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Amphenol Communications Solutions |
| Part No. |
68461-432HLF
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| Description |
BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 32 Positions, 2.54 mm Pitch, Right Angle, 10.16 mm (0.4 in.) Mating, 8.13 mm (0.32 in.) Tail
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
75757-1401 0757571401
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| Description |
3.50mm (.138) Pitch, MX150?/a> Header, Breakaway, Vertical, 20 Circuits, 1.5μm (60μ) Tin (Sn) Plating, 11.20mm (.441) Mating Pin Length, 3.05mm (.120) PC Tail Length
3.50mm (.138) Pitch, MX150 Header, Breakaway, Vertical, 20 Circuits, 1.5μm (60μ) Tin (Sn) Plating, 11.20mm (.441) Mating Pin Length, 3.05mm (.120) PC Tail Length
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| File Size |
166.40K /
4 Page |
 View
it Online |
Download Datasheet
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Amphenol Communications Solutions |
| Part No. |
79821-432HLF
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| Description |
BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 32 Positions, 2.54 mm Pitch, Vertical, 10.92 mm (0.43 in.) Mating, 5.08 mm (0.2 in.) Tail.
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
68491-432HALF
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| Description |
BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 32 Positions, 2.54 mm (0.100in) Pitch.
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
75757-1462 0757571462
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| Description |
3.50mm (.138) Pitch, MX150?/a> Header, Breakaway, Vertical, 12 Circuits, 1.5μm (60μ) Tin (Sn) Plating, 11.20mm (.441) Mating Pin Length, 4.75mm (.187) PC Tail Length
3.50mm (.138) Pitch, MX150 Header, Breakaway, Vertical, 12 Circuits, 1.5μm (60μ) Tin (Sn) Plating, 11.20mm (.441) Mating Pin Length, 4.75mm (.187) PC Tail Length
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| File Size |
166.45K /
4 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
10134214-320424CLF
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| Description |
HPCE BTB RAH 36P24S WITH GUIDE
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
75757-0341 0757570341
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| Description |
3.50mm (.138) Pitch, MX150?/a> Header, Breakaway, Vertical, 4 Circuits, 1.25μm (50μ) Nickel (Ni) Overall, 2.50μm (100μ) Minimum Select Matte Tin (Sn) Plating on Tail
3.50mm (.138) Pitch, MX150 Header, Breakaway, Vertical, 4 Circuits, 1.25μm (50μ) Nickel (Ni) Overall, 2.50μm (100μ) Minimum Select Matte Tin (Sn) Plating on Tail
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| File Size |
99.21K /
3 Page |
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it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
10143267-127500ULF
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| Description |
ExaMEZZ® 56Gb/s High Speed Mezzanine 2-pair, 19 column, 27.5mm stacking height, 152contacts
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
75757-0332 0757570332
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| Description |
3.50mm (.138) Pitch, MX150?/a> Header, Breakaway, Vertical, 3 Circuits, 1.25μm (50μ) Nickel (Ni) Overall, 2.50μm (100μ) Minimum Select Matte Tin (Sn) Plating on Tail
3.50mm (.138) Pitch, MX150 Header, Breakaway, Vertical, 3 Circuits, 1.25μm (50μ) Nickel (Ni) Overall, 2.50μm (100μ) Minimum Select Matte Tin (Sn) Plating on Tail
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| File Size |
99.21K /
3 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
71991-432LF
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| Description |
Dubox®, Board To Board Connector, Receptacle, Vertical, Through Hole, Double Row, Dual Entry, 64 Positions, 2.54mm (0.100in) Pitch
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
75757-0331 0757570331
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| Description |
3.50mm (.138) Pitch, MX150?/a> Header, Breakaway, Vertical, 3 Circuits, 1.25μm (50μ) Nickel (Ni) Overall, 2.50μm (100μ) Minimum Select Matte Tin (Sn) Plating on Tail
3.50mm (.138) Pitch, MX150 Header, Breakaway, Vertical, 3 Circuits, 1.25μm (50μ) Nickel (Ni) Overall, 2.50μm (100μ) Minimum Select Matte Tin (Sn) Plating on Tail
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| File Size |
99.21K /
3 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
77311-432C10LF
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| Description |
BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 10 Positions, 2.54 mm Pitch.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
78511-432HLF
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| Description |
BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Single Row, 32 Positions, 2.54 mm Pitch.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
68001-432HLF
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| Description |
BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Single Row, , 32 Positions, 2.54 mm (0.100in) Pitch.
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
75757-0421 0757570421
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| Description |
3.50mm (.138) Pitch, MX150?/a> Header, Breakaway, Vertical, 2 Circuits, 1.25μm (50μ) Nickel (Ni) Overall, 1.50μm (60μ) Minimum Select Matte Tin (Sn) Plating Overall
3.50mm (.138) Pitch, MX150 Header, Breakaway, Vertical, 2 Circuits, 1.25μm (50μ) Nickel (Ni) Overall, 1.50μm (60μ) Minimum Select Matte Tin (Sn) Plating Overall
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| File Size |
98.91K /
3 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
77311-432-04LF
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| Description |
BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 04 Positions, 2.54 mm Pitch.
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| Tech specs |
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Official Product Page
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