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  082-5373 Datasheet PDF File

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    5082-2830

Agilent(Hewlett-Packard)
Part No. 5082-2830
Description Schottky Barrier Diode Quads for Double Balanced Mixers(应用于双路平衡混频器的肖特基二极
File Size 30.04K  /  2 Page

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Amphenol Communications Solutions
Part No. GSB3115373FHR
Description USB 3.2, Type A, Receptacle, Right Angle Stacked Sink, 9.91mm Height, 18 Pins, Shell with Nickel Plating, Shell Dip Pitch 15.6mm, 30u\\ Gold, Dip 3mm, Blue High Temperature Housing, Tray Packaging
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HUA FENG CIRCUIT





    5082-2800

http://
Advanced Semiconductor
ASI
Part No. 5082-2800
Description SCHOTTKY BARRIER DIODE
File Size 11.18K  /  1 Page

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Amphenol Communications Solutions
Part No. 51915-373LF
Description PwrBlade®, Power Connectors, 3ACP 20S Right Angle Receptacle, Solder To Board
Tech specs 　 　

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    Hewlett-Packard / Agilent
Part No. 5082-2302
Description Schottky Barrier Diodes for General Purpose Applications
File Size 190.03K  /  4 Page

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Amphenol Communications Solutions
Part No. GSB3115373T1F3HR
Description USB 3.2, Type A, Receptacle, Right Angle Stacked Sink, 11.42mm Height, 18 Pins, Shell Without Flange(T/B), Shell Dip 3.2mm, Shell with Nickel Plating, Shell Dip Pitch 15.6mm, 30u\\ Gold, Dip 3.0mm, Blue High Temperature Housing, Tray Packaging
Tech specs 　 　

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    Agilent (Hewlett-Packard)
Part No. 5082-2800
Description Schottky Barrier Diodes for General Purpose Applications
File Size 57.45K  /  7 Page

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Amphenol Communications Solutions
Part No. GSB3115373TF3HR
Description USB 3.2, Type A, Receptacle, Right Angle Stacked Sink, 11.42mm Height, 18 Pins, Shell Without Flange(T/B), Shell Dip 3.2mm, Shell with Nickel Plating, Shell Dip Pitch 15.6mm, 30u\\ Gold, Dip 3.0mm, Blue High Temperature Housing, Tray Packaging
Tech specs 　 　

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    ASI[Advanced Semiconductor]
Part No. 5082-2209
Description SCHOTTKY MEDIUM BARRIER DIODE
File Size 21.30K  /  1 Page

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Amphenol Communications Solutions
Part No. GSB3115373RF1HR
Description USB 3.2, Type A, Receptacle, Right Angle Stacked Sink, 9.91mm Height, 18 Pins, Shell Without Flange(T/B), Shell with Nickel Plating, Shell Dip Pitch 15.6mm, 30u\\ Gold, Dip 3.0mm, Blue High Temperature Housing, Tape and Reel Packaging
Tech specs 　 　

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    XMA CORP
Part No. 3082-7550-12-10 3082-7550-12-20
Description 0 MHz - 12400 MHz RF/MICROWAVE FIXED ATTENUATOR
File Size 43.73K  /  1 Page

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Amphenol Communications Solutions
Part No. RJE1R288225373
Description Modular Jack - 8P8C, RA, Cat5e, Stacked, 2x1 Two Port, Shield With Top and Side EMI Tabs, With LEDs
Tech specs 　 　

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    HS-26082

BOSER Technology Co., Ltd
Part No. HS-26082
Description ULV Intel? Celeron? Processor Embedded Engine Board
ULV Intel垄莽 Celeron垄莽 Processor Embedded Engine Board
File Size 3,447.66K  /  84 Page

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Amphenol Communications Solutions
Part No. GSB3115373RFHR
Description USB3.2, A, GEN1, RightAngle, STACK SINK, DIP, 30u\\ GOLD, BLUE, TL 3MM, H: 9.91mm
Tech specs 　 　

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    TL082

Diodes Incorporated
Part No. TL082
Description GENERAL PURPOSE JFET INPUT OPERATIONAL AMPLIFIERS
File Size 218.59K  /  11 Page

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Texas Instruments
Part No. CSD95373AQ5M
Description 45A Synchronous Buck NexFET&#153; Power Stage with temperature sense 12-LSON-CLIP -55 to 150
Tech specs 　 　

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    XMA CORP
Part No. 2082-7550-12-03
Description 0 MHz - 12400 MHz RF/MICROWAVE FIXED ATTENUATOR
File Size 43.39K  /  1 Page

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Texas Instruments
Part No. CSD95373BQ5M
Description 45A Synchronous Buck NexFET&#153; Smart Power Stage 12-LSON-CLIP -55 to 150
Tech specs 　 　

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    HARWIN INC
Part No. D3082-00
Description INTERCONNECTION DEVICE
File Size 170.69K  /  4 Page

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Texas Instruments
Part No. CSD95373BQ5MT
Description 45A Synchronous Buck NexFET&#153; Smart Power Stage 12-LSON-CLIP -55 to 150
Tech specs 　 　

Official Product Page

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