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  73780-3163 Datasheet PDF File

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    RF3163 RF3163PCBA

RF Micro Devices, Inc.
RFMD[RF Micro Devices]
Part No. RF3163 RF3163PCBA
Description 3V 900MHZ LINEAR POWER AMPLIFIER MODULE 3V00MHz的线性功率放大器模块

File Size 76.36K  /  8 Page

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Amphenol Communications Solutions

Part No. 61083-163402PLF
Description BergStak® 0.80mm Pitch, Mezzanine Connector, Vertical Header, Double Row, 160 Positions.
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    0737802243

Molex Electronics Ltd.
Part No. 0737802243
Description 2.00mm (.079) Pitch HDM? Board-to-Board Daughtercard Receptacle, Vertical, SignalModule, 72 Circuits, Mounted Height 13.00mm (.512), Pin Length 3.00mm (.118),

File Size 198.96K  /  3 Page

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Amphenol Communications Solutions

Part No. 91901-31631LF
Description Conan® 1.00mm Pitch, Board To Board Connector, I - Industrial Series, Vertical Header, Surface Mount, 31 Positions.
Tech specs    

Official Product Page

    0737801223

Molex Electronics Ltd.
Part No. 0737801223
Description 2.00mm (.079) Pitch HDM? Board-to-Board Daughtercard Receptacle, Vertical, Signal Module, 144 Circuits, Mounted Height 13.00mm (.512), Pin Length 2.50mm (.098), Solder Tail

File Size 202.00K  /  3 Page

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Amphenol Communications Solutions

Part No. 131-6316-21D
Description Paladin® 112Gb/s Backplane Connector, 6-Pair, 6 Column, Left End Wall, Backplane Module, 2.25mm Wipe, Nickel Sulfamate.
Tech specs    

Official Product Page

    0737801246

Molex Electronics Ltd.
Part No. 0737801246
Description 2.00mm (.079) Pitch HDM Board-to-Board Daughtercard Receptacle, Vertical, Signal Module, 144 Circuits, Mounted

File Size 201.85K  /  3 Page

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Amphenol Communications Solutions

Part No. 75168-316-36LF
Description BergStik®, Board to Board connector, Unshrouded Right Angled header, Through Hole, Single Row, 36 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    0737801247

Molex Electronics Ltd.
Part No. 0737801247
Description 2.00mm (.079) Pitch HDM? Board-to-Board Daughtercard Receptacle, Vertical, SignalModule, 144 Circuits, Mounted Height 17.00mm (.669), Pin Length 3.00mm (.118),

File Size 202.03K  /  3 Page

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Amphenol Communications Solutions

Part No. 61083-163400LF
Description BergStak® 0.80mm Pitch, Mezzanine Connector, Vertical Header, Double Row, 160 Positions.
Tech specs    

Official Product Page

    0737801257

Molex Electronics Ltd.
Part No. 0737801257
Description 2.00mm (.079) Pitch HDM? Board-to-Board Daughtercard Receptacle, Vertical, SignalModule, 144 Circuits, Mounted Height 17.00mm (.669), Pin Length 3.50mm (.138),

File Size 202.03K  /  3 Page

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Amphenol Communications Solutions

Part No. 61083-163422LF
Description BergStak® 0.80mm Pitch, Mezzanine Connector, Vertical Header, Double Row, 160 Positions.
Tech specs    

Official Product Page

    0737801265

Molex Electronics Ltd.
Part No. 0737801265
Description 2.00mm (.079) Pitch HDM? Board-to-Board Daughtercard Receptacle, Vertical, SignalModule, 144 Circuits, Mounted Height 15.00mm (.591), Pin Length 4.00mm (.157),

File Size 202.00K  /  3 Page

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Amphenol Communications Solutions

Part No. 61083-163402LF
Description BergStak® 0.80mm Pitch, Mezzanine Connector, Vertical Header, Double Row, 160 Positions.
Tech specs    

Official Product Page

    0737801254

Molex Electronics Ltd.
Part No. 0737801254
Description 2.00mm (.079) Pitch HDM? Board-to-Board Daughtercard Receptacle, Vertical, SignalModule, 144 Circuits, Mounted Height 14.00mm (.551), Pin Length 3.50mm (.138),

File Size 202.01K  /  3 Page

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Amphenol Communications Solutions

Part No. 61083-163622LF
Description BergStak® 0.80mm Pitch, Mezzanine Connector, Vertical Header, Double Row, 160 Positions.
Tech specs    

Official Product Page

    0737801253

Molex Electronics Ltd.
Part No. 0737801253
Description 2.00mm (.079) Pitch HDM Board-to-Board Daughtercard Receptacle, Vertical, Signal Module, 144 Circuits, Mounted

File Size 202.01K  /  3 Page

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Amphenol Communications Solutions

Part No. 131-6314-11H
Description Paladin® 112Gb/s Backplane Connector, 6-Pair, 4 Column, Left End Wall, Backplane Module, 1.5mm Wipe, APP.
Tech specs    

Official Product Page

    0737801256

Molex Electronics Ltd.
Part No. 0737801256
Description 2.00mm (.079) Pitch HDM? Board-to-Board Daughtercard Receptacle, Vertical, SignalModule, 144 Circuits, Mounted Height 16.00mm (.630), Pin Length 3.50mm (.138),

File Size 202.00K  /  3 Page

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Amphenol Communications Solutions

Part No. 131-6318-21D
Description Paladin® 112Gb/s Backplane Connector, 6-Pair, 8 Column, Left End Wall, Backplane Module, 2.25mm Wipe, Nickel Sulfamate.
Tech specs    

Official Product Page

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