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  5323 Datasheet PDF File

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    M53231600CE0

Samsung Semiconductor
Part No. M53231600CE0
Description (M53231600CE0/CJ0-C) DRAM Module

File Size 556.57K  /  21 Page

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Amphenol Communications Solutions

Part No. 10136647-053232LF
Description Minitek® Pwr 4.2, Single Row, Vertical Through Hole Header, LCP, 15u\\ Gold (Tin on Tails) plating, Black Color, 5 Positions, GW Compatible, with out Posts, Tray packing.
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    M53230404BT0-C

Samsung Semiconductor
Part No. M53230404BT0-C
Description (M53230404BT0/BY0) DRAM Module

File Size 550.67K  /  21 Page

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Amphenol Communications Solutions

Part No. 68653-236HLF
Description BergStik® 2.54mm, Board To Board Connector, Unshrouded Vertical Header, Through Hole, Single Row, 36 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    M53230224CE2

Samsung Semiconductor
Part No. M53230224CE2
Description (M53230224CE2/CJ2) DRAM Module

File Size 455.93K  /  15 Page

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Amphenol Communications Solutions

Part No. 51915-323LF
Description PwrBlade®, Power Connectors, 12S 17P Right Angle Receptacle, Solder To Board
Tech specs    

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    AD5313ARU AD5313ARU-REEL7 AD5323ARU AD5323ARU-REEL7

Analog Devices
Part No. AD5313ARU AD5313ARU-REEL7 AD5323ARU AD5323ARU-REEL7
Description 2.5 V to 5.5 V 230 µA Dual Rail-to-Rail Voltage Output 8-Bit DAC in a 16-Lead TSSOP Package

File Size 946.11K  /  21 Page

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Amphenol Communications Solutions

Part No. 379-5323-200
Description PLUG,INFINX 6 Pair,14 Position,8.0MM, 100MΩ, w/lossy
Tech specs    

Official Product Page

   
Part No. M53231600CJ0-C50
Description 16M X 32 EDO DRAM MODULE, 50 ns, SMA72

File Size 437.46K  /  21 Page

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Amphenol Communications Solutions

Part No. 88953-231LF
Description Metral® Board Connectors, Backplane Connectors, 4 Row Signal Header, Straight, Solder-to-Board, Wide body.
Tech specs    

Official Product Page

    K4D553238F-JC K4D553238F-JC2A K4D553238F-JC33 K4D553238F-JC36 K4D553238F-JC40 K4D553238F-JC50 K4D553238F-EC2A0 K4D553238

SAMSUNG SEMICONDUCTOR CO. LTD.
Samsung Semiconductor Co., Ltd.
DiCon Fiberoptics, Inc.
SAMSUNG[Samsung semiconductor]
Samsung Electronic
Part No. K4D553238F-JC K4D553238F-JC2A K4D553238F-JC33 K4D553238F-JC36 K4D553238F-JC40 K4D553238F-JC50 K4D553238F-EC2A0 K4D553238F-JC2A0
Description 256Mbit GDDR SDRAM 56Mbit GDDR SDRAM内存
; Accuracy: 1%; Current Rating:5A; Current Ratio:100:5 A; Terminal Type:Leaded RoHS Compliant: Yes 56Mbit GDDR SDRAM内存
8M X 32 DDR DRAM, 0.6 ns, PBGA144 FBGA-144
8M X 32 DDR DRAM, 0.6 ns, PBGA144 LEAD FREE, FBGA-144

File Size 295.12K  /  17 Page

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Amphenol Communications Solutions

Part No. 88953-235LF
Description Metral® Board Connectors, Backplane Connectors, 4 Row Signal Header, Straight, Solder-to-Board, Wide body.
Tech specs    

Official Product Page

   
Part No. NLF453232T-1R0M NLF1812-100K
Description 1 ELEMENT, 1 uH, GENERAL PURPOSE INDUCTOR, SMD
1 ELEMENT, 10 uH, GENERAL PURPOSE INDUCTOR, SMD

File Size 78.68K  /  2 Page

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Amphenol Communications Solutions

Part No. 75915-323LF
Description Dubox®, Board To Board Connector, Receptacle, Vertical, Through Hole, Single Row, Top Entry, 23 Positions, 2.54mm (0.100in) Pitch
Tech specs    

Official Product Page

    YAGEO CORP
Part No. NL252018B-330K-S NL453232B-330K-S
Description 1 ELEMENT, 33 uH, GENERAL PURPOSE INDUCTOR, SMD

File Size 112.60K  /  11 Page

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Amphenol Communications Solutions

Part No. 76745-323-72LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 72 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    Bourns, Inc.
BOURNS INC
Part No. CC453232-680KL CC453232-8R2KL CC453232-1R2KL CC453232-180KL CC453232-390KL CC453232-1R0KL CC453232-470KL CC453232-561KL
Description MAGNETICS - CHIP INDUCTOR 1 ELEMENT, 68 uH, FERRITE-CORE, GENERAL PURPOSE INDUCTOR, SMD
MAGNETICS - CHIP INDUCTOR 1 ELEMENT, 8.2 uH, FERRITE-CORE, GENERAL PURPOSE INDUCTOR, SMD
MAGNETICS - CHIP INDUCTOR 1 ELEMENT, 1.2 uH, FERRITE-CORE, GENERAL PURPOSE INDUCTOR, SMD
MAGNETICS - CHIP INDUCTOR 1 ELEMENT, 18 uH, FERRITE-CORE, GENERAL PURPOSE INDUCTOR, SMD

File Size 340.51K  /  2 Page

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Amphenol Communications Solutions

Part No. 91615-323LF
Description Dubox® 2.54mm, Board to Board Connector, PCB Mounted Receptacle, Vertical, Surface Mount, Dual Entry, Double row , 46 Positions, 2.54mm (0.100in) Pitch
Tech specs    

Official Product Page

    3M Company
HIROSE ELECTRIC Co., Ltd.
Part No. 6532316P2R 6532314P2R
Description SOCKET 3 WAY RCD BOXED 230V 16A 插座3未来路民盟盒2306A
SOCKET 3 WAY RCD BOXED 110V 16A 插座3未来路民盟盒10伏特16A

File Size 49.60K  /  1 Page

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Amphenol Communications Solutions

Part No. 75915-323HLF
Description Dubox® 2.54mm, Board to Board Connector,Vertical Receptacle, Through Hole, Single row , 23 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

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