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Molex Electronics Ltd.
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| Part No. |
70287-1000 0702871000
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| Description |
2.54mm (.100") Pitch C-Grid庐 Header, Breakaway, Dual Row, Vertical, with RetentionPin, 4 Circuits, 6.10mm (.240") Mating Pin Length, Tin (Sn) Plating
2.54mm (.100) Pitch C-Grid? Header, Breakaway, Dual Row, Vertical, with RetentionPin, 4 Circuits, 6.10mm (.240) Mating Pin Length, Tin (Sn) Plating
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| File Size |
308.31K /
6 Page |
 View
it Online |
Download Datasheet
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Amphenol Communications Solutions |
| Part No. |
10118085-101-12LF
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| Description |
Unshrouded Right Angle header,Surface Mount, Double Row, 12 Positions, 2.54mm (0.100in) Pitch.
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
70287-1002 0702871002
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| Description |
2.54mm (.100") Pitch C-Grid庐 Header, Breakaway, Dual Row, Vertical, with RetentionPin, 8 Circuits, 6.10mm (.240") Mating Pin Length, Tin (Sn) Plating
2.54mm (.100) Pitch C-Grid? Header, Breakaway, Dual Row, Vertical, with RetentionPin, 8 Circuits, 6.10mm (.240) Mating Pin Length, Tin (Sn) Plating
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| File Size |
308.32K /
6 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
10119333-101-15LF
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| Description |
BergStik®, Board to Board connector, Unshrouded horizontal header, Surface mount, Single Row, 15 Positions, 2.54mm (0.100in) Pitch.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
10114829-10110LF
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| Description |
1.25mm Wire to Board Wafer, Vertical, Through Hole, 10 Positions
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
70287-1004 0702871004
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| Description |
2.54mm (.100") Pitch C-Grid庐 Header, Breakaway, Dual Row, Vertical, with RetentionPin, 12 Circuits, 6.10mm (.240") Mating Pin Length, Tin (Sn) Plating
2.54mm (.100) Pitch C-Grid? Header, Breakaway, Dual Row, Vertical, with RetentionPin, 12 Circuits, 6.10mm (.240) Mating Pin Length, Tin (Sn) Plating
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| File Size |
308.31K /
6 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
10114831-10113LF
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| Description |
1.25mm Wire-to-Board Connector System WAFER THROUGH HOLE RIGHT ANGLE, 13 POSITIONS, TIN PLATING
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
70287-1005 0702871005
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| Description |
2.54mm (.100") Pitch C-Grid庐 Header, Breakaway, Dual Row, Vertical, with Retention Pin, 14 Circuits, 6.10mm (.240") Mating Pin Length, Tin (Sn) Plating
2.54mm (.100) Pitch C-Grid? Header, Breakaway, Dual Row, Vertical, with Retention Pin, 14 Circuits, 6.10mm (.240) Mating Pin Length, Tin (Sn) Plating
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| File Size |
308.31K /
6 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
10114831-10114LF
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| Description |
1.25mm Wire-to-Board Connector System WAFER THROUGH HOLE RIGHT ANGLE, 14 POSITIONS, TIN PLATING
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
70287-1006 0702871006
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| Description |
2.54mm (.100") Pitch C-Grid庐 Header, Breakaway, Dual Row, Vertical, with RetentionPin, 16 Circuits, 6.10mm (.240") Mating Pin Length, Tin (Sn) Plating
2.54mm (.100) Pitch C-Grid? Header, Breakaway, Dual Row, Vertical, with RetentionPin, 16 Circuits, 6.10mm (.240) Mating Pin Length, Tin (Sn) Plating
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| File Size |
308.31K /
6 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
10114829-10114LF
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| Description |
1.25mm Wire to Board Wafer, Vertical, Through Hole, 14 Positions
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
70287-1007 0702871007
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| Description |
2.54mm (.100") Pitch C-Grid庐 Header, Breakaway, Dual Row, Vertical, with Retention Pin, 18 Circuits, 6.10mm (.240") Mating Pin Length, Tin (Sn) Plating
2.54mm (.100) Pitch C-Grid? Header, Breakaway, Dual Row, Vertical, with Retention Pin, 18 Circuits, 6.10mm (.240) Mating Pin Length, Tin (Sn) Plating
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| File Size |
308.31K /
6 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
10114828-10115LF
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| Description |
1.25mm Wire to Board Wafer,Vertical, Surface Mount, 15 Positions
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
70287-1008 0702871008
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| Description |
2.54mm (.100") Pitch C-Grid庐 Header, Breakaway, Dual Row, Vertical, with RetentionPin, 20 Circuits, 6.10mm (.240") Mating Pin Length, Tin (Sn) Plating
2.54mm (.100) Pitch C-Grid? Header, Breakaway, Dual Row, Vertical, with RetentionPin, 20 Circuits, 6.10mm (.240) Mating Pin Length, Tin (Sn) Plating
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| File Size |
308.31K /
6 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
10114830-10111LF
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| Description |
1.25mm Wire to Board Wafer, Right Angle, Surface Mount, 11 Positions
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
70287-1010 0702871010
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| Description |
2.54mm (.100") Pitch C-Grid庐 Header, Breakaway, Dual Row, Vertical, with RetentionPin, 24 Circuits, 6.10mm (.240") Mating Pin Length, Tin (Sn) Plating
2.54mm (.100) Pitch C-Grid? Header, Breakaway, Dual Row, Vertical, with RetentionPin, 24 Circuits, 6.10mm (.240) Mating Pin Length, Tin (Sn) Plating
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| File Size |
308.31K /
6 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
10114829-10115LF
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| Description |
1.25mm Wire to Board Wafer, Vertical, Through Hole, 15 Positions
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
10114831-10115LF
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| Description |
1.25mm Wire-to-Board Connector System WAFER THROUGH HOLE RIGHT ANGLE, 15 POSITIONS, TIN PLATING
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| Tech specs |
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Official Product Page
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