutions

Part No. 51730-158LF
Description PwrBlade®, Power Supply Connectors, 4P 24S 2P Right Angle Header.
Tech specs    

Official Product Page

    0015800643

Molex Electronics Ltd.
Part No. 0015800643
Description 2.54mm (.100) Pitch C-Grid庐 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 64 Circuits

File Size 1,218.29K  /  7 Page

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Amphenol Communications Solutions

Part No. 77313-401-58LF
Description BergStik®, Board to Board connector, Unshrouded Header, 2.54 mm Pitch, Vertical, Double Row,Through Hole, 58 Positions
Tech specs    

Official Product Page

For 87587-0158 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | <10> | 11 | 12 | 13 | 14 | 15 |   

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