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Amphenol Communications Solutions |
| Part No. |
91618-416LF
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| Description |
Dubox® 2.54mm, Board to Board Connector, PCB Mounted Receptacle, Vertical, Surface Mount, Double row, Top Entry, 32 Positions, 2.54mm (0.100in) Pitch
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Official Product Page
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Cypress Semiconductor, Corp.
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| Part No. |
CYM1841APM-12C CYM1841P7-20C CYM1841P7-30C CYM1841AP7-30C CYM1841PN-45C CYM1841APN-55C CYM1841PN-25C CYM1841PN-55C CYM1841PN-35C
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| Description |
1M X 8 MULTI DEVICE SRAM MODULE, 12 ns, PSMA64
1M X 8 MULTI DEVICE SRAM MODULE, 20 ns, PSMA72
1M X 8 MULTI DEVICE SRAM MODULE, 30 ns, PSMA72
1M X 8 MULTI DEVICE SRAM MODULE, 45 ns, PSMA64
1M X 8 MULTI DEVICE SRAM MODULE, 55 ns, PSMA64
1M X 8 MULTI DEVICE SRAM MODULE, 25 ns, PSMA64
1M X 8 MULTI DEVICE SRAM MODULE, 35 ns, PSMA64
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| File Size |
251.98K /
11 Page |
 View
it Online |
Download Datasheet
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Amphenol Communications Solutions |
| Part No. |
68418-418HLF
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| Description |
BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 18 Positions, 2.54 mm Pitch, Vertical, 5.84 mm (0.23 in.) Mating, 10.16 mm (0.4 in.) Tail
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
131-8414-21H
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| Description |
Paladin® 112Gb/s Backplane Connector, 8-Pair, 4 Column, Right End Wall, Backplane Module, 2.25mm Wipe, APP.
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
91618-419LF
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| Description |
Dubox® 2.54mm, Board to Board Connector, PCB Mounted Receptacle, Vertical, Surface Mount, Double row, Top Entry, 38 Positions, 2.54mm (0.100in) Pitch
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
68418-417HLF
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| Description |
BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 17 Positions, 2.54 mm Pitch, Vertical, 5.84 mm (0.23 in.) Mating, 10.16 mm (0.4 in.) Tail
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
68418-416HLF
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| Description |
BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 16 Positions, 2.54 mm Pitch, Vertical, 5.84 mm (0.23 in.) Mating, 10.16 mm (0.4 in.) Tail
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
131-8414-11H
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| Description |
Paladin® 112Gb/s Backplane Connector, 8-Pair, 4 Column, Right End Wall, Backplane Module, 1.5mm Wipe, APP.
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Official Product Page
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Sony, Corp.
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| Part No. |
CXK77B1841AGB CXK77B3641AGB
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| Description |
4Mb Late Write LVTTL High Speed Synchronous SRAM (128K x 36Bit)(4M位、写延迟LVTTL高速同步静态RAM (128K x 36) 4Mb的后写入LVTTL高速同步SRAM28K的x 36Bit）（4分位，写延迟LVTTL高速同步静态随机存储器28K的36位）
4Mb Late Write LVTTL High Speed Synchronous SRAMs (128K x 36Bit)(4M位、写延迟、高速逻辑收发（HSTL）、高速同步静态RAM (128K x 36) 4Mb的后写入LVTTL高速（128K的x 36Bit）（4分位，写延迟，高速逻辑收发（HSTL），高速同步静态随机存储器28K的36位）同步静态存储器
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| File Size |
227.24K /
28 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
131-8418-21D
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| Description |
Paladin® 112Gb/s Backplane Connector, 8-Pair, 8 Column, Right End Wall, Backplane Module, 2.25mm Wipe, Nickel Sulfamate.
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
91618-414LF
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| Description |
Dubox® 2.54mm, Board to Board Connector, PCB Mounted Receptacle, Vertical, Surface Mount, Double row, Top Entry, 28 Positions, 2.54mm (0.100in) Pitch
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
68418-419HLF
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| Description |
BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 19 Positions, 2.54 mm Pitch, Vertical, 5.84 mm (0.23 in.) Mating, 10.16 mm (0.4 in.) Tail
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Official Product Page
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Bom2Buy.com
Price and Availability
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