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  6163 Datasheet PDF File

For 6163 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | <10> | 11 | 12 | 13 | 14 | 15 |   

    Samsung Semiconductor Co., Ltd.
SAMSUNG SEMICONDUCTOR CO. LTD.
Part No. K4H560838F-TC/LA2 K4H560838F-TC/LB3 K4H561638F-TC/LA2 K4H560838F-TC/LAA K4H561638F-TC/LAA K4H560838F-TC/LB0 K4H561638F-TC/LB0 K4H561638F-TC/LB3
Description 256Mb F-die DDR SDRAM Specification 256Mb的的F - DDR SDRAM内存芯片规格
10-Bit, 38 kSPS ADC Serial Out, On-Chip System Clock, Single Ch. 8-PDIP
10-Bit, 38 kSPS ADC Serial Out, On-Chip System Clock, 11 Ch. 20-PLCC -40 to 125

File Size 331.11K  /  23 Page

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Amphenol Communications Solutions

Part No. 10137926-1631LF
Description Minitek® Pwr 3.0, Dual Row, Vertical SMT Tails and Hold Down Header, 15u\\ Gold (Tin on Tails) plating, Black Color, 16 Positions, GW Compatible LCP, Tape and Reel with cap.
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    K4H561638F K4H561638F-TC_LB3 FMB857B K4H560838F-TC_LA2 K4H560838F-TC_LAA K4H560838F-TC_LB0 K4H560838F-TC_LB3 K4H561638F-

Samsung Electronic
SAMSUNG[Samsung semiconductor]
Part No. K4H561638F K4H561638F-TC_LB3 FMB857B K4H560838F-TC_LA2 K4H560838F-TC_LAA K4H560838F-TC_LB0 K4H560838F-TC_LB3 K4H561638F-TC_LA2 K4H561638F-TC_LAA K4H561638F-TC_LB0 K4H560838F-TC/LA2 K4H560838F-TC/LAA K4H560838F-TC/LB0 K4H560838F-TC/LB3 K4H561638F-TC/LA2 K4H561638F-TC/LAA K4H561638F-TC/LB0 K4H561638F-TC/LB3
Description 256Mb F-die DDR SDRAM Specification

File Size 326.57K  /  23 Page

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Amphenol Communications Solutions

Part No. RJE711886163
Description Modular Jacks, Input Output Connectors, 8P8C, With Shield, With LEDs.
Tech specs    

Official Product Page

    K4C560838C-TCD3 K4C561638C-TCD3 K4C561638C-TCD4000 K4C561638C-TCDA K4C560838C-TCD4 K4C560838C-TCDA K4C561638C-TCD4

Samsung Electronic
SAMSUNG[Samsung semiconductor]
Part No. K4C560838C-TCD3 K4C561638C-TCD3 K4C561638C-TCD4000 K4C561638C-TCDA K4C560838C-TCD4 K4C560838C-TCDA K4C561638C-TCD4
Description 256Mb Network-DRAM

File Size 877.29K  /  42 Page

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Amphenol Communications Solutions

Part No. RJE721886163
Description Modular Jack, 8P8C, CAT5e, Shield, Recessed Profile, With LEDs
Tech specs    

Official Product Page

    K4H561638N-LCB3T00 K4H560838N-LLB30

Samsung semiconductor
Part No. K4H561638N-LCB3T00 K4H560838N-LLB30
Description N-die DDR SDRAM
32M X 8 DDR DRAM, 0.7 ns, PDSO66

File Size 325.32K  /  24 Page

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Amphenol Communications Solutions

Part No. 10136163-101LF
Description ExaMAX® 56Gb/s High Speed Backplane Connector 85Ohm, 6-Pair, 10 column, 200 position, Right Angle Header, No Guide Pin.
Tech specs    

Official Product Page

    K4H560838D-TCC4 K4H560838D-TCCC K4H561638D-TCCC K4H56038D-TC K4H561638D-TCC4

Samsung Semiconductor Co., Ltd.
SAMSUNG SEMICONDUCTOR CO. LTD.
SAMSUNG[Samsung semiconductor]
Samsung Electronic
Part No. K4H560838D-TCC4 K4H560838D-TCCC K4H561638D-TCCC K4H56038D-TC K4H561638D-TCC4
Description 256Mb D-die DDR400 SDRAM Specification 256Mb芯片支持DDR400内存规格

File Size 166.12K  /  18 Page

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Amphenol Communications Solutions

Part No. 77316-163LF
Description BergStik®, Board to Board connector, Unshrouded Right Angle Header, Through Hole, Single row , Polarized, 7 Positions, 2.54mm (0.100in) Pitch
Tech specs    

