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  61010-101 Datasheet PDF File

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    Winchester Electronics ...
Part No. 757-21-101
Description BNC BULKHEAD RECEPTACLE

File Size 77.17K  /  1 Page

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Amphenol Communications Solutions

Part No. 54112-106101000RLF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 10 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

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HUA FENG CIRCUIT





   
Part No. E101
Description Optoelectronic

File Size 351.03K  /  1 Page

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Amphenol Communications Solutions

Part No. 10125756-361010LF
Description PCI Express® GEN 3 Card Edge, Storage and Server Connector, Straddle-Mount, x1, 36 Positions, 1.00mm (0.039in) Pitch
Tech specs    

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Part No. 22-1014-3H
Description INTERCONNECTION DEVICE

File Size 88.52K  /  1 Page

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Amphenol Communications Solutions

Part No. 10025026-10102TLF
Description PCI Express® GEN 3 Card Edge, Storage and Server Connector, Straddle-Mount, x8, 98 Positions, 1.00mm (0.039in) Pitch
Tech specs    

Official Product Page

    RAF ELECTRONIC HARDWARE
Part No. 0101-SS
Description CAPTIVE PANEL SCREW STYLE 1

File Size 78.16K  /  1 Page

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Amphenol Communications Solutions

Part No. 54112-106101050LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 10 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    XR-1016

Exar Corporation
Part No. XR-1016
Description (XR-1015 / XR-1016) Seventh Order Elliptic Low Pass Filters

File Size 825.30K  /  17 Page

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Amphenol Communications Solutions

Part No. 54122-106101000RLF
Description BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 10 position, 2.54mm (0.100in) pitch
Tech specs    

Official Product Page

   
Part No. 6-292-121 6-292-101
Description Low-Voltage, 1.8kHz PWM Output Temperature Sensors

File Size 88.40K  /  1 Page

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Amphenol Communications Solutions

Part No. 10025026-10100PLF
Description PCI Express® GEN 3 Card Edge, Storage and Server Connector, Straddle-Mount, x1, 36 Positions, 1.00mm (0.039in) Pitch .
Tech specs    

Official Product Page

   
Part No. 09-9101-1-06
Description INTERCONNECTION DEVICE

File Size 162.12K  /  3 Page

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Amphenol Communications Solutions

Part No. 10129206-1010001LF
Description DDR4 Ultra Low Profile Memory Module Sockets, Storage and Server System, Through Hole Termination, 288 Positions, 0.85mm (0.033in) Pitch.
Tech specs    

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    Samsung Semiconductor Co., Ltd.
Part No. PG-101 PG-104 PG-2BC
Description 3A, Fast Transient Response, Low Noise, LDO Regulators; Package: TO-220; No of Pins: 5; Temperature Range: -40°C to 125°C
High Power CCFL Controller for Wide Dimming Range and Maximum Lamp Lifetime; Package: SSOP; No of Pins: 16; Temperature Range: -40°C to 85°C

File Size 327.55K  /  6 Page

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Amphenol Communications Solutions

Part No. 59112-G36-10-100LF
Description Minitek® 2.00mm, Board To Board, Unshrouded Vertical Stacking Header, Through Hole, Double Row, 20 Positions.
Tech specs    

Official Product Page

    MILL-MAX MFG CORP
Part No. 210-88-318-41-101
Description DIP18, IC SOCKET

File Size 113.98K  /  1 Page

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Amphenol Communications Solutions

Part No. 79610-102
Description 2x10 PCB Header, Low Profile, Right Angle, 3.3mm (0.13inch) Solder tail, Off White
Tech specs    

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Part No. 2101
Description From old datasheet system

File Size 119.95K  /  8 Page

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Amphenol Communications Solutions

Part No. 10084610-101LF
Description Mechanical Guidance Modules, Backplane Connectors, 10.8mm Guide Pin-External Thread.
Tech specs    

Official Product Page

For 61010-101 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | <10> | 11 | 12 | 13 | 14 | 15 |   

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