Official Product Page

    SAMSUNG SEMICONDUCTOR CO. LTD.
Samsung Semiconductor Co., Ltd.
Part No. K4C561638C-TCDA K4C560838C-TCDA K4C561638C-TCD4000 K4C560838C-TCD3 K4C560838C-TCDA0 K4C560838C-TCD40
Description Aluminum Electrolytic Radial Lead High Ripple, Long Life Capacitor; Capacitance: 220uF; Voltage: 200V; Case Size: 18x31 mm; Packaging: Bulk
Aluminum Electrolytic Radial Lead High Ripple, Long Life Capacitor; Capacitance: 47uF; Voltage: 200V; Case Size: 12.5x20 mm; Packaging: Bulk 256Mb的网络内
256Mb Network-DRAM 256Mb的网络内
32M X 8 SYNCHRONOUS DRAM, 0.75 ns, PDSO66
32M X 8 SYNCHRONOUS DRAM, 0.65 ns, PDSO66

File Size 885.55K  /  42 Page

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Amphenol Communications Solutions

Part No. 10136163-11JLF
Description ExaMAX® 56Gb/s High Speed Backplane Connector 85Ohm, 6-Pair, 10 column, 200 position, Right Angle Header, Right Guide Pin.
Tech specs    

Official Product Page

    HYB25DC256163CE-4 HYB25DC256163CE-5 HYB25DC256163CE-6

Qimonda AG
Part No. HYB25DC256163CE-4 HYB25DC256163CE-5 HYB25DC256163CE-6
Description 256-Mbit Double-Data-Rate SGRAM

File Size 868.35K  /  29 Page

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Amphenol Communications Solutions

Part No. 10136163-12JLF
Description ExaMAX® 56Gb/s High Speed Backplane Connector 85Ohm, 6-Pair, 10 column, 200 position, Right Angle Header, Left Guide Pin.
Tech specs    

Official Product Page

    K4H560438H K4H560438H-UC_LA2 K4H560438H-UC_LB0 K4H561638H-UC_LA2 K4H561638H-UC_LB0 K4H561638H-UC_LB3 K4H561638H-UC_LCC K

SAMSUNG[Samsung semiconductor]
Part No. K4H560438H K4H560438H-UC_LA2 K4H560438H-UC_LB0 K4H561638H-UC_LA2 K4H561638H-UC_LB0 K4H561638H-UC_LB3 K4H561638H-UC_LCC K4H561638H K4H560838H-UC_LCC K4H560838H K4H560838H-UC_LA2 K4H560838H-UC_LB0 K4H560838H-UC_LB3
Description 256Mb H-die DDR SDRAM Specification

File Size 356.30K  /  24 Page

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Amphenol Communications Solutions

Part No. 10137926-1633LF
Description Minitek® Pwr 3.0, Dual Row, Vertical SMT Tails and Hold Down Header, 15u\\ Gold (Tin on Tails) plating, Natural Color, 16 Positions, GW Compatible LCP, Tape and Reel with cap.
Tech specs    

Official Product Page

    K4S560432E-NC75 K4S560832E-NC75 K4S560832E-NL75 K4S561632E K4S560432E-NC K4S560432E-NL75

Samsung Semiconductor Co., Ltd.
SAMSUNG SEMICONDUCTOR CO. LTD.
SAMSUNG[Samsung semiconductor]
Samsung Electronic
Part No. K4S560432E-NC75 K4S560832E-NC75 K4S560832E-NL75 K4S561632E K4S560432E-NC K4S560432E-NL75
Description 256Mb E-die SDRAM Specification 54pin sTSOP-II 256Mb的电子芯片内存规4pin sTSOP -

File Size 180.64K  /  13 Page

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Amphenol Communications Solutions

Part No. 10137926-1632LF
Description Minitek® Pwr 3.0, Dual Row, Vertical SMT Tails and Hold Down Header, 15u\\ Gold (Tin on Tails) plating, Black Color, 16 Positions, Non GW Compatible LCP, Tape and Reel with cap.
Tech specs    

Official Product Page

    K4H560438J-LC/LB0 K4H560438J-LC/LB3 K4H560838J-LC/LCC K4H561638J-LC/LB3 K4H561638J-LC/LCC K4H560838J-LC/LB3

Samsung semiconductor
Part No. K4H560438J-LC/LB0 K4H560438J-LC/LB3 K4H560838J-LC/LCC K4H561638J-LC/LB3 K4H561638J-LC/LCC K4H560838J-LC/LB3
Description 256Mb J-die DDR SDRAM Specification

File Size 352.76K  /  24 Page

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Amphenol Communications Solutions

Part No. 10137926-1634LF
Description Minitek® Pwr 3.0, Dual Row, Vertical SMT Tails and Hold Down Header, 15u\\ Gold (Tin on Tails) plating, Natural Color, 16 Positions, Non GW Compatible LCP, Tape and Reel with cap.
Tech specs    

Official Product Page

For 6163 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | <10> | 11 | 12 | 13 | 14 | 15 |   

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